Abstract: A common mode filter comprises an insulating substrate, a lower coil leading layer, a coil main body multilayer, and an upper coil leading layer. The upper coil leading layer comprises at least one upper lead, at least one upper terminal, and at least one upper contact, and the lower coil leading layer comprises at least one lower lead, at least one lower terminal, and at least one lower contact. The two ends of the upper lead are respectively connected to the upper terminal and the upper contact, and the upper lead surrounds the upper contact. The two ends of the lower lead are respectively connected to the lower terminal and the lower contact, and the lower lead surrounds the lower contact. The upper coil leading layer and the lower coil leading layer sandwich the coil main body multi-layer, and the lower coil leading layer is disposed on the insulating substrate.

Abstract: A thin film type common mode noise filter and its fabrication method are disclosed. There are several electric insulation layers, coil lead layers and main coil layers are formed on an insulation substrate by means of processes of Lithography, Physical Vapor Deposition, etching or other chemical process. After that the structure is covered with an electric insulation gluing layer and a magnetic material layer so as to form a thin film type common mode noise filter with a low production cost but an improved filtering characteristic of the common mode noise.

Abstract: The present invention relates to a compact sized choke coil and fabrication method of same, an enameled metal wire or metal wire enclosed with insulated material is firstly prepared, then the wire is wound into helical coil, and then a magnetic film on the helical coil is formed by sputtering a layer of magnetic substance with a thickness greater than 10?10 m on the surface of the helical coil, finally by electroplating, non-electroplating technologies, sol-gel method, crystal growth, or chemical vapor decomposition etc., suitable amount of magnetic substance is formed on the surface of said helical coil that has already been coated with a layer of magnetic material, and also fills the gap between and in the coil, after that, a block of compact sized choke coil is obtained.

Abstract: The present invention relates to a RC filtering device, consists of: a lower substrate, a first intermediate substrate, a second intermediate substrate and an upper substrate. On top surface of the lower substrate is a cross form electrode layer. At both ends of the electrode layer in one direction forms a pair of air gaps to function as over voltage protection. The first intermediate substrate is formed above the lower substrate also has a pair of grooves corresponding to said air gaps, and on the top surface of the second intermediate layer, there is a transmission wire. The said transmission wire is formed with metallic layer at its both ends and the metallic oxide layer made with electrical resistance, this transmission wire and the electrode layer on the lower substrate form an RC filtering device.

Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.