Abstract: A heat dissipation apparatus includes a heat absorption piece, a attachment bracket, a heat dissipation device, and a heat transfer member. The heat absorption piece is configured to make contact with an electronic element electrically connected to a circuit board, to absorb heat generated by the electronic element. The attachment bracket is attached to the circuit board and defines a first groove configured to receive the heat absorption piece. A first part of the heat transfer member touches the heat absorption piece. A second part of the heat transfer member touches the heat dissipation device. The heat transfer member is configured to transfer the heat of the heat absorption piece to the second part of the heat transfer member to be dissipated by the heat dissipation device.