Abstract: A method includes forming source/drain regions in a semiconductor substrate; depositing a zirconium-containing oxide layer over a channel region in the semiconductor substrate and between the source/drain region; forming a titanium oxide layer in contact with the zirconium-containing oxide layer; forming a top electrode over the zirconium-containing oxide layer, wherein no annealing is performed after depositing the zirconium-containing oxide layer and prior to forming the top electrode.

Abstract: A package structure according to the present disclosure includes a package substrate, a package component disposed over the package substrate, a lid disposed over the package substrate and the package component, and an active cooling device embedded in the lid.

Abstract: A semiconductor package according to the present disclosure includes an interposer and a component mounted on the interposer. The component includes a first die and a second die disposed over the first die having a surface away from the first die. The second die includes a metal pad. A top surface of the metal pad is coplanar with the surface. The metal pad is electrically floating.

Abstract: A multi-layer detachable single-axis fiber optic sensing device is provided. The device includes a first circuit board, a light source module, an optical carrier, a beam guiding module, a modulation module, a fiber coil, a second circuit board, a detection module, a third circuit board, a transceiver module, a fourth circuit board, a power supply module, a fifth circuit board, and a computing module. The first circuit board, the optical carrier, the second circuit board, the third circuit board, the fourth circuit board, and the fifth circuit board may be arranged in any order, and any two adjacent ones can be detachably assembled together.

Abstract: The present invention discloses a boost converter power stage circuit, comprising: an organic light-emitting diode power management integrated circuit unit, a switched capacitor converter, and a boost converter, wherein, a flying capacitor is used to boost the voltage of the inductor to twice the voltage, and then the positive voltage of the output voltage source is boosted, and then use the switched capacitor converter to output the voltage in order to obtain the conversion of the negative voltage.

Abstract: A wafer includes chips, a scribe lane, a metal layer and an inhibitor made of a nonconductive material. The metal layer is provided on the scribe lane and the chip located next to the scribe lane. The inhibitor covers the scribe lane and the chip next to the scribe line and includes a first removed part and an inhibition part which are located above a second removed part and a residual part of the metal layer, respectively. The scribe lane, the first and second removed parts are removed, and the inhibition part and the residual part are retained on each of the chips after a wafer cutting process. The inhibitor is provided to prevent the residual part of the metal layer from being lifted up or generating a metal burr during the wafer cutting process.

Abstract: A spherical multi-axis optical fiber sensing device is formed by a three-axis optical interference sensor composed of a multi-level opto-mechanical integrated unit kit. The opto-mechanical integrated unit kit is composed of three fiber rings, which are respectively a large fiber ring, a medium fiber ring and a small fiber ring. The multi-level opto-mechanical integrated unit kit is combined with the use of the mechanism component technology that can be freely rotated and positioned to achieve the functional purpose of establishing a three-axis orthogonal optical fiber sensing unit in a single sphere volume.

Abstract: In an embodiment, a method includes: forming active devices over a semiconductor substrate; forming an interconnect structure over the active devices, the interconnect structure comprising a first portion of a seal ring over the semiconductor substrate, the seal ring being electrically insulated from the active devices; forming a first passivation layer over the interconnect structure; forming a first metal pad and a second metal pad extending through the first passivation layer and over the interconnect structure, the first metal pad having a bowl shape, the second metal pad having a step shape; and depositing a second passivation layer over the first metal pad and the second metal pad.

Abstract: Semiconductor device and methods of manufacture are provided. In an embodiment, the a semiconductor device may include a first semiconductor die; an oxide layer on the first semiconductor die, wherein the first semiconductor die has a first top surface opposite the oxide layer; a first insulating material encapsulating the first semiconductor die and the oxide layer, wherein the first insulating material has a second top surface planar with the first top surface; and a first polymer buffer disposed between a sidewall of the first semiconductor die and a sidewall of the oxide layer, wherein the first polymer buffer has a third top surface planar with both the first top surface and the second top surface.

Abstract: A method of providing a cryptographic algorithm firewall for an industrial control network is provided. The method includes receiving or determining a cryptographic algorithm configuration for determining which cryptographic algorithms are allowed, accessing packets flowing along a data path of the industrial control network, analyzing at least one packet of the accessed data packets to determine a cryptographic algorithm used for a network communication between two parties that is secured by application of the cryptographic algorithm, determining whether the cryptographic algorithm used for the network communication is allowed based on the received cryptographic algorithm configuration, and causing one or more actions related to the at least one packet's flow and/or the network communication in response to determining the cryptographic algorithm used for the network communication is not allowed.

Abstract: Systems, methods, and apparatus including computer-readable mediums for managing error corrections for memory systems are provided. In one aspect, a memory system includes a memory and a memory controller coupled to the memory. The memory controller is configured to: read data from a data page of the memory, perform a first phase Error-Correcting Code (ECC) test on the read data based on first ECC data associated with the data, and in response to determining that the read data fails to pass the first phase ECC test, perform a second phase ECC test on a portion of the read data based on second ECC data. The first ECC data is stored together with the data in the data page. The second ECC data is associated with a portion of the data corresponding to the portion of the read data, and stored in a redundancy page different from the data page.

Abstract: A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.

Abstract: The communication system includes a display card, a display processing module, a display-card connector, a power supply, a power processing module, a signal transmission element, a display-end connector, and a configuration unit. The display-card connector includes a display-card first terminal set involving 6 terminals, a display-card second terminal set involving another 6 terminals, and a display-card signal terminal set including two function terminals and two detection terminals. Each function terminal allows at least one user-defined function regarding a signal to be monitored from the power supply. The display processing module, therefore, may monitor and control the power supply through the function terminals.

Abstract: The present invention includes a power supply unit composed of a casing and a current conversion unit, a slotted wall, a fan device composed of a fan and a fan support, a chamber, and a slant rim. The fan device is detachably joined to the casing for convenient maintenance and replacement. The fan is housed in the fully open chamber for reduced impedance and noise. The slant rim tapers toward the chamber and facilitates airflow for enhanced heat dissipation performance.

Abstract: A feedback module is formed with modules comprising a schedule hardware register module and a computation circuit module. The schedule hardware register module receives a modulation signal and a sensing signal, and schedules and temporarily stores signal values of the sensing signal in successive half modulation cycles in sequence by taking a half modulation cycle as a time interval to obtain a temporarily stored sensing signal which has been scheduled. In each half modulation cycle, the computation circuit module calculates a differential signal value of the temporarily stored sensing signal between the previous two half modulation cycles, and outputs the differential signal value as a signal value of the feedback signal. The schedule hardware register module temporarily stores the feedback signal, and the feedback module feedbacks the feedback signal to an integrated optics chip of the photoelectric sensing system integrated optics chip.

Abstract: A method of automating cypher configuration for a plurality of industrial devices within an industrial system is provided. The method includes receiving system parameters for the industrial system and receiving from a data source device parameters for respective individual industrial devices of the plurality of industrial devices. The method further includes selecting, generating and/or updating an optimal cypher configuration for the respective individual industrial devices based on or using the system parameters for the industrial system and the device parameters for the respective individual devices. The method further includes providing the optimal cypher configuration to the respective individual industrial devices for configuration of the respective individual industrial devices' cypher configuration.

Abstract: A projection device and a safety protection method of the projection device are provided. The projection device calculates a warning range according to lens information. Whether an object enters the warning range is detected. The projection device is controlled to reduce brightness of a light source or turn off the light source in response to the object entering the warning range. The projection device and the safety protection method thereof proposed by the disclosure can effectively ensure the usage safety of the projection device.

Abstract: Weather-resistant light emitting diode (LED) assemblies, which prevent water and moisture from entering the LED assemblies, which may be integrated to form a display, so that images may be displayed on the display are provided. A waterproof light emitting diode (LED) assembly including an LED tile including one or more LED boards; and a power box, wherein each LED board includes an array of LEDs, and the LED tile and the power box are connected through a plurality of waterproof connector assemblies is provided. Each waterproof connector assembly comprises a waterproof connector plug and waterproof connector socket having an O-ring, wherein the waterproof connector having the O-ring cooperatively interfacing with the waterproof connector plug seals the waterproof connector assembly. A waterproof LED panel including a plurality of waterproof LED assemblies mounted on a LED panel frame is also provided.

Abstract: A sports event video processing method is provided. The processing method includes: receiving a sports event input video; performing SOI detection on the sports event input video to obtain at least one SOI; performing logo detection and extraction on the at least one SOI to detect at least one logo; performing pixel-level rearrangement on the at least one detected logo; and outputting a sports event output video having completed pixel-level rearrangement.

Abstract: The present invention relates to a nitrogen-containing diesel solidification point depressant composition, and preparation and application thereof. The nitrogen-containing diesel solidification point depressant composition includes the following components in percentage by weight: 10-40% of monoisopropanolamine; 10-40% of cyclohexane; 0-20% of polyethylene glycol; and 40-60% of N-tetradecyl methacrylamide-tetradecyl methacrylate. After the prepared diesel solidification point depressant composition is added to commercially available 0 #diesel, a solidification point and a cold filter plugging point of the diesel are respectively depressed by 21-25° C. and 9-13° C.