Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Abstract: A radar wave sensing apparatus including a rotation element, a nanosecond pulse near-field sensor and a control unit is provided. The nanosecond pulse near-field sensor emits an incident radar wave and receives a reflection radar wave of the incident radar wave hitting on a surface of the rotation element to obtain a repetition frequency variation of the reflection radar wave corresponding to the incident radar wave. The control unit calculates a vibration of the rotation element according to the repetition frequency variation.

Abstract: A radar wave sensing apparatus including a rotation element, a nanosecond pulse near-field sensor and a control unit is provided. The nanosecond pulse near-field sensor emits an incident radar wave and receives a reflection radar wave of the incident radar wave hitting on a surface of the rotation element to obtain a repetition frequency variation of the reflection radar wave corresponding to the incident radar wave. The control unit calculates a vibration of the rotation element according to the repetition frequency variation.

Abstract: A planar moving apparatus includes a moving stage, a first driving apparatus, a second driving apparatus and a base member. The base member carries the stage, the first driving apparatus and the second driving apparatus. The first driving apparatus drives the moving stage along a first axial direction and the second driving apparatus drives the moving stage along a second axial direction. The first driving apparatus and the second driving apparatus operate independently and do not interfere with each other when the moving stage moves along either the first axial direction or the second axial direction.