Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

Abstract: A case is provided, including a shell, a fan frame, and a fan module. The shell is internally provided with a backplane and a motherboard, where the motherboard is connected to the backplane along a first axis, the backplane is connected with a plug connector, the plug connector includes a plug connector body and a plurality of connection terminals, and the connection terminals are located in the plug connector body. The fan frame bears the fan module, and the fan module includes a fan assembly and a matching connector. The matching connector is connected to the fan assembly, and the matching connector is connected to the plug connector along a second axis. The matching connector includes a matching connector body and a plurality of matching terminals, and the matching terminals are located in the matching connector body. The fan frame is fixed in the shell.

Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: The present invention provides a class AB amplifier, wherein the class AB amplifier includes a cascode stage with a filter and an output stage. The cascode stage with the filter is arranged for receiving an input signal to generate a first driving signal and a second driving signal, wherein the filter filters the input signal to generate an filtered input signal, and at least one of the first driving signal and the second driving signal is generated according to the filtered input signal. The output stage is coupled to the cascode stage, and is arranged for generating an output signal according to the first driving signal and the second driving signal.

Abstract: The present invention provides a class AB amplifier, wherein the class AB amplifier includes a cascode stage with a filter and an output stage. The cascode stage with the filter is arranged for receiving an input signal to generate a first driving signal and a second driving signal, wherein the filter filters the input signal to generate an filtered input signal, and at least one of the first driving signal and the second driving signal is generated according to the filtered input signal. The output stage is coupled to the cascode stage, and is arranged for generating an output signal according to the first driving signal and the second driving signal.

Abstract: A radio frequency (RF) receiver includes a digital tuning engine; and I-path and Q-path analog filters, tuned by the digital tuning engine. The digital tuning engine gets an I/Q imbalance difference, and the digital tuning engines tunes the I-path analog filter and/or the Q-path analog filter based on the I/O imbalance difference.

Abstract: A radio frequency (RF) receiver includes a digital tuning engine; and I-path and Q-path analog filters, tuned by the digital tuning engine. The digital tuning engine gets an I/Q imbalance difference, and the digital tuning engines tunes the I-path analog filter and/or the Q-path analog filter based on the I/Q imbalance difference.

Abstract: A radio frequency (RF) receiver includes a digital tuning engine; I-path and Q-path analog filters, tuned by the digital tuning engine; and a digital compensation circuit. The digital tuning engine executes a RC (resistor-capacitor) time constant calibration to adjust respective cut-off frequencies of the I-path analog filter and the Q-path analog filter. The digital tuning engine executes a filter mismatch calibration to match the I-path analog filter and the Q-path analog filter. The digital tuning engine executes a filter residual mismatch calibration to match an I-path response from the I-path analog filter to the digital compensation circuit and a Q-path response from the Q-path analog filter to the digital compensation circuit.

Abstract: A digital to analog converting system, which comprises: a first data converting circuit, for receiving a first digital data stream transmitted at a first clock frequency, for converting the first digital data stream to a plurality of second digital data streams transmitted at a second clock frequency, and for outputting the second digital data streams in parallel; a second data converting circuit, for receiving the second digital data streams from the first data converting circuit, and for converting the second digital data streams to a third digital data stream transmitted at a third clock frequency; and a first digital to analog converter, for converting the third digital data stream to a first output analog data stream. The second clock frequency is lower than the first clock frequency and the third clock frequency.

Abstract: A digital to analog converting system, which comprises: a first data converting circuit, for receiving a first digital data stream transmitted at a first clock frequency, for converting the first digital data stream to a plurality of second digital data streams transmitted at a second clock frequency, and for outputting the second digital data streams in parallel; a second data converting circuit, for receiving the second digital data streams from the first data converting circuit, and for converting the second digital data streams to a third digital data stream transmitted at a third clock frequency; and a first digital to analog converter, for converting the third digital data stream to a first output analog data stream. The second clock frequency is lower than the first clock frequency and the third clock frequency.

Abstract: A radio frequency (RF) receiver includes a digital tuning engine; I-path and Q-path analog filters, tuned by the digital tuning engine; and a digital compensation circuit. The digital tuning engine executes a RC (resistor-capacitor) time constant calibration to adjust respective cut-off frequencies of the I-path analog filter and the Q-path analog filter. The digital tuning engine executes a filter mismatch calibration to match the I-path analog filter and the Q-path analog filter. The digital tuning engine executes a filter residual mismatch calibration to match an I-path response from the I-path analog filter to the digital compensation circuit and a Q-path response from the Q-path analog filter to the digital compensation circuit.