Patents by Inventor SHENG-HAO LEE

SHENG-HAO LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging method for tire pressure monitoring sensor
    Patent number: 11964520
    Abstract: A packaging method for a tire pressure monitoring sensor includes a step of placing, a step of pouring, and a step of hardening. In the step of placing, a sensing transmission module is put into a cavity of a modeling unit, and a positioning portion in the cavity restricts the sensing transmission module from moving transversely and toward an inner bottom of the cavity. In the step of pouring, a rubber compound is poured into the cavity and fills the cavity. The sensing transmission module is coated by the rubber compound to form a case on the outer surface of the sensing transmission module. In the step of hardening, the case is hardened and integrally formed with the sensing transmission module to form a tire pressure monitoring sensor which is removed from the cavity.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: April 23, 2024
    Assignee: SYSGRATION LTD.
    Inventors: Sheng-Hao Lee, Shih-Yao Lin
  • PACKAGING METHOD FOR TIRE PRESSURE MONITORING SENSOR
    Publication number: 20220242177
    Abstract: A packaging method for a tire pressure monitoring sensor includes a step of placing, a step of pouring, and a step of hardening. In the step of placing, a sensing transmission module is put into a cavity of a modeling unit, and a positioning portion in the cavity restricts the sensing transmission module from moving transversely and toward an inner bottom of the cavity. In the step of pouring, a rubber compound is poured into the cavity and fills the cavity. The sensing transmission module is coated by the rubber compound to form a case on the outer surface of the sensing transmission module. In the step of hardening, the case is hardened and integrally formed with the sensing transmission module to form a tire pressure monitoring sensor which is removed from the cavity.
    Type: Application
    Filed: January 18, 2022
    Publication date: August 4, 2022
    Inventors: SHENG-HAO LEE, SHIH-YAO LIN