Patents by Inventor Sheng He

Sheng He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250134306
    Abstract: Disclosed is an air fryer with good thermal insulation, including a body, a cooking cavity located within the body, and a hot air circulation system connected to the cooking cavity, wherein at least part of the outside of the cooking cavity is equipped with a heat insulation component that matches the outer wall of the cooking cavity, the heat insulation component and the outer wall of the cooking cavity are suitable for forming a heat insulation chamber, the heat insulation chamber contains a heat insulation medium. By providing a heat insulation component that matches the outer wall of the cooking cavity on the outside of the cooking cavity to form a heat insulation chamber, and placing a heat insulation medium inside the heat insulation chamber, the air fryer can reduce the impact of high temperatures inside the cooking cavity on the electrical components outside.
    Type: Application
    Filed: October 25, 2024
    Publication date: May 1, 2025
    Applicant: NINGBO CARELINE ELECTRIC APPLIANCE CO., LTD.
    Inventors: Yichi ZHANG, Huayuan PAN, Sheng HE, Zhian HUO
  • Publication number: 20250133859
    Abstract: A battery back passivation structure, a manufacturing method therefor, and a solar cell, the manufacturing method comprising: introducing a dopant gas and a first reaction gas into a coating device, and depositing a doped passivation layer on the back side of a silicon wafer (1); and introducing a second reaction gas into the coating device, and directly or indirectly depositing an internal reflection layer on the surface of the doped passivation layer away from the silicon wafer (1). The described battery back passivation structure comprises a doped passivation layer and an internal reflection layer that are stacked on the back side of the silicon wafer (1), and has enhanced passivation capability.
    Type: Application
    Filed: September 6, 2022
    Publication date: April 24, 2025
    Applicant: CHINT NEW ENERGY TECHNOLOGY CO., LTD.
    Inventors: Hongbo LI, Sheng HE, Wei-chih HSU, Wei SHAN
  • Publication number: 20250120542
    Abstract: Disclosed is high energy efficient air fryer, the frying basket includes a body, wherein the body is provided with a first cooking chamber and a second cooking chamber, the first cooking chamber is equipped with a first circulation fan, and the first cooking chamber has a first air outlet corresponding to the first circulation fan, the first air outlet is connected to the second cooking chamber through a first pipeline; the second cooking chamber is equipped with a second circulation fan, and the second cooking chamber has a second air outlet corresponding to the second circulation fan, the second air outlet is connected to the first cooking chamber through a second pipeline.
    Type: Application
    Filed: October 14, 2024
    Publication date: April 17, 2025
    Applicant: NINGBO CARELINE ELECTRIC APPLIANCE CO., LTD.
    Inventors: Yichi Zhang, Huayuan PAN, Sheng HE, Mingjia ZHU
  • Patent number: 12230723
    Abstract: Some embodiments of the present invention relate to a technical field of N-type TOPCon solar cells, and disclose a back-side metal electrode of an N-type TOPCon solar cell. The back-side metal electrode includes a substrate, a plurality of first silver fine grids disposed on a passivation film which is on a back side of the substrate, a plurality of second aluminum fine grids overlaid on the plurality of first silver fine grids, and a plurality of first silver main grids disposed perpendicular to the plurality of first silver fine grids. Each of the plurality of first silver main grids is a segmented structure. The back-side metal electrode further includes a plurality of second aluminum main grids, which are formed, in a printing manner, between any two adjacent grid segments of a plurality of grid segments and around each of the plurality of grid segments.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: February 18, 2025
    Assignee: CHINT NEW ENERGY TECHNOLOGY CO., LTD.
    Inventors: Mingzhang Feng, Jinfang Yang, Sheng He, Wei-Chih Hsu
  • Publication number: 20240379463
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Application
    Filed: July 18, 2024
    Publication date: November 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng He HUANG, Chung-Pin CHOU, Shiue-Ming GUO, Hsuan-Chia KAO, Yan-Cheng CHEN, Sheng-Ching KAO, Jun Xiu LIU
  • Patent number: 12119273
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: October 15, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sheng He Huang, Chung-Pin Chou, Shiue-Ming Guo, Hsuan-Chia Kao, Yan-Cheng Chen, Sheng-Ching Kao, Jun Xiu Liu
  • Publication number: 20240306847
    Abstract: A fryer plate that is accommodated inside a fryer basket, including: a holding portion holding food and including a first air hole; and a support portion coupled to the holding portion. The support portion is coupled to the fryer basket, the holding portion is spaced apart from an inner bottom wall surface of the fryer basket, and a first air passage is formed between the support portion and the inner bottom wall surface of the fryer basket and is in connection with the first air hole.
    Type: Application
    Filed: March 13, 2024
    Publication date: September 19, 2024
    Inventors: Yuexuan DAI, Ming ZHANG, Yiyi MAO, Yichi ZHANG, Rongjie BAI, Sheng HE, Youbing CAO
  • Publication number: 20240310352
    Abstract: The present disclosure relates to a method for analyzing a geological body with the help of physical and chemical properties thereof, and in particular, to a method for identifying an exudative sandstone uranium deposit. With the method for identifying an exudative sandstone uranium deposit according to the embodiments of the present disclosure, an exudative sandstone uranium deposit formed by an exudation metallogenesis may be systematically identified, so as to guide prediction and prospecting evaluation of a uranium deposit in red variegated sandstone formations of a sedimentary basin, avoid ore dislocation and ore leakage, open up new prospecting positions and spaces, and break through new uranium resources.
    Type: Application
    Filed: July 21, 2023
    Publication date: September 19, 2024
    Inventors: Ziying Li, Wusheng Liu, Mingkuan Qin, Yuqi Cai, Qingyin Guo, Feng He, Jun Zhong, Xide Li, Ye Sun, Yunlong Zhang, Weitao Li, Guo Wang, Shengfu Li, Jianfang Cai, Gui Wang, Shan Jiang, Jielin Zhang, Sheng He, Qubo Wu, Zilong Zhang, Chiheng Liu, Linfei Qiu, Hu Liu, Hongwei Ji, Qiang Guo, Pengfei Zhu, Xinyang Liu, Yuyan Zhang, Zhixin Huang, Jian Guo, Meizhi Han, Zhongbo He, Jinrong Lin, Licheng Jia, Junxian Wang, Longsheng Yi, Mingming Tian, Xiaoneng Luo, Bo Peng, Xiaoqian Xiu, Ruixiang Hao, Wenquan Wang, Changfa Yu
  • Patent number: 11988430
    Abstract: An air conditioning unit includes: a first refrigeration system including a first evaporator, a first compressor, a first condenser, a first one-way valve, and a first throttling element connected in sequence in a loop as well as a second one-way valve connected in parallel with the first compressor, and a first fluorine pump connected in parallel with the first one-way valve; and a second refrigeration system including a second evaporator, a second compressor, a second condenser, a third one-way valve, and a second throttling element connected in sequence in a loop as well as a fourth one-way valve connected in parallel with the second compressor, and a second fluorine pump connected in parallel with the third one-way valve, where the first evaporator and the second evaporator are arranged front and rear in sequence along a return air cooling duct.
    Type: Grant
    Filed: November 24, 2022
    Date of Patent: May 21, 2024
    Assignee: Vertiv Tech Co., Ltd.
    Inventors: Jie Guo, Sheng He, Chang Liu, Xiuling Li
  • Publication number: 20240097057
    Abstract: Some embodiments of the present disclosure provide an N-type TOPCon cell with double-sided aluminum paste electrodes, and a preparation method therefor. The front side of the cell is provided with a front-side silver main grid and a front-side aluminum fine grid, and the back side is provided with a back-side silver main grid and a back-side aluminum fine grid. The method for preparing the cell includes: texturing?B diffusion?BSG removal?alkali polishing?depositing a tunnel oxide layer and a polysilicon layer on a back side of a substrate by means of LPCVD?P diffusion on the back side?PSG removal?plating removal?deposition of an AlOx preparatory layer and a first SiNxHy preparatory layer on the front side?deposition of a second preparatory layer SiNxHy on the back side?UV laser ablation on the front side of the substrate and the back side of the substrate?screen printing.
    Type: Application
    Filed: May 25, 2021
    Publication date: March 21, 2024
    Inventors: Mingzhang FENG, Sheng HE, Wei-Chih HSU
  • Publication number: 20240014329
    Abstract: Some embodiments of the present disclosure provide a back structure of a solar cell. The back structure includes an aluminum oxide film layer disposed on a silicon wafer substrate, and a first silicon nitride film layer and a first silicon oxynitride film layer, which are successively disposed on the aluminum oxide film layer from inside to outside; and the back structure further includes a second silicon nitride film layer disposed on the first silicon oxynitride film layer. The refractive index of the first silicon nitride film layer is greater than that of the second silicon nitride film layer, and the refractive index of the second silicon nitride film layer is greater than that of the first silicon oxynitride film layer.
    Type: Application
    Filed: February 2, 2021
    Publication date: January 11, 2024
    Inventors: Hongbo LI, Sheng HE, Wei SHAN, Wei-Chih HSU, Xinlin ZENG, Yingcai ZHAO
  • Publication number: 20230420583
    Abstract: Some embodiments of the present invention relate to a technical field of N-type TOPCon solar cells, and disclosed a back-side metal electrode of an N-type TOPCon solar cell. The back-side metal electrode includes a substrate, a plurality of first silver fine grids disposed on a passivation film which is on a back side of the substrate, a plurality of second aluminum fine grids overlaid on the plurality of first silver fine grids, and a plurality of first silver main grids disposed perpendicular to the plurality of first silver fine grids. Each of the plurality of first silver main grids is a segmented structure. The back-side metal electrode further includes a plurality of second aluminum main grids, which are formed, in a printing manner, between any two adjacent grid segments of a plurality of grid segments and around each of the plurality of grid segments.
    Type: Application
    Filed: May 10, 2021
    Publication date: December 28, 2023
    Inventors: Mingzhang FENG, Jinfang YANG, Sheng HE, Wei-Chih HSU
  • Publication number: 20230360975
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Application
    Filed: July 18, 2023
    Publication date: November 9, 2023
    Inventors: Sheng He HUANG, Chung-Pin CHOU, Shiue-Ming GUO, Hsuan-Chia KAO, Yan-Cheng CHEN, Sheng-Ching KAO, Jun Xiu LIU
  • Patent number: 11749571
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: September 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sheng He Huang, Chung-Pin Chou, Shiue-Ming Guo, Hsuan-Chia Kao, Yan-Cheng Chen, Sheng-Ching Kao, Jun Xiu Liu
  • Publication number: 20230168016
    Abstract: An air conditioning unit includes: a first refrigeration system including a first evaporator, a first compressor, a first condenser, a first one-way valve, and a first throttling element connected in sequence in a loop as well as a second one-way valve connected in parallel with the first compressor, and a first fluorine pump connected in parallel with the first one-way valve; and a second refrigeration system including a second evaporator, a second compressor, a second condenser, a third one-way valve, and a second throttling element connected in sequence in a loop as well as a fourth one-way valve connected in parallel with the second compressor, and a second fluorine pump connected in parallel with the third one-way valve, where the first evaporator and the second evaporator are arranged front and rear in sequence along a return air cooling duct.
    Type: Application
    Filed: November 24, 2022
    Publication date: June 1, 2023
    Applicant: Vertiv Tech Co., Ltd.
    Inventors: Jie GUO, Sheng HE, Chang LIU, Xiuling LI
  • Patent number: 11627528
    Abstract: The present disclosure discloses a method of multi-access edge computing task offloading based on D2D in IoV environment, which models a task offloading strategy, a transmission power and a channel resource allocation mode as a mixed integer nonlinear programming problem, wherein an optimization problem is to maximize the sum of time delay and energy consumption benefits of all CUE in cellular communication with a base station in the IoV system. This method has low time complexity, may effectively utilize channel resources of the IoV system, and ensures the delay reliability of the DUE for which the local V2V data exchange is performed in the form of D2D communication. In the meantime, the time delay and energy consumption of CUE are both close to the minimum, thus meeting the IoV requirements of low time delay and high reliability.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: April 11, 2023
    Assignee: South China University of Technology
    Inventors: Bin-jie Hu, Sheng-he Lu
  • Publication number: 20230068133
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 2, 2023
    Inventors: Sheng He HUANG, Chung-Pin CHOU, Shiue-Ming GUO, Hsuan-Chia KAO, Yan-Cheng CHEN, Sheng-Ching KAO, Jun Xiu LIU
  • Publication number: 20230001428
    Abstract: A multifunctional air pollution reduction device includes a tool and a multifunctional pollutant remover. The multifunctional pollutant remover is adjacent to or integrated with the tool. The multifunctional pollutant remover can not only reduce air pollution, but also help reduce one or more of the following problems when using the tools: noise, vibration and/or slip.
    Type: Application
    Filed: July 5, 2022
    Publication date: January 5, 2023
    Inventors: Ming-Yeng LIN, Yung-Chung CHEN, Huann-Shyang LIN, Chun-Juei CHOU, Sheng-He WANG
  • Patent number: 11422323
    Abstract: An optical communication module made with transparent packaging material which locates elements and provides protection against contaminants and EMI includes a printed circuit board; a photoelectric element disposed on the printed circuit board; an optical-fiber connector disposed on the printed circuit board, corresponding to the photoelectric element; the transparent packaging material covers the printed circuit board, the photoelectric component and the optical-fiber connector. An electromagnetic shielding layer covers the transparent packaging material. A method of manufacturing same is also disclosed.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: August 23, 2022
    Assignee: SHUNYUN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Guang-Sheng He
  • Publication number: 20210266834
    Abstract: The present disclosure discloses a method of multi-access edge computing task offloading based on D2D in IoV environment, which models a task offloading strategy, a transmission power and a channel resource allocation mode as a mixed integer nonlinear programming problem, wherein an optimization problem is to maximize the sum of time delay and energy consumption benefits of all CUE in cellular communication with a base station in the IoV system. This method has low time complexity, may effectively utilize channel resources of the IoV system, and ensures the delay reliability of the DUE for which the local V2V data exchange is performed in the form of D2D communication. In the meantime, the time delay and energy consumption of CUE are both close to the minimum, thus meeting the IoV requirements of low time delay and high reliability.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 26, 2021
    Applicant: South China University of Technology
    Inventors: Bin-jie HU, Sheng-he LU