Patents by Inventor Sheng-Hong Chen

Sheng-Hong Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240320247
    Abstract: The present invention provides a method for providing analytics and intelligent question-answering via an interactive dashboard, which includes the following steps: receiving user input data via the interactive dashboard; identifying user intent from the user input data; converting the user intent into an application programming interface (API) of a local system for the local system to proceed; translating a response of the API into a natural language response; generating a revised interactive dashboard based on the user intent dynamically according to the response of the API; and presenting the natural language response via the revised interactive dashboard.
    Type: Application
    Filed: March 24, 2023
    Publication date: September 26, 2024
    Inventors: Wen-Shyen Chen, Ming-Jye Sheu, Henry Hong-Yi Tzeng, Sheng-Lin Wu, Chee-Siong Lee, Yung-Tsun Liu
  • Publication number: 20240307007
    Abstract: An alarm system an alarm method for a medical emergency are provided. The alarm method includes: obtaining a physiological signal of a user by a sensor of a portable electronic device; receiving the physiological signal from the portable electronic device, determining whether an abnormal event has occurred according to the physiological signal, and transmitting first feedback information corresponding to the physiological signal to a server in response to the abnormal event by the terminal device; and outputting an alarm message according to the first feedback information by the server.
    Type: Application
    Filed: November 21, 2023
    Publication date: September 19, 2024
    Applicants: Acer Incorporated, Far Eastern Memorial Hospital
    Inventors: Sheng-Wei Chu, Tsung-Hsien Tsai, Ke-Han Pan, Yueh-Yarng Tsai, Pei-Jung Chen, Jun-Hong Chen, Yen-Wen Wu, Jen-Tang Sun
  • Publication number: 20240301150
    Abstract: The aerogel particles are mixed with organic solvent and dispersed to form an aerogel suspended solution containing the organic solvent, which can be uniformly aerogel/polymer solution with mixed various types of polymers or plastics solution by mixer, and then coated to form an aerogel/polymer composite film, and the steps of which comprises: organic solvent suspension dispersion, polymer solution mixing, coating film formation, drying and winding. The prepared organic solvent aerogel suspended solution can be evenly mixed with the matching polymer solution to form a uniform aerogel/polymer solution, and then the uniform aerogel/polymer solution is made into various thicknesses of aerogel/polymer composite film by the use of coating, laminating, extruding and other processes.
    Type: Application
    Filed: March 6, 2023
    Publication date: September 12, 2024
    Inventors: JEAN-HONG CHEN, SHIU-SHIU CHEN, SHENG-HONG PONG, YANG-DUAN LI
  • Publication number: 20230051621
    Abstract: A semiconductor structure and a method for manufacturing a semiconductor are provided. The semiconductor structure includes a channel pillar, a dielectric layer formed on the channel pillar, a via formed in the dielectric layer and electrically connected to the channel pillar, and a spacer formed between the dielectric layer and the via.
    Type: Application
    Filed: August 12, 2021
    Publication date: February 16, 2023
    Inventors: Ting-Feng LIAO, Sheng-Hong CHEN, Kuang-Wen LIU
  • Patent number: 11374099
    Abstract: A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a source line structure. The source line structure includes a composite material formed in a trench. The composite material includes an oxide portion and a metal portion.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: June 28, 2022
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Ting-Feng Liao, Sheng-Hong Chen, Kuang-Wen Liu
  • Publication number: 20220020856
    Abstract: A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a source line structure. The source line structure includes a composite material formed in a trench. The composite material includes an oxide portion and a metal portion.
    Type: Application
    Filed: July 16, 2020
    Publication date: January 20, 2022
    Inventors: Ting-Feng LIAO, Sheng-Hong CHEN, Kuang-Wen LIU
  • Publication number: 20190280103
    Abstract: A semiconductor structure includes a substrate including a dummy area and an array area adjacent to the dummy area, sub-dummy structures, sub-array structures, a three-dimensional array of memory cells, first conductive structures and second conductive structures. The sub-dummy structures are disposed on the dummy area, and separated from each other by first trenches extending along a first direction. The sub-array structures are disposed on the array area, and separated from each other by second trenches extending along a second direction. The memory cells include cell groups disposed in the sub-array structures, respectively. The first conductive structures and the second conductive structures are disposed in the first trenches and the second trenches respectively. Each of the first conductive structures extends along the first direction, each of the second conductive structure extends along the second direction, and the first direction is different from the second direction.
    Type: Application
    Filed: March 9, 2018
    Publication date: September 12, 2019
    Inventors: Sheng-Hong CHEN, Ting-Feng LIAO
  • Publication number: 20180261621
    Abstract: A semiconductor structure includes a substrate and a plurality of sub-array structures disposed on the substrate. The sub-array structures separated from each other by a plurality of trenches. The semiconductor structure includes a three-dimensional array of memory cells. The memory cells include a plurality of cell groups disposed in the sub-array structures, respectively. The semiconductor structure further includes a plurality of support pillars and a plurality of conductive pillars disposed in the trenches. The support pillars and the conductive pillars in each of the trenches are alternately arranged in an extending direction of the trenches. The semiconductor structure further includes a plurality of conductive lines disposed in the trenches and on the support pillars and the conductive pillars. Each of the conductive lines connects the conductive pillars thereunder.
    Type: Application
    Filed: March 10, 2017
    Publication date: September 13, 2018
    Inventors: Sheng-Hong Chen, Ting-Feng Liao