Patents by Inventor Sheng Hsiang Chang

Sheng Hsiang Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935894
    Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
  • Publication number: 20240086612
    Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Po-Hsiang HUANG, Fong-Yuan CHANG, Clement Hsingjen WANN, Chih-Hsin KO, Sheng-Hsiung CHEN, Li-Chun TIEN, Chia-Ming HSU
  • Publication number: 20220408054
    Abstract: The present invention provides a control method of a processor, wherein the control method comprises the steps of: transmitting image data of a first frame to an integrated circuit, wherein the first frame corresponds to a first frame rate; determining a second frame rate of a second frame next to the first frame; determining if a difference between the second frame rate and the first frame rate belongs to a large scale frame rate adjustment or a small scale frame rate adjustment; if the difference between the second frame rate and the first frame rate belongs to the large scale frame rate adjustment, using a first mode to transmit image data of the second frame; and if the difference between the second frame rate and the first frame rate belongs to the small scale frame rate adjustment, using a second mode to transmit image data of the second frame.
    Type: Application
    Filed: August 21, 2022
    Publication date: December 22, 2022
    Applicant: MEDIATEK INC.
    Inventors: Kang-Yi Fan, Chin-Wen Liang, Chang-Chu Liu, Sheng-Hsiang Chang, You-Min Yeh
  • Patent number: 11457173
    Abstract: The present invention provides a control method of a processor, wherein the control method comprises the steps of: transmitting image data of a first frame to an integrated circuit, wherein the first frame corresponds to a first frame rate; determining a second frame rate of a second frame next to the first frame; determining if a difference between the second frame rate and the first frame rate belongs to a large scale frame rate adjustment or a small scale frame rate adjustment; if the difference between the second frame rate and the first frame rate belongs to the large scale frame rate adjustment, using a first mode to transmit image data of the second frame; and if the difference between the second frame rate and the first frame rate belongs to the small scale frame rate adjustment, using a second mode to transmit image data of the second frame.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: September 27, 2022
    Assignee: MEDIATEK INC.
    Inventors: Kang-Yi Fan, Chin-Wen Liang, Chang-Chu Liu, Sheng-Hsiang Chang, You-Min Yeh
  • Publication number: 20210280148
    Abstract: The present invention provides a processor including a source generator, a request synchronization signal generator and an output circuit. The source generator is configured to generate image data of a frame. The request synchronization signal generator is configured to generate a request synchronization signal to an integrated circuit only after the source generator generates the image data of the frame completely, wherein the request synchronization signal is used to trigger the integrated circuit to send a synchronization signal to the processor. The output circuit is configured to send the image data of the frame to the integrated circuit only after receiving the synchronization signal generated from the integrated circuit in response to the request synchronization signal.
    Type: Application
    Filed: February 24, 2021
    Publication date: September 9, 2021
    Inventors: Chang-Chu Liu, Sheng-Hsiang Chang, Kang-Yi Fan, You-Min Yeh
  • Publication number: 20210266495
    Abstract: The present invention provides a control method of a processor, wherein the control method comprises the steps of: transmitting image data of a first frame to an integrated circuit, wherein the first frame corresponds to a first frame rate; determining a second frame rate of a second frame next to the first frame; determining if a difference between the second frame rate and the first frame rate belongs to a large scale frame rate adjustment or a small scale frame rate adjustment; if the difference between the second frame rate and the first frame rate belongs to the large scale frame rate adjustment, using a first mode to transmit image data of the second frame; and if the difference between the second frame rate and the first frame rate belongs to the small scale frame rate adjustment, using a second mode to transmit image data of the second frame.
    Type: Application
    Filed: January 21, 2021
    Publication date: August 26, 2021
    Inventors: Kang-Yi Fan, Chin-Wen Liang, Chang-Chu Liu, Sheng-Hsiang Chang, You-Min Yeh
  • Patent number: 10636718
    Abstract: A packaging module includes a substrate, a chip firmly mounted on the substrate, a frame firmly connected to the substrate via a gold-to-gold bonding and a cover firmly connected to the frame via the same gold-to-gold bonding. With the inorganic bonding structure, the packaging module is able to endure high temperature and high pressure without the worry of bonding agent being damaged by environmental condition change.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: April 28, 2020
    Assignee: Chang Sheng Hsiang Chang
    Inventor: Sheng Hsiang Chang
  • Publication number: 20190088567
    Abstract: A packaging module includes a substrate, a chip firmly mounted on the substrate, a frame firmly connected to the substrate via a gold-to-gold bonding and a cover firmly connected to the frame via the same gold-to-gold bonding. With the inorganic bonding structure, the packaging module is able to endure high temperature and high pressure without the worry of bonding agent being damaged by environmental condition change.
    Type: Application
    Filed: September 21, 2018
    Publication date: March 21, 2019
    Inventor: Sheng Hsiang Chang