Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: The present disclosure discloses a porous metal matrix composite (MMC), wherein the porous MMC includes a metal material, a spacing material forming an interconnected structure and embedded in the metal material to form an interface between the metal material and the interconnected structure; and a first plurality of pores located at the interface.

Abstract: A high-temperature hot-pressing molding machine includes a mold unit, a heating, unit disposed to heat the mold unit, a heat insulating unit including a surrounding insulating member to enclose the mold unit and two insulating layers disposed on two opposite sides of the mold unit to obstruct heat radiation and conduction from the mold unit, a heat dissipating unit disposed on the insulating layers, a cooling unit disposed on the heat dissipating unit, and a vacuum unit disposed to form a vacuum space. Under a vacuum environment, with the heat insulating unit defining a heat zone containing the mold unit, other component parts adjacent to the heat zone can be prevented from damage in a high temperature operation.

Abstract: Methods for making lead-carbon coupling, lead-carbon electrode sheets, and a lead-carbon battery are revealed. The coupling methods consist of steps of assembling the carbon material that contains oxygen functional groups or metal precursors and lead material in contact with each other and then heating the assembled lead-carbon pair to form lead oxides or metal carbides as a bridge to form coupled lead-carbon interface with high electrochemical and mechanical stability. This coupled lead-carbon structure is applied to form lead-carbon electrode sheets and is further used as electrode sheets of lead-carbon batteries by lead welding.

Abstract: A high-temperature hot-pressing molding machine includes a mold unit, a heating, unit disposed to heat the mold unit, a heat insulating unit including a surrounding insulating member to enclose the mold unit and two insulating layers disposed on two opposite sides of the mold unit to obstruct heat radiation and conduction from the mold unit, a heat dissipating unit disposed on the insulating layers, a cooling unit disposed on the heat dissipating unit, and a vacuum unit disposed to form a vacuum space. Under a vacuum environment, with the heat insulating unit defining a heat zone containing the mold unit, other component parts adjacent to the heat zone can be prevented from damage in a high temperature operation.

Abstract: Methods for making lead-carbon coupling, lead-carbon electrode sheets, and a lead-carbon battery are revealed. The coupling methods consist of steps of assembling the carbon material that contains oxygen functional groups or metal precursors and lead material in contact with each other and then heating the assembled lead-carbon pair to form lead oxides or metal carbides as a bridge to form coupled lead-carbon interface with high electrochemical and mechanical stability. This coupled lead-carbon structure is applied to form lead-carbon electrode sheets and is further used as electrode sheets of lead-carbon batteries by lead welding.

Abstract: A switch control circuit includes a processor computing an on-time ratio based on an input voltage value, a first output voltage value, and a second output voltage value. The processor further computes an on-time sum based, on an output current value, an inductance value, the input voltage value, the first output voltage value and the second output voltage value, and further computes an operation frequency value that corresponds to the on-time sum. The processor further computes on-time values of a boost mode and a buck-boost mode based on the on-time sum and the on-time ratio. The processor controls a signal generator based on the operation frequency value, the on-time value of the boost mode and the on-time value of the buck-boost mode.

Abstract: A switch control circuit includes a processor computing an on-time ratio based on an input voltage value, a first output voltage value, and a second output voltage value. The processor further computes an on-time sum based, on an output current value, an inductance value, the input voltage value, the first-output voltage value and the second output voltage value, and further computes an operation frequency value that corresponds to the on-time sum. The processor further computes on-time values of a boost mode and a buck-boost mode based on the on-time sum and the on-time ratio. The processor controls a signal generator based on the operation frequency value, the on-time value of the boost mode and the on-time value of the buck-boost mode.