Abstract: A package structure includes a first layer, a second layer and a third layer. The second layer includes an outer frame, a resonator and a chip. The second layer is arranged between the first layer and the third layer. The outer frame, the first layer and the third layer are constituted a rectangular accommodation portion. The resonator and the chip are located in the rectangular accommodation portion. The chip is located at a side of the resonator, and is electrically connected to the third layer and the resonator through a plurality of conductive components on the chip. A package structure in which the chip is located below the resonator is also provided.

Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit generates a clock signal and adjust a clock frequency of the clock signal according to a control voltage generated by the processor circuit. The processor circuit calculates a current frequency aging rate value based on a current clock frequency. The processor circuit calculates a control voltage regulation rate value based on the current frequency aging rate value and a control voltage slope, and compensates the control voltage based on the control voltage regulation rate value in the holdover state. Alternatively, the processor circuit calculates a frequency regulation value based on the current frequency aging rate value and an oscillator resolution of the synchronizer, and provides the frequency regulation value to the synchronizer in the holdover state to compensate an output frequency of the synchronizer.

Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit is configured to generate a clock signal and adjust a clock frequency of the clock signal according to a control voltage. The processor circuit is coupled to the oscillator circuit and is configured to generate the control voltage. The processor circuit reads a frequency aging rate value and a control voltage slope of the oscillator circuit from the oscillator circuit, calculates a control voltage regulation rate value corresponding to the frequency aging rate value and the control voltage slope, and compensates the control voltage based on the control voltage regulation rate value. Alternatively, the processor circuit reads the control voltage regulation rate value from the oscillator circuit, and compensates the control voltage based on the control voltage regulation rate value.

Abstract: A frequency generating device and an operation method thereof are provided. The frequency generating device includes an oscillator circuit and a processor circuit. The oscillator circuit is configured to generate a clock signal and adjust a clock frequency of the clock signal according to a control voltage. The processor circuit is coupled to the oscillator circuit and is configured to generate the control voltage. The processor circuit reads a frequency aging rate value and a control voltage slope of the oscillator circuit from the oscillator circuit, calculates a control voltage regulation rate value corresponding to the frequency aging rate value and the control voltage slope, and compensates the control voltage based on the control voltage regulation rate value. Alternatively, the processor circuit reads the control voltage regulation rate value from the oscillator circuit, and compensates the control voltage based on the control voltage regulation rate value.

Abstract: An oscillating device includes a heater, a thermoelectric cooler, a frequency source, a temperature controlled circuit, and a voltage controlled oscillation circuit. When the ambient temperature is in a low-temperature range, the temperature controlled circuit drives the heater to a target temperature to adjust an operating temperature of the frequency source. When the ambient temperature is in a high-temperature range, the temperature controlled circuit drives the thermoelectric cooler to the target temperature to adjust the operating temperature of the frequency source, and the voltage controlled oscillation circuit drives the frequency source to reduce a frequency variation of the frequency source resulted from the variation of the ambient temperature. Alternatively, the heater or the voltage controlled oscillation circuit may be omitted.

Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first waveform adjustment circuit, and at least two second quartz crystal resonators. The first quartz crystal resonator has a first resonant frequency. The driving circuit, coupled to the first quartz crystal resonator, drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The second quartz crystal resonators, coupled in parallel and coupled to the driving circuit and the first quartz crystal resonator, have a second resonant frequency and receive and rectify the first oscillating signal to generate a second oscillating signal having the second resonant frequency. The first waveform adjustment circuit, coupled to the second quartz crystal resonators, receives the second oscillating signal and adjusts the second oscillating signal to generate a first waveform adjustment signal.

Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first waveform adjustment circuit, and at least two second quartz crystal resonators. The first quartz crystal resonator has a first resonant frequency. The driving circuit, coupled to the first quartz crystal resonator, drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The second quartz crystal resonators, coupled in parallel and coupled to the driving circuit and the first quartz crystal resonator, have a second resonant frequency and receive and rectify the first oscillating signal to generate a second oscillating signal having the second resonant frequency. The first waveform adjustment circuit, coupled to the second quartz crystal resonators, receives the second oscillating signal and adjusts the second oscillating signal to generate a first waveform adjustment signal.

Abstract: An oscillating device includes a first quartz crystal resonator, a driving circuit, a first buffer, an attenuator, a second quartz crystal resonator, and a second buffer. The first quartz crystal resonator and the second quartz crystal resonator respectively have a first resonant frequency and a second resonant frequency. The driving circuit drives the first quartz crystal resonator to generate a first oscillating signal having the first resonant frequency. The first buffer generates a first clock signal in response to the first oscillating signal. The attenuator reduces the wave swing of the first clock signal to generate an attenuated signal. The second quartz crystal resonator rectifies the attenuated signal to generate a second oscillating signal having the second resonant frequency. The second buffer generates a second clock signal in response to the second oscillating signal.

Abstract: A temperature-controlled and temperature-compensated oscillating device and a method of temperature control and temperature compensation is disclosed. The operating temperature of a frequency source is adjusted by driving a heater to a target temperature when the ambient temperature is in a first range between a first temperature and a second temperature higher than the third temperature. The frequency variation of the frequency source resulted from a variation of the ambient temperature is reduced by applying a voltage to the frequency source when the ambient temperature is in a second range between a third temperature and a fourth temperature higher than the third temperature. The third temperature is higher than the first temperature.

Abstract: An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.

Abstract: An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

Abstract: An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.