Patents by Inventor SHENG-HSIANG YU

SHENG-HSIANG YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240308200
    Abstract: A method for transferring an electronic component includes the steps of: providing a carrier, wherein a surface of the carrier is loaded with an electronic component; providing a substrate; allowing a side of the substrate to face an electronic component-loaded side of the carrier, and maintaining an appropriate distance between the carrier and the substrate; providing an energy source for projecting an energy beam; splitting the energy beam into at least two sub-beams; focusing the at least two sub-beams, such that projection paths of the sub-beams are not parallel to each other; adjusting a distance between the carrier and the energy source as needed; and irradiating appropriate points on the electronic component-free side of the carrier with the at least two sub-beams to allow the electronic component to be separated from the carrier and transferred to the substrate.
    Type: Application
    Filed: May 22, 2024
    Publication date: September 19, 2024
    Applicant: SKIILEUX ELECTRICITY INC.
    Inventors: SHENG-HSIANG YU, SHANG-WEI TSAI, TE-FU CHANG, CHENG-CHIEH CHANG
  • Publication number: 20230068211
    Abstract: A device for transferring electronic component, comprising: an energy source used to project an energy beam; a first frame used to carry a carrier loaded with electronic component; a second frame used to carry a substrate for receiving the aforesaid electronic component; a beam splitting element arranged between the first frame and the energy source; and a focusing device arranged between the first frame and the beam splitting element. The present invention also relates to a method of transferring electronic component. The device for transferring electronic component and the method for transferring electronic component of the present invention can be applied in the manufacturing process of display.
    Type: Application
    Filed: June 2, 2022
    Publication date: March 2, 2023
    Inventors: SHENG-HSIANG YU, SHANG-WEI TSAI, TE-FU CHANG, CHENG-CHIEH CHANG