Abstract: The present invention provides a chuck structure for substrate cleansing equipment, which comprises a base and at least a pair of clipping members. The pair of clipping members is disposed on both corresponding sides of the base, respectively. Each clipping member has a plurality of holes on a surface thereof. When the pair of clipping members moves towards the base, it clips a substrate such as a photomask, a wafer, or other semiconductor substrate. The surfaces of the clipping members having the plurality of holes are against the substrate for reducing the contact area between the clipping members and the substrate. Thereby, the static charges generated on the substrate by the friction between the clipping members and the substrate can be avoided, which can reduce the damages on the substrate due to electrostatic discharge effectively.