Patents by Inventor Sheng-Hsun Hsiao

Sheng-Hsun Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus micro lapping with abrasive for polishing precision screw and polishing method thereof
    Patent number: 7217173
    Abstract: The present invention is an apparatus for polishing a precision screw. The apparatus uses abrasive in a sealed container for polishing. Hence, the present invention can do precise polishing to obtain smooth surface of thread by removing tiny burrs with the abrasive.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: May 15, 2007
    Assignee: National Central University
    Inventors: Biing-Hwa Yan, Hsinn-Jyh Tzeng, Jan-Ming Chen, Sheng-Hsun Hsiao