Patents by Inventor Sheng-Huang Lin

Sheng-Huang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12331999
    Abstract: A thermal module includes a radiating fin unit having a plurality of superposed radiating fin assemblies, and a plurality of groups of heat pipes. The heat pipes respectively have a heat absorbing section and a heat dissipating section formed at two opposite ends thereof. The heat absorbing sections in each heat pipe group is in contact with a heat source, and the heat dissipating sections in the same heat pipe group is sandwiched between two adjacent ones of the radiating fin assemblies. The thermal module is characterized in that the heat dissipating sections are horizontally extended through the radiating fin assemblies from one of two opposite shorter sides to another shorter side along two parallel longer sides thereof, such that the heat dissipating sections not only have a maximum contact area with the radiating fin assemblies, but also give the radiating fin unit an enhanced structural strength.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: June 17, 2025
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sheng-Huang Lin
  • Patent number: 12272617
    Abstract: A heat dissipation fastener structure includes a support body, a heat sink, a cover body and an operation unit assembly. The support body comprises a window formed on an upper side and support legs extended from a lower side to together define a reciprocating space in communication with the window. The heat sink is formed with perforations at four corners and disposed in the reciprocating space. Threaded locking members, around which elastic members are fitted, are correspondingly passed through the perforations to mount the heat sink above a heat source in a floating state. The cover body is disposed on the support body and comprises at least one vertical folded edge. The operation unit assembly is disposed on the heat sink to drive the cover body to shield the threaded locking members and make the heat sink get close to or away from the heat source.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: April 8, 2025
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Chii-Ming Leu
  • Patent number: 12241690
    Abstract: A thermal module structure includes an aluminum base having a heat pipe receiving groove formed on one side thereof; a heat dissipation unit including a plurality of radiation fin assemblies or heat sinks and being provided with a first heat pipe receiving section; a plurality of heat pipes made of a copper material and respectively having a heat absorption section and a horizontally extended condensation section; and a copper embedding layer provided on surfaces of the heat pipe receiving groove and the first heat pipe receiving section. The aluminum base and the heat dissipation unit are horizontally parallelly arranged. The heat absorption sections are fitted in the heat pipe receiving groove, and the condensation sections are extended through the first heat pipe receiving section. With the copper embedding layer, the aluminum base and the heat dissipation unit can be directly welded to the heat pipes.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: March 4, 2025
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Patent number: 12215934
    Abstract: A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: February 4, 2025
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Patent number: 12146714
    Abstract: A heat dissipation device assembly includes an aluminum base seat, an aluminum radiating fin assembly and at least one U-shaped copper heat pipe, which is upright arranged or horizontally arranged. The aluminum base seat has at least one connection section. A copper embedding layer is disposed on the connection section. The aluminum radiating fin assembly is assembled and disposed on the aluminum base seat. The copper heat pipe has a heat dissipation section and a heat absorption section respectively connected on the aluminum radiating fin assembly and the connection section of the aluminum base seat. By means of the copper embedding layer, the aluminum base seat and the copper heat pipe can be directly welded and connected with each other without chemical nickel treatment.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: November 19, 2024
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Yuan-Yi Li
  • Publication number: 20240347419
    Abstract: A heat dissipation fastener structure includes a support body, a heat sink, a cover body and an operation unit assembly. The support body comprises a window formed on an upper side and support legs extended from a lower side to together define a reciprocating space in communication with the window. The heat sink is formed with perforations at four corners and disposed in the reciprocating space. Threaded locking members, around which elastic members are fitted, are correspondingly passed through the perforations to mount the heat sink above a heat source in a floating state. The cover body is disposed on the support body and comprises at least one vertical folded edge. The operation unit assembly is disposed on the heat sink to drive the cover body to shield the threaded locking members and make the heat sink get close to or away from the heat source.
    Type: Application
    Filed: April 11, 2023
    Publication date: October 17, 2024
    Inventors: Sheng-Huang Lin, Chii-Ming Leu
  • Patent number: 12111113
    Abstract: A heat transfer component reinforcement structure includes a main body. The main body has a pair of first lateral sides and a pair of second lateral sides and a reinforcement member. The reinforcement member is correspondingly externally connected with the main body in at least one manner selected from the group consisting of that the reinforcement members are engaged, latched and connected with the first lateral sides and the second lateral sides of the main body and the reinforcement members are engaged, latched and connected with the junctions between the first and second lateral sides in four corners.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: October 8, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20240141950
    Abstract: A screw locking unit structure includes a screw main body having a head portion, a stem portion extended from a lower side of the head portion, a first screw locking section located below the stem portion, and a second screw locking section located below the first screw locking section; and an elastic element being externally fitted around the stem portion. The first screw locking section and the second screw locking section are externally provided with a first and a second male thread, respectively. The first and the second male thread are structurally different from one another to not only enable the screw main body to be temporarily held to an assembling interface before the latter is screw locked in place later, but also provide a function of stopping screwing automatically to prevent the second locking section extended through the assembling interface from being excessively screwed into a heat source.
    Type: Application
    Filed: April 26, 2023
    Publication date: May 2, 2024
    Inventors: Sheng-Huang Lin, Chii-Ming Leu
  • Publication number: 20240093946
    Abstract: A thermal module includes a radiating fin unit having a plurality of superposed radiating fin assemblies, and a plurality of groups of heat pipes. The heat pipes respectively have a heat absorbing section and a heat dissipating section formed at two opposite ends thereof. The heat absorbing sections in each heat pipe group is in contact with a heat source, and the heat dissipating sections in the same heat pipe group is sandwiched between two adjacent ones of the radiating fin assemblies. The thermal module is characterized in that the heat dissipating sections are horizontally extended through the radiating fin assemblies from one of two opposite shorter sides to another shorter side along two parallel longer sides thereof, such that the heat dissipating sections not only have a maximum contact area with the radiating fin assemblies, but also give the radiating fin unit an enhanced structural strength.
    Type: Application
    Filed: May 11, 2023
    Publication date: March 21, 2024
    Inventor: Sheng-Huang Lin
  • Publication number: 20230422443
    Abstract: A vapor chamber structure includes a main body. The main body has multiple independent heat dissipation blocks. Each of the heat dissipation blocks has an internal independent airtight chamber. A capillary structure is disposed on an inner wall face of the airtight chamber. A working fluid is filled in the airtight chamber. Multiple connection bodies are disposed between the independent heat dissipation blocks to connect the independent heat dissipation blocks with each other. At least one heat insulation penetrating slot is formed between each two adjacent connection bodies to separate the heat dissipation blocks from each other so as to achieve heat insulation effect. By means of the heat insulation penetrating slots formed on the connection bodies, the respectively airtight chambers can independently conduct heat without transferring heat to each other.
    Type: Application
    Filed: February 22, 2023
    Publication date: December 28, 2023
    Inventor: Sheng-Huang Lin
  • Patent number: 11817372
    Abstract: A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: November 14, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Sheng-Huang Lin
  • Publication number: 20230337971
    Abstract: A detecting method for a behavior disorder event during rapid-eye-movement sleep is provided. The detecting method includes: collecting a heart rate value and a motion value of a user per epoch within a time period; generating a plurality of corresponding sleep condition values by using the motion values, to distinguish epochs into an awake period and a sleep period; transforming the motion values corresponding to the sleep period into a score according to a predetermined rule, to generate a plurality of sleep depth scores, and distinguishing the sleep period into a light sleep period and a deep sleep period by using the sleep depth scores; grouping the heart rate values corresponding to the deep sleep period as a high heart rate group and a low heart rate group; and determining, when the motion values corresponding to the high heart rate group satisfy a condition, that a behavior disorder event happens.
    Type: Application
    Filed: October 31, 2022
    Publication date: October 26, 2023
    Inventors: Pei-Chi CHUANG, Chun-Hsiang TSAI, Yu-Jen CHEN, Ching-Fu WANG, Shih-Zhang LI, Sheng-Huang LIN, Pei-Hsin KUO, You-Yin CHEN
  • Patent number: 11719491
    Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.
    Type: Grant
    Filed: June 5, 2022
    Date of Patent: August 8, 2023
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20230243603
    Abstract: A heat sink structure with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one through hole and al least one groove, in which a copper embedding layer is provided for contacting with and connected to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 3, 2023
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20230243598
    Abstract: A thermal module structure includes an aluminum base having a heat pipe receiving groove formed on one side thereof; a heat dissipation unit including a plurality of radiation fin assemblies or heat sinks and being provided with a first heat pipe receiving section; a plurality of heat pipes made of a copper material and respectively having a heat absorption section and a horizontally extended condensation section; and a copper embedding layer provided on surfaces of the heat pipe receiving groove and the first heat pipe receiving section. The aluminum base and the heat dissipation unit are horizontally parallelly arranged. The heat absorption sections are fitted in the heat pipe receiving groove, and the condensation sections are extended through the first heat pipe receiving section. With the copper embedding layer, the aluminum base and the heat dissipation unit can be directly welded to the heat pipes.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 3, 2023
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20230243608
    Abstract: A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 3, 2023
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20230243597
    Abstract: A heat sink assembly with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one area to be connected to other members of the heat sink assembly, such as a groove. A copper embedding layer is provided on a groove inner surface of the groove for connecting the aluminum fin assembly to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 3, 2023
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20230243596
    Abstract: A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 3, 2023
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20230243595
    Abstract: A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 3, 2023
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin
  • Publication number: 20230241728
    Abstract: A manufacturing method of thermal module includes steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component. By means of the copper embedding layer, the aluminum heat conduction component can be welded and connected with other heat conduction components made of heterogeneous materials and the same material.
    Type: Application
    Filed: December 12, 2022
    Publication date: August 3, 2023
    Inventors: Sheng-Huang Lin, Yuan-Yi Lin