Patents by Inventor Sheng-Huei Kuo

Sheng-Huei Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a light emitting diode element
    Patent number: 8173456
    Abstract: A method of manufacturing a light emitting diode element is provided. A first patterned semi-conductor layer, a patterned light emitting layer, and a second patterned semi-conductor layer are sequentially formed on an epitaxy substrate so as to form a plurality of epitaxy structures, wherein the first patterned semi-conductor layer has a thinner portion in a non-epitaxy area outside the epitaxy structures. A passivation layer covering the epitaxy structures and the thinner portion is formed. The passivation layer covering on the thinner portion is partially removed to form a patterned passivation layer. A patterned reflector is formed directly on each of the epitaxy structures. The epitaxy structures are bonded to a carrier substrate. A lift-off process is performed to separate the epitaxy structures from the epitaxy substrate. An electrode is formed on each of the epitaxy structures far from the patterned reflector.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: May 8, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Jenq-Dar Tsay, Suh-Fang Lin, Yu-Hsiang Chang, Yih-Der Guo, Sheng-Huei Kuo, Wei-Hung Kuo, Hsun-Chih Liu
  • METHOD OF MANUFACTURING A LIGHT EMITTING DIODE ELEMENT
    Publication number: 20110003410
    Abstract: A method of manufacturing a light emitting diode element is provided. A first patterned semi-conductor layer, a patterned light emitting layer, and a second patterned semi-conductor layer are sequentially formed on an epitaxy substrate so as to form a plurality of epitaxy structures, wherein the first patterned semi-conductor layer has a thinner portion in a non-epitaxy area outside the epitaxy structures. A passivation layer covering the epitaxy structures and the thinner portion is formed. The passivation layer covering on the thinner portion is partially removed to form a patterned passivation layer. A patterned reflector is formed directly on each of the epitaxy structures. The epitaxy structures are bonded to a carrier substrate. A lift-off process is performed to separate the epitaxy structures from the epitaxy substrate. An electrode is formed on each of the epitaxy structures far from the patterned reflector.
    Type: Application
    Filed: December 29, 2009
    Publication date: January 6, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jenq-Dar Tsay, Suh-Fang Lin, Yu-Hsiang Chang, Yih-Der Guo, Sheng-Huei Kuo, Wei-Hung Kuo, Hsun-Chih Liu