Abstract: An apparatus for measuring the thickness profile and elastic modulus profile of a polishing pad comprise an eddy current sensor and a mechanism to press the eddy current sensor against the polishing pad. The pad thickness is given by the signal of the eddy current sensor. The elastic modulus of the polishing pad is extracted from measurements at different forces applied to the eddy current sensor. The thickness profile and elastic modulus profile of the polishing pad are obtained by scanning the measurement across the whole polishing pad or along a diameter of the polishing pad. The pad thickness profile is used to adjust pad conditioning recipe so that more pad materials is eroded away at thicker area of the pad. By employing the apparatus of present invention, the thickness uniformity of a polishing pad can be better maintained, resulting in longer pad lifetime and better CMP removal rate uniformity.

Abstract: A method of vacuum holes formation on carrier film of chemical mechanical polishing machine; the formed vacuum is to fit the dimension and position of vacuum hole on the wafer carrier of the chemical mechanical polishing machine. The present invention is that providing a formed plate and a mold for fixing and positioning, and then adjusting to produce the best laser parameters, thus forming vacuum hole of need of carrier film on chemical polishing machine via laser machine.

Abstract: A method for forming dresser of chemical mechanical polishing pad, firstly to make a stainless steel bottom seat. Then preparing metal welding powder and organic glue, mixing the aforesaid metal welding powder, organic glue and adequate ratio of water to welding thick liquid and uniformly distributing or pasting it on the aforesaid dresser bottom seat to form the sintering layer. The aforesaid metal welding material includes the active metal with diamond can form metal carbonate. Then using the computer visual inspection system to proceed the diamond powder distribution, uniformly distributing them for 60 to 2500 grains per square centimeter. Proceeding the sintering process to make the friction layer of chemical mechanical polishing pad dresser.