Abstract: A patterned ground shield device includes a first patterned ground shield layer and a second patterned ground shield layer. The first patterned ground shield layer is located on a first layer, and the second patterned ground shield layer is located on a second layer. The first patterned ground shield layer includes a plurality of first strip-shaped structures, and each of the first strip-shaped structures includes an oxide diffusion material. The second patterned ground shield layer includes a plurality of second strip-shaped structures, and each of the second strip-shaped structures includes a conductive material, wherein the first strip-shaped structures and the second strip-shaped structures are disposed to each other in an interlaced manner.

Abstract: A patterned ground shield device includes a first patterned ground shield layer and a second patterned ground shield layer. The first patterned ground shield layer is located on a first layer, and the second patterned ground shield layer is located on a second layer. The first patterned ground shield layer includes a plurality of first strip-shaped structures, and each of the first strip-shaped structures includes an oxide diffusion material. The second patterned ground shield layer includes a plurality of second strip-shaped structures, and each of the second strip-shaped structures includes a conductive material, wherein the first strip-shaped structures and the second strip-shaped structures are disposed to each other in an interlaced manner.

Abstract: An integrated circuit structure includes a substrate, an integrated inductor, multiple components, multiple metal interconnections, a first shielding structure, and a second shielding structure. The integrated inductor is substantially formed in a first layer of the integrated circuit structure. The metal interconnections are coupled to the integrated inductor and the components. The first shielding structure is formed between the first layer and the substrate and is substantially beneath the integrated inductor. The second shielding structure is formed between the first layer and the substrate, has substantially the same distribution as the metal interconnections, and is substantially beneath the metal interconnections. The first shielding structure and the second shielding structure are equipotential.

Abstract: A multi-phase brushless DC motor driving circuit includes a driving-stage circuit, a PWM generator, a control circuit and a plurality of current detection circuits. The driving-stage circuit includes a plurality of sub-driving circuits each having a high-side transistor and a low-side transistor. The current detection circuits detect the current at a node between the high-side transistor and the low-side transistor of the corresponding sub-driving circuit, and then generate a current detection signal. According to the current detection signals, the control circuit controls the PWM generator to generate a plurality of PWM signals for controlling the conducting and cutting off of the high-side transistor and the low-side transistor of each sub-driving circuit, and to provide a driving current to drive a multi-phase brushless DC motor.

Abstract: A system includes a cooling device, a memory, and a processor. The cooling device is configured to detect a temperature of a wafer and to provide air to the wafer. The memory is configured to store computer program codes. The processor is configured to execute the computer program codes in the memory to: determine whether the temperature of the wafer meet a predetermined requirement; adjust the temperature of the wafer on condition that the temperature does not meet the predetermined requirement; and control the cooling device to detect the temperature of the wafer again, in order to verify whether an adjusted temperature of the wafer meet predetermined requirement.

Abstract: A multi-phase brushless DC motor driving circuit includes a driving-stage circuit, a PWM generator, a control circuit and a plurality of current detection circuits. The driving-stage circuit includes a plurality of sub-driving circuits each having a high-side transistor and a low-side transistor. The current detection circuits detect the current at a node between the high-side transistor and the low-side transistor of the corresponding sub-driving circuit, and then generate a current detection signal. According to the current detection signals, the control circuit controls the PWM generator to generate a plurality of PWM signals for controlling the conducting and cutting off of the high-side transistor and the low-side transistor of each sub-driving circuit, and to provide a driving current to drive a multi-phase brushless DC motor.

Abstract: An integrated circuit structure includes a substrate, an integrated inductor, multiple components, multiple metal interconnections, a first shielding structure, and a second shielding structure. The integrated inductor is substantially formed in a first layer of the integrated circuit structure. The metal interconnections are coupled to the integrated inductor and the components. The first shielding structure is formed between the first layer and the substrate and is substantially beneath the integrated inductor. The second shielding structure is formed between the first layer and the substrate, has substantially the same distribution as the metal interconnections, and is substantially beneath the metal interconnections. The first shielding structure and the second shielding structure are equipotential.

Abstract: A system includes a cooling device, a memory, and a processor. The cooling device is configured to detect a temperature of a wafer and to provide air to the wafer. The memory is configured to store computer program codes. The processor is configured to execute the computer program codes in the memory to: determine whether the temperature of the wafer meet a predetermined requirement; adjust the temperature of the wafer on condition that the temperature does not meet the predetermined requirement; and control the cooling device to detect the temperature of the wafer again, in order to verify whether an adjusted temperature of the wafer meet predetermined requirement.

Abstract: A system includes a protection device and a blocking device. The protection device is installed on a wall of a chamber. The protection device is configured to protect the wall of the chamber from plasma associated with a semiconductor manufacturing process that is performed by a tool. The blocking device is arranged between the protection device and the wall to block up a gap therebetween.

Abstract: A stacked capacitor structure includes a MOS varactor and a stacked capacitor. The stacked capacitor is electrically connected to the MOS varactor. The MOS varactor includes a substrate, a gate, a first source/drain and a second source/drain. The substrate has a well, and the gate is positioned over the well. The first source/drain and the second source/drain are formed in the well and positioned at opposing sides of the gate. The stacked capacitor includes a plurality of metal layers. The metal layers are spaced from each other, stacked above the gate, and positioned below an inductive element.

Abstract: A paper cup cover structure device is disclosed, which comprises a cup body, being made of a paper, and comprising a cup opening disposed at a top thereof, and a cup bottom disposed at a bottom thereof, the cup opening having a flat cup rim disposed at an outer circumference thereof and having a flat face, the flat cup rim being contained within an extension cirucumferentially disposed downwards; and a cup cover, covering the cup body at the cover top, disposed at an inner wall face corresponding to the cup rim, and having a screw magzine circumferentially disposed with respect thereto, the screw magzine having a push-stop portion extending from a bottom thereof so that the cup rim and the screw magzine are rotationally combined with each other, where the cup body may be further reinforced by using the cup rim having the flat shape.

Abstract: A paper cup cover structure, comprising a cup body, being made of a paper, and comprising a cup opening disposed at a top thereof, a flat cup rim disposed around an exterior side of the cup opening, the cup rim having a flat face disposed at an exterior side thereof; and a cup cover, having a screw magzine circumferentially disposed at an inner face corresponding to the cup rim so that the cup rim and the screw magzine are rotationally combined with each other. In this manner, not only the cup body may more firmly stand with an assistance of the flat cup rim, the screw magzine may also rotationally reach a closure with the flat cup rim by stopping the screw magzine against the flat cup rim, so that the cup cover and the flat cup rim form a stable closure fixation.

Abstract: A light emitting diode (LED) light tube includes a substrate, a plurality of light emitting diodes (LEDs), a light diffusing plate, an organic yellow fluorescent powder and a hollow tube. The substrate, the LEDs and the light diffusing plate are disposed in the hollow tube. The organic yellow fluorescent powder is doped in the light diffusing plate. The LEDs are lined up on a surface of the substrate. The light diffusing plate are disposed facing to the LEDs, in which the light diffusing plate includes a plurality of microstructures located on positions opposite to the LEDs, so as to diffuse the light emitted from the LEDs.

Abstract: A novel cup is revealed. The cup is deform-proof. A body part of the cup has lateral-oriented fibers. By using the lateral-oriented fibers together with a rim part surrounding an opening part of the cup, the cup is not easily deformed on being held by hand. The present invention can be applied to cups with different heights for strengthening the body part, reducing weight of the body part and lowering production cost.

Abstract: A light emitting diode (LED) lamp includes a heat dissipation module, a circular light guide plate (LGP), and LED light sources. The heat dissipation module includes a heat dissipation element and a heat-conducting base that has a containing concave. The heat dissipation element connecting and surrounding the heat-conducting base is distant from the circumference of the heat-conducting base. The circular LGP in the containing concave has a top surface, a bottom surface, and an annular side surface. The top surface faces the heat-conducting base and has concentric annular trenches. The LED light sources are configured in the containing concave and face the annular side surface. The LED light sources are suitable for emitting a light beam which is capable of passing through the annular side surface to enter the circular LGP and capable of being reflected by the annular trenches and emitted from the bottom surface.

Abstract: A light guide plate (LGP) includes a first surface, a second surface, and a plurality of light incident surfaces. The first surface is a light-emitting surface. The light incident surfaces connect the first surface and the second surface. The second surface has a plurality of ring-shaped grooves. Depths of the ring-shaped grooves are gradually decreased from a place close to a center of the LGP towards places close to the light incident surfaces. Each of the ring-shaped grooves has a first ring-shaped side wall surface and a second ring-shaped side wall surface. The second ring-shaped side wall surface is opposite to the first ring-shaped side wall surface and located between a geometry center of the ring-shaped groove and the first ring-shaped side wall surface. The first ring-shaped side wall surface is a tilted surface. In addition, a light source apparatus is also provided.

Abstract: A light source module includes a transparent element, a plurality of light-emitting devices, and a plurality of light diffusion micro-structures. The transparent element includes a transparent substrate having a light exiting surface and a bottom surface opposite to the light exiting surface, a plurality of first notches, and a plurality of second notches. The first notches are sunken at the light exiting surface. There is a reflection surface in each of the first notches. The second notches are respectively opposite to the first notches and sunken at the bottom surface. The second notches respectively have a light incident curve-surface. The light-emitting devices are respectively disposed beside the light incident curve-surfaces. Each of the light-emitting devices has a light exiting surface capable of providing a light beam. The light exiting surface is not conformal to the light incident curve-surface. The light diffusion micro-structures are disposed on the bottom surface.

Abstract: A light guide unit including a light guide plate and a scattering reflective unit is provided. The light guide plate has a first surface, a second surface opposite to the first surface, and a light incident surface connecting the first surface and the second surface. The light incident surface includes a first recess and a second recess arranged in a sequence from the first surface to the second surface. An average radius of curvature of the first recess is less than an average radius of curvature of the second recess. The scattering reflective unit is disposed on the second surface. A light source module is also provided.

Abstract: A light source apparatus including a light guide plate, a first light emitting unit, and a second light emitting unit is provided. The light guide plate has a first surface, an opposite second surface, a first side surface, and an opposite second side surface. The first light emitting unit is disposed beside the first side surface for providing a first light beam. The second light emitting unit is disposed beside the second side surface for providing a second light beam. The first light emitting unit has a central line passing through a geometric center of the first light emitting unit and being perpendicular to the first side surface. The second light emitting unit has a central line passing through a geometric center of the second light emitting unit and being perpendicular to the second side surface. The central lines do not coincide with each other.