Patents by Inventor Sheng-Hung YI
Sheng-Hung YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150253904Abstract: A touch sensitive housing includes an insulator housing and conductive first and second touch sensor layers formed on the insulator housing, stacked one over the other and insulated from each other. At least one of the first and second touch sensor layers includes a patterned seed sub-layer including a catalytically active metal useful for activating electroless plating and a base sub-layer of a base metal formed on the seed sub-layer and having structural characteristics indicative of the base sub-layer being formed by electroless plating techniques.Type: ApplicationFiled: March 3, 2015Publication date: September 10, 2015Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO, Huai-Liang CHIEN
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Publication number: 20150241910Abstract: A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.Type: ApplicationFiled: December 29, 2014Publication date: August 27, 2015Inventors: Sheng-Hung YI, Pen-Yi LIAO
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Patent number: 8952919Abstract: A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.Type: GrantFiled: March 4, 2014Date of Patent: February 10, 2015Assignee: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Publication number: 20140374141Abstract: A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.Type: ApplicationFiled: November 27, 2012Publication date: December 25, 2014Inventors: Sheng-Hung Yi, Pen-Yi Liao, Min-Hsiang Chen
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Publication number: 20140183020Abstract: A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.Type: ApplicationFiled: March 4, 2014Publication date: July 3, 2014Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO
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Publication number: 20140116885Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.Type: ApplicationFiled: January 7, 2014Publication date: May 1, 2014Applicant: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Publication number: 20140102775Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.Type: ApplicationFiled: December 19, 2013Publication date: April 17, 2014Applicant: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Patent number: 8692790Abstract: A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.Type: GrantFiled: October 31, 2011Date of Patent: April 8, 2014Assignee: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Publication number: 20120273261Abstract: A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure.Type: ApplicationFiled: July 12, 2012Publication date: November 1, 2012Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO
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Publication number: 20120217145Abstract: A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.Type: ApplicationFiled: October 31, 2011Publication date: August 30, 2012Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO
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Publication number: 20120177942Abstract: A composite structure for an electronic device includes: a metallic base part made from a metallic material and having at least one bonding region; at least one porous protrusion made from a sintered metal powder and bonded to and protruding from the bonding region; and at least one feature molded over the porous protrusion.Type: ApplicationFiled: January 6, 2012Publication date: July 12, 2012Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Chia-Ming CHANG, Shih-Chang YEH, Chung-Ho LIU, Sheng-Hung YI
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Publication number: 20120107575Abstract: A touch panel having a seamless outer surface and its manufacturing method are disclosed. The method includes: binding step, placing step, and placing step. Provide a film and a shell. This film has a decorated area and a non-decorated area. Bond this film onto the shell to form an exterior seamless structure. Providing a touch panel and a screen displaying portion, place them together so as to form an internal structure. Finally, place the internal structure into a hollow area of the exterior seamless structure with glue for expelling any air clearance so that the exterior seamless structure and the internal structure are combined as a final product. It has a smooth surface with less shrinkage and is good for decoration. It can reduce thickness significantly. Light transmittance at hollow area is relatively larger. Plus, the sensitivity of the touch panel will perform a better response.Type: ApplicationFiled: October 27, 2011Publication date: May 3, 2012Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventor: SHENG-HUNG YI
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Publication number: 20110278050Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.Type: ApplicationFiled: February 25, 2011Publication date: November 17, 2011Applicant: JABIL CIRCUIT, INC.Inventors: SHENG-HUNG YI, PEN-YI LIAO
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Publication number: 20100284132Abstract: A touch panel module includes a capacitive touch panel and a seamless shell body. The capacitive touch panel includes a touch surface actuated by a touch action. The seamless shell body is formed by a molding material, and includes a touch portion which is transparent and a peripheral portion which is integrally formed with the touch portion, wherein the touch portion is molded to the capacitive touch panel. A method of making the touch panel module is also disclosed.Type: ApplicationFiled: May 7, 2010Publication date: November 11, 2010Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Yen-Chou Chen, Wen-Pao Yang
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Publication number: 20100215938Abstract: This invention discloses a method of selective plastic insert molding on metal component and its product. A metal joint component is bonded with a metal component. After which, the joint component is submerged in plastic so that the molded plastic can be secured on the metal component firmly. Hence, a desired plastic structure can be formed on the metal component. This invention can shorten the manufacturing process and reduce the cost. In addition, it solves the traditional bonding problem between the plastic and the metal component as well as the problem concerning processing time and high cost.Type: ApplicationFiled: February 16, 2010Publication date: August 26, 2010Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Shaupoh WANG, Sheng-Hung YI, Yi-Chung SU