Abstract: A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.

Abstract: A rotating axle skewer sleeve in the present invention is provided in a rotisserie oven with the rear end receiving the protruding rod of the motor on one inner side wall of the rotisserie oven. The rotating axle skewer sleeve is provided with a right quadrangle hollow in the center for the spear end of the rotating axle skewer to be promptly and smoothly plugged into in any azimuth angle.

Abstract: An inserting structure of an oil-collecting plate for an electric oven in the present invention is provided with a plate-inserting groove located below several electric heating tubes, along and inward the lower portion of three inner walls of the roasting room of an electric oven. The plate-inserting groove is properly provided for three sides of an oil-collecting plate to be inserted in so as to make the oil-collecting plate form an oil-collecting scope bigger than the dripping scope formed by the inner walls of the roasting room and take the most effect of collecting oil.