Patents by Inventor Sheng-Jen Chen
Sheng-Jen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961810Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.Type: GrantFiled: June 21, 2021Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen
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Publication number: 20240120388Abstract: Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gate material to a recessed surface, wherein the recessed surface includes a first horn at a first edge, a second horn at a second edge, and a valley located between the first horn and the second horn; depositing an etch-retarding layer over the recessed surface, wherein the etch-retarding layer has a central region over the valley and has edge regions over the horns, and wherein the central region of the etch-retarding layer is thicker than the edge regions of the etch-retarding layer; and performing a second etch process to recess the horns to establish the gate material with a desired profile.Type: ApplicationFiled: January 18, 2023Publication date: April 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Li-Wei Yin, Tzu-Wen Pan, Yu-Hsien Lin, Jih-Sheng Yang, Shih-Chieh Chao, Chia Ming Liang, Yih-Ann Lin, Ryan Chia-Jen Chen
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Publication number: 20240105795Abstract: A method for fabricating semiconductor devices is disclosed. The method includes forming a gate trench over a semiconductor channel, the gate trench being surrounded by gate spacers. The method includes sequentially depositing a work function metal, a glue metal, and an electrode metal in the gate trench. The method includes etching respective portions of the electrode metal and the glue metal to form a gate electrode above a metal gate structure. The metal gate structure includes a remaining portion of the work function metal and the gate electrode includes a remaining portion of the electrode metal. The gate electrode has an upper surface extending away from a top surface of the metal gate structure.Type: ApplicationFiled: February 16, 2023Publication date: March 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jun-Ye Liu, Jih-Sheng Yang, Yu-Hsien Lin, Ryan Chia-Jen Chen
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Publication number: 20240096630Abstract: Disclosed is a semiconductor fabrication method. The method includes forming a gate stack in an area previously occupied by a dummy gate structure; forming a first metal cap layer over the gate stack; forming a first dielectric cap layer over the first metal cap layer; selectively removing a portion of the gate stack and the first metal cap layer while leaving a sidewall portion of the first metal cap layer that extends along a sidewall of the first dielectric cap layer; forming a second metal cap layer over the gate stack and the first metal cap layer wherein a sidewall portion of the second metal cap layer extends further along a sidewall of the first dielectric cap layer; forming a second dielectric cap layer over the second metal cap layer; and flattening a top layer of the first dielectric cap layer and the second dielectric cap layer using planarization operations.Type: ApplicationFiled: January 12, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Li-Wei Yin, Tzu-Wen Pan, Yu-Hsien Lin, Yu-Shih Wang, Jih-Sheng Yang, Shih-Chieh Chao, Yih-Ann Lin, Ryan Chia-Jen Chen
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Publication number: 20240089000Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.Type: ApplicationFiled: September 14, 2023Publication date: March 14, 2024Applicant: AuthenX Inc.Inventors: Sheng-Fu LIN, Po-Kuan SHEN, Chun-Chiang YEN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
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Publication number: 20240085634Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.Type: ApplicationFiled: September 14, 2023Publication date: March 14, 2024Applicant: AuthenX Inc.Inventors: Chun-Chiang YEN, Po-Kuan SHEN, Sheng-Fu LIN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
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Patent number: 11929000Abstract: The display system comprising a main control module and a display module is provided. The main control module comprises a display driving circuit and a timing control circuit. The display driving circuit is used to output a display driving signal. The timing control circuit is coupled to the display driving circuit to receive the display driving signal, and convert the display driving signal into a digital signal. The display module comprises a first display panel to an N-th display panel, coupled to the timing control circuit and receiving the digital signal, so as to display corresponding multimedia content according to the digital signal, wherein N is a positive integer greater than 1, and the main control module is independently coupled to the display module.Type: GrantFiled: January 17, 2023Date of Patent: March 12, 2024Assignee: AUO Display Plus CorporationInventors: Sheng-Kai Hsu, Hung-Min Shih, Yung-Jen Chen
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Patent number: 11345033Abstract: The disclosure provides a control method of a moving body and a control system of a moving body, which allow a control part to calculate a fragment of a moving path between the moving body and a target according to position information of the moving body and the target, and transmit the fragment to the moving body. The above steps are repeatedly executed in sequence until the moving body reaches the target.Type: GrantFiled: September 19, 2019Date of Patent: May 31, 2022Assignee: NIDEC CORPORATIONInventors: Chun-Hsien Liu, Bo Yi Li, Sheng-Jen Chen, Chih-Hsiang Chen, Yung-Chih Pan, Chi-Ying Lee
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Publication number: 20200094409Abstract: The disclosure provides a control method of a moving body and a control system of a moving body, which allow a control part to calculate a fragment of a moving path between the moving body and a target according to position information of the moving body and the target, and transmit the fragment to the moving body. The above steps are repeatedly executed in sequence until the moving body reaches the target.Type: ApplicationFiled: September 19, 2019Publication date: March 26, 2020Applicant: NIDEC CORPORATIONInventors: Chun-Hsien Liu, Bo Yi Li, Sheng-Jen Chen, Chih-Hsiang Chen, Yung-Chih Pan, Chi-Ying Lee
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Publication number: 20040031127Abstract: A handle grip structure includes an elastic tube, and a slender strip mounted on the elastic tube. The slender strip includes a foamed layer having an inner surface wrapped and bonded around an outer surface of the elastic tube, and a polyester layer coated on an outer surface of the foamed layer. Thus, by provision of the foamed layer having a determined elastic restoring force, the handle grip structure has an excellent shock absorbing effect, thereby decreasing the sport damage applied on the user.Type: ApplicationFiled: August 13, 2002Publication date: February 19, 2004Inventor: Sheng-Jen Chen
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Publication number: 20040031128Abstract: A handle grip structure includes an elastic tube, and an impregnated polyurethane layer mounted on an outer periphery of the elastic tube by a predetermined working process, so that the polyurethane layer are integrally formed on the elastic tube, thereby forming an integral structure Thus, the handle grip structure may have an excellent shock absorbing effect, thereby efficiently reducing the vibration when hitting the ball, and thereby greatly decreasing the sport damage applied on the user.Type: ApplicationFiled: August 13, 2002Publication date: February 19, 2004Inventor: Sheng-Jen Chen