Patents by Inventor Sheng-Ji Liao

Sheng-Ji Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6392165
    Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes and are coaxial therewith. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. Electrical conductors are provided on the base plate and the interfacing plate for connecting electrically and respectively the solder pads and the insert pins via the upper and lower through holes.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: May 21, 2002
    Assignee: Witek Enterprise Co., Ltd.
    Inventor: Sheng-Ji Liao
  • Publication number: 20020029903
    Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The solder pads correspond to and are adapted for surface mounting of solder balls of the ball grid array device thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. The insert pins correspond to and are adapted for insertion into pin holes in the integrated circuit socket in order to establish electrical contact with board mounting pins that are disposed in the pin holes.
    Type: Application
    Filed: August 24, 2001
    Publication date: March 14, 2002
    Applicant: Witek Enterprise Co., Ltd. a Taiwan Corporation
    Inventor: Sheng-Ji Liao
  • Patent number: 6326560
    Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The solder pads correspond to and are adapted for surface mounting of solder balls of the ball grid array device thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. The insert pins correspond to and are adapted for insertion into pin holes in the integrated circuit socket in order to establish electrical contact with board mounting pins that are disposed in the pin holes.
    Type: Grant
    Filed: August 4, 1999
    Date of Patent: December 4, 2001
    Assignee: Witek Enterprise Co., Ltd.
    Inventor: Sheng-Ji Liao