Patents by Inventor Sheng Ji

Sheng Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080299113
    Abstract: The present invention provides a method for treating tumors or tumor metastases in a patient, comprising administering to the patient simultaneously or sequentially a therapeutically effective amount of an EGFR kinase inhibitor and an IGF1R inhibitor compound of Formula I combination, with or without additional agents or treatments, such as other anti-cancer drugs or radiation therapy. The invention also encompasses a pharmaceutical composition that is comprised of an EGFR kinase inhibitor and IGF1R inhibitor compound of Formula I combination with a pharmaceutically acceptable carrier. The IGF1R inhibitor is represented by Formula I: wherein X1, X2, X3, X4, X5, X6, X7, R1, and Q1 are defined herein.
    Type: Application
    Filed: December 18, 2006
    Publication date: December 4, 2008
    Inventors: Lee D. Arnold, Qun-Sheng Ji, Mark Joseph Mulvihill
  • Publication number: 20080014200
    Abstract: The present invention provides a method for treating tumors or tumor metastases in a patient, comprising administering to the patient simultaneously or sequentially a therapeutically effective amount of an anti-cancer agent and an IGF1R inhibitor compound of Formula I combination, with or without additional agents or treatments, such as other anti-cancer drugs or radiation therapy. The IGF1R inhibitor is represented by Formula I: wherein X1, X2, X3, X4, X5, X6, X7, R1, and Q1 are defined herein.
    Type: Application
    Filed: April 13, 2007
    Publication date: January 17, 2008
    Inventors: Lee Arnold, Qun-Sheng Ji, Mark Mulvihill
  • Publication number: 20070032512
    Abstract: Compounds of the formula and pharmaceutically acceptable salts thereof, wherein X1, X2, X3, and Q1 are defined herein, inhibit the IGF-1R enzyme and are useful for the treatment and/or prevention of hyperproliferative diseases such as cancer, inflammation, psoriasis, allergy/asthma, disease and conditions of the immune system, disease and conditions of the central nervous system.
    Type: Application
    Filed: August 3, 2006
    Publication date: February 8, 2007
    Inventors: Qun-Sheng Ji, Mark Mulvihill, Arno Steinig, Qinghua Weng
  • Publication number: 20040185548
    Abstract: Hybrid receptors are provided that comprise (a) the extracellular domain of the Ret receptor kinase, containing one or more amino acid residue substitutions, deletions or additions that render it capable of activating an intracellular receptor kinase domain in a ligand-independent manner, and (b) the kinase domain of a heterologous receptor protein kinase. The present invention is also directed to nucleic acids and expression vectors encoding these hybrid receptor proteins, host cells expressing these hybrid receptor proteins, methods for detecting a modulator of receptor protein kinase activity, and membrane preparations comprising recombinantly produced hybrid receptor protein. The hybrid receptors are useful for assays for the determination of modulators of receptor protein kinase activity, being particularly useful in cases where the ligand for the receptor kinase is unknown, or difficult to obtain or use.
    Type: Application
    Filed: March 16, 2004
    Publication date: September 23, 2004
    Inventor: Qun-Sheng Ji
  • Patent number: 6392165
    Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes and are coaxial therewith. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. Electrical conductors are provided on the base plate and the interfacing plate for connecting electrically and respectively the solder pads and the insert pins via the upper and lower through holes.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: May 21, 2002
    Assignee: Witek Enterprise Co., Ltd.
    Inventor: Sheng-Ji Liao
  • Publication number: 20020029903
    Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The solder pads correspond to and are adapted for surface mounting of solder balls of the ball grid array device thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. The insert pins correspond to and are adapted for insertion into pin holes in the integrated circuit socket in order to establish electrical contact with board mounting pins that are disposed in the pin holes.
    Type: Application
    Filed: August 24, 2001
    Publication date: March 14, 2002
    Applicant: Witek Enterprise Co., Ltd. a Taiwan Corporation
    Inventor: Sheng-Ji Liao
  • Patent number: 6326560
    Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The solder pads correspond to and are adapted for surface mounting of solder balls of the ball grid array device thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. The insert pins correspond to and are adapted for insertion into pin holes in the integrated circuit socket in order to establish electrical contact with board mounting pins that are disposed in the pin holes.
    Type: Grant
    Filed: August 4, 1999
    Date of Patent: December 4, 2001
    Assignee: Witek Enterprise Co., Ltd.
    Inventor: Sheng-Ji Liao