Patents by Inventor Sheng-Jian Jou

Sheng-Jian Jou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having an antenna and manufacturing method thereof
    Patent number: 9153542
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first substrate, a second substrate, an interposer substrate, a semiconductor chip, a package body and a first antenna layer. The first substrate comprises a grounding segment. The interposer substrate is disposed between the second substrate and the first substrate. The semiconductor chip is disposed on the second substrate. The package body encapsulates the second substrate, the semiconductor chip and the interposer substrate, and has a lateral surface and an upper surface. The first antenna layer is formed on the lateral surface and the upper surface of the package body, and electrically connected to the grounding segment.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: October 6, 2015
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: I-Chia Lin, Sheng-Jian Jou, Han-Chee Yen
  • SEMICONDUCTOR PACKAGE HAVING AN ANTENNA AND MANUFACTURING METHOD THEREOF
    Publication number: 20140035097
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first substrate, a second substrate, an interposer substrate, a semiconductor chip, a package body and a first antenna layer. The first substrate comprises a grounding segment. The interposer substrate is disposed between the second substrate and the first substrate. The semiconductor chip is disposed on the second substrate. The package body encapsulates the second substrate, the semiconductor chip and the interposer substrate, and has a lateral surface and an upper surface. The first antenna layer is formed on the lateral surface and the upper surface of the package body, and electrically connected to the grounding segment.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 6, 2014
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: I-Chia Lin, Sheng-Jian Jou, Han-Chee Yen