Abstract: A camera module with good heat dissipation efficiency and stability includes a base. The base comprises a first receiving groove. At least one escaping hole is defined at the base and the escaping hole forms a connection between the first receiving groove and the ambient environment. At least one heat dissipation block is received in each escaping hole.

Abstract: A camera module with good heat dissipation efficiency and stability includes a base. The base comprises a first receiving groove. At least one escaping hole is defined at the base and the escaping hole forms a connection between the first receiving groove and the ambient environment. At least one heat dissipation block is received in each escaping hole.

Abstract: A camera includes a bracket, a lens, a filter, a circuit board, a lens base, and a photosensitive chip. The bracket defines a through hole. The lens is mounted on the bracket. The is filter mounted on a side of the bracket and covers the through hole. The circuit board is mounted on a side of the bracket opposite to the filter. The lens base is mounted on the side of the bracket mounted to the filter. The photosensitive chip is mounted on the circuit board and faces the through hole. One of the bracket and the lens base includes a number of positioning members. The other one of the bracket and the lens base defines a number of positioning holes. Each positioning member is received in a corresponding one of the positioning holes.

Abstract: An optical projection device with metallic components for heat dissipation and for structural reinforcement includes a holder and two opposing metal components opposite to each other. The holder comprises lens receiving groove, electric component receiving groove, and connecting receiving groove leading to the exterior. The two opposing metal components comprise first and second heat dissipation parts, and a connecting part. The first heat dissipation part is formed on an exterior surface of the holder, the connecting part is received in the connecting receiving groove, and the second heat dissipation part is formed on an inner wall of the electric component receiving groove.

Abstract: An optical projection module with improved heat dissipation efficiency includes a circuit board, a semiconductor substrate mounted on a surface of the circuit board, and a light source and an optical member mounted on a surface of the semiconductor substrate opposite from the circuit board. A hollow area is defined in the circuit board and in the semiconductor substrate to draw heat directly away from the light source and thus avoid physical distortion of the hardware which would otherwise reduce the quality of light beams emitted.

Abstract: An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.

Abstract: A circuit board includes an assembly and a labeling area. The assembly area is for installation of the elements. The labeling area is for marking of the circuit board. A paint layer is coated on a surface of the labeling area. A two-dimensional code is printed on the paint layer. A camera module having the circuit board and a method for labeling the circuit board are also provided.

Abstract: An imaging module allows heated internal gas to escape out of a camera/imaging module when heat is applied to the module during an adhesive curing manufacturing step without making manufacture more difficult due to molding issues. The imaging module includes a lens holder with top and bottom surfaces. The bottom surface defines an opening at a bottom of the lens holder. The opening extends through the inside and outside walls of the lens holder. The opening allows heated internal gas to escape out of a camera/imaging module.

Abstract: An optical projector module protected against image distortion caused by heat building up in the light-emitting element includes a printed circuit board, and a light emitting element and an optical member mounted on the printed circuit board. The optical member includes a supporting structure which forms a housing. The housing contains the light emitting element, and a dissipating member made of electrically and thermally conductive metal is embedded on an inner surface of the housing. The housing extends outside of the housing and forms a path to carry away heat generated.

Abstract: A optical projector device less vulnerable to deformation of projected light by generated heat includes a printed circuit board, a light source, and an optical module. The heat-generating light source emits a laser beam, the optical module being mounted on the printed circuit board and surrounding the light source. The optical module comprises a lens holder, a collimating optical element received in the lens holder, and a diffractive optical element away from the light source. The lens holder comprises an outer lens holder and an inner lens holder fixed in the outer lens holder, and the diffractive optical element is received in the inner lens holder, this arrangement enables the dissipation of any heat-expansion force away from these elements.

Abstract: A camera device allowing for easy and reliable mating to a circuit board includes a printed circuit board, an imaging sensor mounted on the printed circuit board, a supporting bracket mounted on the printed circuit board and surrounding the imaging sensor, and a lens module received in the supporting bracket. The printed circuit board includes a first portion and an extending portion connecting with the first portion, the first portion defines a first location and a second location. The first location surrounds the imaging sensor, and the second location is located outside of the first location and adjacent to the extending portion. The supporting bracket includes a main body and a fixing lug forming at side surface of the main body, bottom of the base and bottom of the fixing lug are coplanar.

Abstract: The present invention relates to a camera module. The camera module includes a circuit board; an image sensor electrically connected to the circuit board; at least one lens holder disposed on the circuit board; at least one lens module received in the at least one lens holder; wherein the circuit board comprises a heat dissipation area in the central thereof and a wiring area besides the heat dissipation area, the wiring area being electrically insulated from the heat dissipation area, the wiring area comprises a plurality of conducting traces, the heat dissipation area defines a plurality of dissipating holes, each dissipating hole is provided with a thermally conductive pillar; and the image sensor is mounted on the heat dissipation area, heat generated by the image sensor is able to dissipate via the thermally conductive pillar.

Abstract: A camera module which collects incoming dirt and dust so as to prevent the accumulation of same on an optical element of the image-capturing process includes a microscope base and an optical filter unit. The microscope base includes a supporting portion. A first gap is formed in the supporting portion. The optical filter unit filter and adhesive layer formed on the optical filter. The optical filter is bonded on the supporting portion by the adhesive layer. The optical filter comprises a filter area in the optical filter. A surface of the adhesive layer facing away from the optical filter is adhesive. A second gap is formed in the adhesive layer. The filter area is exposed from the second gap. Parts of the adhesive layer and the filter area are exposed from the first gap.

Abstract: A small-scale camera device with heat-dissipating properties includes a pedestal bracket and a camera module mounted on the pedestal bracket. The pedestal bracket includes a top plate and a side plate extending perpendicularly from edges of the top plate. The side plate includes an inner side surface and an outer side surface opposite to the inner side surface. The bottom of the side plate defines a plurality of first receiving recesses, each of the first receiving recesses carries a heat dissipation member.

Abstract: A light shielding member includes a transparent plate. The transparent plate includes a first surface and a second surface opposite to the first surface; the first surface of the transparent plate comprises a first light permeable area and a light shielding area surrounding the first light permeable area. The light shielding member further comprises a opaque adhesive layer formed on the light shielding area.

Abstract: A camera module which collects incoming dirt and dust so as to prevent the accumulation of same on an optical element of the image-capturing process includes a microscope base and an optical filter unit. The microscope base includes a supporting portion. A first gap is formed in the supporting portion. The optical filter unit filter and adhesive layer formed on the optical filter. The optical filter is bonded on the supporting portion by the adhesive layer. The optical filter comprises a filter area in the optical filter. A surface of the adhesive layer facing away from the optical filter is adhesive. A second gap is formed in the adhesive layer. The filter area is exposed from the second gap. Parts of the adhesive layer and the filter area are exposed from the first gap.

Abstract: A lens module includes a circuit, a sensor mounted on the circuit, a base mounted on the circuit, a motor mounted on the base, and a lens unit mounted on the motor. The base has a first surface, a second surface opposite to the first surface and an outer surface connected with the first surface and the second surface. The base forms a plurality of heat dissipation layers, the heat dissipation layers are made of metal materials. The heat dissipation layers are spaced from each other. The heat dissipation layers are formed on the first surface and the outer surface of the base.