Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Abstract: A method for manufacturing a thermoplastic polymer foaming sole includes the following steps. A prototype is formed. The prototype includes thermoplastic polyurethane or thermoplastic polyester elastomer but excludes a cross-linking agent and a foaming agent, and the prototype is sole-shaped. A supercritical fluid is used to foam the prototype so as to directly get the thermoplastic polymer foaming sole. A density of the thermoplastic polymer foaming sole is larger than or equal to 0.3 g/cm3 and smaller than or equal to 0.8 g/cm3.

Abstract: A method for manufacturing a foam shoe material includes the following steps. (a) A plate prototype is formed, wherein the plate prototype is composed of thermoplastic polyurethane. (b) The plate prototype is foamed by a supercritical fluid to form a foam shoe material including a plurality of microporous structures and an average aperture of the microporous structures is smaller than 100 micrometers.