Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.

Abstract: A biaxially rotatable electrical connector has a base and a rotary part. The rotary part has a rotary member and an insertion member. One end of the rotary member is pivotally connected with the base and is rotated around a first axis, the other end of the rotary member is pivotally connected with the insertion member so that the insertion member can be rotated around a second axis. The base and the rotary part are hollow and their inner spaces communicate with each other. Accordingly, the electrical connector can be flexibly rotated with multiple angular directions and does not conflict with or block other adjacent plug or socket when connected to an electronic device.