Patents by Inventor Sheng-Kai Wen

Sheng-Kai Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110037655
    Abstract: A dielectric-loaded and coupled planar antenna includes a ground plane, a radiator, a ceramic substrate and at least one ground coupling electrode. The radiator is formed by extending one side of the ground plane, and a feeding point is formed between the radiator and the ground plane. The radiator extends at least one end portion on the ceramic substrate. The ground coupling electrode is formed on the ceramic substrate by extending the other side of the ground plane. The ground coupling electrode formed on the ceramic substrate and the end portion of the radiator formed on the ceramic substrate are coupled with each other to form a coupling electrode. The present invention can adjust the coupling amount loaded by the ceramic substrate so as to be operated in a desired frequency range. The present invention can be operated in a single-frequency, dual-frequency or multi-frequency condition.
    Type: Application
    Filed: August 17, 2009
    Publication date: February 17, 2011
    Inventors: Yueh-Lin Tsai, Sheng-Kai Wen, Chih-Wei Chen, Po-Chun Huang, Lee-Ting Hsieh
  • Publication number: 20100309087
    Abstract: A chip antenna device includes a single or multi-layer dielectric substrate, a radiator body, one or a plurality of first coupling electrodes formed on the radiator body, and a ground radiator formed on the upper or lower surface or inter-layer in another end of the substrate. It is designed by using loops and coupling concepts. The chip antenna device does not require large areas and clear space but has high radiation efficiency. It adjusts the impedance matching and operation frequency by changing the signal feed position, so that low frequency operation can be achieved without increasing the area of said antenna meeting the requirements of compact size for electronic products.
    Type: Application
    Filed: June 4, 2009
    Publication date: December 9, 2010
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Yueh-Lin Tsai, Sheng-Kai Wen, Chih-Wei Chen