Abstract: A semiconductor device and methods of fabricating the same are disclosed. The semiconductor device includes a substrate, a fin structure disposed on the substrate, a source/drain (S/D) region disposed on the fin structure, and a gate structure disposed on the fin structure adjacent to the S/D region. The gate structure includes a gate stack disposed on the fin structure and a gate capping structure disposed on the gate stack. The gate capping structure includes a conductive gate cap disposed on the gate stack and an insulating gate cap disposed on the conductive gate cap. The semiconductor device further includes a first contact structure disposed within the gate capping structure and a first via structure disposed on the first contact structure.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first and second transistors arranged over a substrate. The first transistor includes first channel structures extending between first and second source/drain regions. A first gate electrode is arranged between the first channel structures, and a first protection layer is arranged over a topmost one of the first channel structures. The second transistor includes second channel structures extending between the second source/drain region and a third source/drain region. A second gate electrode is arranged between the second channel structures, and a second protection layer is arranged over a topmost one of the second channel structures. The integrated chip further includes a first interconnect structure arranged between the substrate and the first and second channel structures, and a contact plug structure coupled to the second source/drain region and arranged above the first and second gate electrodes.

Abstract: A backlight component includes a back plate, a fastening module, a light source and a light-guiding plate. The fastening module includes a first plate, a second plate and a third plate. The first plate, the second plate and the third plate define a receiving space. The light source is securely assembled at one side of the second plate and facing toward the receiving space. The light-guiding plate is slidably assembled in the receiving space of the fastening module, and sandwiched between the first plate and the third plate. Accordingly, when the thickness of the light-guiding plate is changed, only the second plate of the fastening module need be changed; additionally, the length of the fastening module can be normalized to apply for display devices with different sizes. Consequently, the manufacturing cost of display devices can be reduced, and the fastening module is applicable to different kinds of display devices.

Abstract: A backlight component includes a back plate, a fastening module, a light source and a light-guiding plate. The fastening module includes a first plate, a second plate and a third plate. The first plate, the second plate and the third plate define a receiving space. The light source is securely assembled at one side of the second plate and facing toward the receiving space. The light-guiding plate is slidably assembled in the receiving space of the fastening module, and sandwiched between the first plate and the third plate. Accordingly, when the thickness of the light-guiding plate is changed, only the second plate of the fastening module need be changed; additionally, the length of the fastening module can be normalized to apply for display devices with different sizes. Consequently, the manufacturing cost of display devices can be reduced, and the fastening module is applicable to different kinds of display devices.

Abstract: A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.

Abstract: A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.