Patents by Inventor Sheng-Liang Dai
Sheng-Liang Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9717162Abstract: An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium.Type: GrantFiled: January 12, 2015Date of Patent: July 25, 2017Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Jia-Hong Wu, Sheng-Liang Dai
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Patent number: 9689625Abstract: A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube and sealing the tube to form the heat pipe.Type: GrantFiled: December 12, 2013Date of Patent: June 27, 2017Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Sheng-Liang Dai, Jia-Hong Wu
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Patent number: 9453689Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.Type: GrantFiled: December 26, 2013Date of Patent: September 27, 2016Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
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Publication number: 20160088762Abstract: An electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component. The casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber, and a pore structure formed within the sealed chamber. The sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium, whereby the heat generated from the electronic component is dissipated by a phase change of the working medium.Type: ApplicationFiled: January 12, 2015Publication date: March 24, 2016Inventors: JIA-HONG WU, SHENG-LIANG DAI
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Publication number: 20140166246Abstract: A method for manufacturing a heat pipe includes following steps: providing a tube; providing a rod; inserting the rod in the circular tube, a receiving portion is formed between an inner face of the tube and the upper portion of the rod; providing an amount of metal powder and filling the metal powder into the receiving portion; sintering the metal powder at a high temperature to form a first wick structure adhered on the inner face of the tube and then drawing the rod out of the tube; injecting a working medium into the tube and sealing the tube to form the heat pipe.Type: ApplicationFiled: December 12, 2013Publication date: June 19, 2014Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, JIA-HONG WU
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Publication number: 20140166244Abstract: An exemplary flat heat pipe includes a hollow tube and a wick structure lining an inner surface of the tube. The tube includes an evaporator section, an adiabatic section and a condenser section defined in turn along a longitudinal direction thereof. The wick structure includes a first wick portion located in the evaporator section, a second wick portion located in the condenser section, and a third wick portion extending longitudinally from the evaporator section, through the adiabatic section to the condenser section and communicating with the first wick portion and the second wick portion. A capillary force of the first wick portion is larger than that of the third wick portion, and a pore density of the first wick portion is less than that of the third wick portion.Type: ApplicationFiled: March 25, 2013Publication date: June 19, 2014Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, JIA-HONG WU
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Publication number: 20140166245Abstract: A flat heat spreader includes a hollow casing defining a vapor chamber therein, a working liquid contained in the vapor chamber, a first wick structure formed on an inner face of the casing, and a second wick structure formed on the inner face of the casing. The inner face of the casing includes a bottom face and a top face opposite to the bottom face. A porosity of the first wick structure is less than that of the second wick structure. A method for manufacturing the flat heat spreader is also provided.Type: ApplicationFiled: April 17, 2013Publication date: June 19, 2014Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, JIA-HONG WU
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Publication number: 20140150995Abstract: An exemplary heat pipe includes a hollow tube, a wick structure configured on an inner surface of the tube and a working medium formed in the tube. Two ends of the tube are sealed and the tube defining a chamber therein. The tube comprises an evaporating section and a condensing section, and the evaporating section is isolated from the condensing section. The wick structure extends from the evaporating section to the condensing section along the inner surface of the tube to form a working medium channel. A pair of through holes is defined in each of the evaporating section and the condensing section of the tube. A pair of metal pipes communicate the through holes of the evaporating section with those of the condensing section to form a pair of vapor channels. A method for manufacturing the heat pipe is also provided.Type: ApplicationFiled: December 28, 2012Publication date: June 5, 2014Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, JIA-HONG WU
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Publication number: 20140102671Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.Type: ApplicationFiled: December 26, 2013Publication date: April 17, 2014Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, JIN-PENG LIU, YUE LIU, SHENG-GUO ZHOU, SHENG-LIN WU, NIEN-TIEN CHENG
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Patent number: 8667684Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.Type: GrantFiled: June 28, 2010Date of Patent: March 11, 2014Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
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Publication number: 20140054014Abstract: A heat pipe includes an elongated tube, a wick structure arranged on an inner wall of the tube, and a working fluid filled in the tube. The wick structure defines elongated liquid channels for condensed working fluid flowing therethrough. An elongated vapor channel is defined in the tube for vaporized working fluid flowing therethrough. The vapor channel is spaced from the liquid channels by the wick structure.Type: ApplicationFiled: October 16, 2012Publication date: February 27, 2014Inventors: SHENG-LIANG DAI, YU-LIANG LO, JIA-HONG WU
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Publication number: 20130255921Abstract: An exemplary heat pipe includes a tube, an evaporation section and a condenser section located at two opposite ends of the tube, a grid wick structure received in the tube and abutting an inner wall of the tube, and a working fluid sealed in the tube. The grid wick structure includes a plurality of rhombuses. Each rhombus includes two opposite first included angles, one of the first included angles is at a point of the rhombus nearest one of the ends of the tube, the other first included angle is at a point of the rhombus nearest the other end of the tube. Each first included angle is smaller than 90 degrees.Type: ApplicationFiled: March 27, 2013Publication date: October 3, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, YU-LIANG LO, JIA-HONG WU
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Publication number: 20130233520Abstract: An exemplary flat heat pipe includes a cover, a wick structure and a restricting plate. The cover defines a receiving chamber therein. The wick structure is received in the receiving chamber. The restricting plate is received in the receiving chamber and opposite ends thereof abut against opposite inner surfaces of the cover to divide the receiving chamber into two passages. The restricting plate divides the wick structure into two wick portions, the wick portions are adhered on lateral surfaces of the restricting plate and located at lateral sides of two passages, respectively.Type: ApplicationFiled: April 3, 2012Publication date: September 12, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: YU-LIANG LO, SHENG-LIANG DAI
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Publication number: 20130233519Abstract: An exemplary flat heat pipe includes a cover, a wick structure adhered to part of an inner surface of the cover and working medium contained in the wick structure. The cover defines a receiving chamber therein. The wick structure is received in the receiving chamber and includes an interface surface away from the inner surface of the cover. The interface of the wick structure and the exposed inner surface of the cover cooperatively define a vapor passage therebetween.Type: ApplicationFiled: April 1, 2012Publication date: September 12, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, YU-LIANG LO
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Patent number: 8459339Abstract: A heat pipe includes a tube body and a sealing member. The tube body is made of titanium and has a sealed end and an open end at two opposite ends of the tube body. The sealing member is attached to the open end and seals the open end of the tube body. The sealing member is made of a material selected from one of copper, aluminum, stainless steel, low-carbon steel, iron, nickel, tungsten, tantalum, molybdenum, rhenium and columbium. The sealing member seals the open end.Type: GrantFiled: August 18, 2009Date of Patent: June 11, 2013Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Yue Liu, Jin-Peng Liu, Sheng-Liang Dai, Sheng-Lin Wu, Yu-Liang Lo
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Patent number: 8459340Abstract: An exemplary flat heat pipe with an evaporator section and a condenser section includes a hollow casing, and a first wick structure and a second wick structure in the casing. The second structure contacts an inner surface of the casing at the evaporator section. The first structure at the evaporator section includes a first contact portion contacting an inner surface of the second structure, and a first isolated portion from the inner surface of the second structure. The first isolated portion and the inner surface of the second structure define a first channel therebetween. The first structure at the condenser section includes a second contact portion contacting the inner surface of the casing, and a second isolated portion from the inner surface of the casing. The second isolated portion and the inner surface of the casing define therebetween a second channel communicating with the first channel.Type: GrantFiled: June 17, 2010Date of Patent: June 11, 2013Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Yue Liu, Sheng-Liang Dai, Jin-Peng Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Yu-Liang Lo
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Publication number: 20130037244Abstract: A flat heat pipe includes a casing, a wick structure received in the casing, and a working medium contained in the casing and saturated in the wick structure. The casing has an upper plate and a bottom plate opposite to the upper plate. The wick structure is attached only to the bottom plate of the casing. The wick structure spaces from the upper plate with a vapor channel defined between the upper plate and the wick structure.Type: ApplicationFiled: October 18, 2012Publication date: February 14, 2013Inventors: SHENG-LIN WU, HAI-PING SHEN, SHENG-LIANG DAI, YU-LIANG LO, NIEN-TIEN CHENG
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Patent number: 8361948Abstract: A paint stripper composition includes from about 70 to about 76 percent by volume of methylene chloride, from about 10 to about 14 percent by volume of isopropanol, from about 5 to about 8 percent by volume of formic acid, from about 1.5 to about 2.5 percent by volume of OP-10, from about 1 to about 2.5 percent by volume of phenol, and from about 2 to about 4 percent by volume of ozocerite, based upon 100 percent by volume of the total composition.Type: GrantFiled: August 8, 2011Date of Patent: January 29, 2013Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chang-De Li, Huang-Jin Lv, Sheng-Liang Dai
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Publication number: 20130014919Abstract: A heat pipe includes a casing and a plurality of wick layers. The casing has an inner wall. The wick layers stack at an inner surface of the casing in turn. The wick layers respectively define a plurality of pores therein. Diameters of the pores of each of the wick layers gradually decrease from the inner wall to center of the casing.Type: ApplicationFiled: August 29, 2011Publication date: January 17, 2013Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, YUE LIU, HAI-PING SHEN, WEN-HU CHEN, JIA-HONG WU, YU-LIANG LO
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Publication number: 20120316096Abstract: A paint stripper composition includes from about 70 to about 76 percent by volume of methylene chloride, from about 10 to about 14 percent by volume of isopropanol, from about 5 to about 8 percent by volume of formic acid, from about 1.5 to about 2.5 percent by volume of OP-10, from about 1 to about 2.5 percent by volume of phenol, and from about 2 to about 4 percent by volume of ozocerite, based upon 100 percent by volume of the total composition.Type: ApplicationFiled: August 8, 2011Publication date: December 13, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: CHANG-DE LI, HUANG-JIN LV, SHENG-LIANG DAI