Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.

Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.

Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.

Abstract: A power supply system for a motherboard includes a switching power source, a control circuit, and a switch circuit. The control circuit includes a photocoupler and a comparator. The photocoupler is electrically connected to the switching power source and the comparator. The switch circuit is electrically connected to the comparator and a motherboard. The switch circuit is turned off when the motherboard is in a normal state and turned on when the motherboard is in a standby state. The switching power source outputs a voltage through the control circuit when the switch circuit is turned off. When the switch circuit is turned on, the comparator outputs a first state signal to the photocoupler. The photocoupler thus outputs a first driving signal to the switching power source. The first driving signal causes the switching power source to reduce the voltage.

Abstract: A power supply system for a motherboard includes a switching power source, a control circuit, and a switch circuit. The control circuit includes a photocoupler and a comparator. The photocoupler is electrically connected to the switching power source and the comparator. The switch circuit is electrically connected to the comparator and a motherboard. The switch circuit is turned off when the motherboard is in a normal state and turned on when the motherboard is in a standby state. The switching power source outputs a voltage through the control circuit when the switch circuit is turned off. When the switch circuit is turned on, the comparator outputs a first state signal to the photocoupler. The photocoupler thus outputs a first driving signal to the switching power source. The first driving signal causes the switching power source to reduce the voltage.