Patents by Inventor SHENG-LIN WU
SHENG-LIN WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120313Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
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Publication number: 20240089607Abstract: An image sensing device and a control device of an illumination device thereof are provided. The control device includes a control circuit, an operation circuit, and multiple driving signal generators. The control circuit generates multiple control signals. The operation circuit performs a logical operation on the control signals and an image capturing signal to generate multiple operation results. The driving signal generator respectively provides multiple driving signals to the illumination device according to the operation results, and the driving signals respectively have multiple different output powers.Type: ApplicationFiled: May 29, 2023Publication date: March 14, 2024Applicant: HTC CorporationInventors: Chao Shuan Huang, Sheng-Long Wu, Yu-Jui Hsu, Shih-Yao Tsai, Tun-Hao Chao, Sen-Lin Chung, Chih Pin Chung, Chih-Yuan Chien, Shih Hong Sun
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Patent number: 9453689Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.Type: GrantFiled: December 26, 2013Date of Patent: September 27, 2016Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
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Publication number: 20160140131Abstract: A system and a method for data transformation for cloud-based archiving and backup are disclosed. The system includes an original disk storage, an object storage and a Data Transformation and Virtualization Module (DTVM). The DTVM can transform an original data in the original disk storage into an archiving data which has objects, pointers, and a metadata including an environmental information, and store the archiving data to the object storage by a storing means. Thus, in addition to restoring of the archiving data which is available, with the drivers for booting added to objects, pointers, and a metadata, recovery of the original disk storage with booting function can be available.Type: ApplicationFiled: November 19, 2014Publication date: May 19, 2016Applicant: ProphetStor Data Services, Inc.Inventors: Wen Shyen CHEN, Sheng Lin WU
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Patent number: 9063799Abstract: A method for encapsulating functions for application programming interface in a cloud environment is disclosed. The method includes the steps of: A. providing an API supported by a driver; B inheriting the API as a new class if the API is usable for a service device in a computing node environment; C. augmenting extending function(s) for the service device to the driver; and D. repackaging the driver to conform to the inherited API.Type: GrantFiled: March 19, 2014Date of Patent: June 23, 2015Assignee: Prophetstor Data Services, Inc.Inventors: Wen Shyen Chen, Sheng Lin Wu
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Publication number: 20140102671Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.Type: ApplicationFiled: December 26, 2013Publication date: April 17, 2014Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, JIN-PENG LIU, YUE LIU, SHENG-GUO ZHOU, SHENG-LIN WU, NIEN-TIEN CHENG
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Patent number: 8667684Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.Type: GrantFiled: June 28, 2010Date of Patent: March 11, 2014Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
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Patent number: 8622117Abstract: A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.Type: GrantFiled: June 25, 2009Date of Patent: January 7, 2014Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Sheng-Lin Wu, Yu-Liang Lo, Wen-Hu Chen, Yue Liu, Nien-Tien Cheng
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Patent number: 8459339Abstract: A heat pipe includes a tube body and a sealing member. The tube body is made of titanium and has a sealed end and an open end at two opposite ends of the tube body. The sealing member is attached to the open end and seals the open end of the tube body. The sealing member is made of a material selected from one of copper, aluminum, stainless steel, low-carbon steel, iron, nickel, tungsten, tantalum, molybdenum, rhenium and columbium. The sealing member seals the open end.Type: GrantFiled: August 18, 2009Date of Patent: June 11, 2013Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Yue Liu, Jin-Peng Liu, Sheng-Liang Dai, Sheng-Lin Wu, Yu-Liang Lo
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Patent number: 8459340Abstract: An exemplary flat heat pipe with an evaporator section and a condenser section includes a hollow casing, and a first wick structure and a second wick structure in the casing. The second structure contacts an inner surface of the casing at the evaporator section. The first structure at the evaporator section includes a first contact portion contacting an inner surface of the second structure, and a first isolated portion from the inner surface of the second structure. The first isolated portion and the inner surface of the second structure define a first channel therebetween. The first structure at the condenser section includes a second contact portion contacting the inner surface of the casing, and a second isolated portion from the inner surface of the casing. The second isolated portion and the inner surface of the casing define therebetween a second channel communicating with the first channel.Type: GrantFiled: June 17, 2010Date of Patent: June 11, 2013Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Yue Liu, Sheng-Liang Dai, Jin-Peng Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Yu-Liang Lo
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Publication number: 20130037244Abstract: A flat heat pipe includes a casing, a wick structure received in the casing, and a working medium contained in the casing and saturated in the wick structure. The casing has an upper plate and a bottom plate opposite to the upper plate. The wick structure is attached only to the bottom plate of the casing. The wick structure spaces from the upper plate with a vapor channel defined between the upper plate and the wick structure.Type: ApplicationFiled: October 18, 2012Publication date: February 14, 2013Inventors: SHENG-LIN WU, HAI-PING SHEN, SHENG-LIANG DAI, YU-LIANG LO, NIEN-TIEN CHENG
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Publication number: 20120111540Abstract: An exemplary flat type heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure includes a plurality of spaced protruding portions and grooves between every two adjacent protruding portions. The second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.Type: ApplicationFiled: December 21, 2010Publication date: May 10, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, SHENG-GUO ZHOU, JIN-PENG LIU, YUE LIU, SHENG-LIN WU, YU-LIANG LO
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Publication number: 20120111539Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is folded by a steel sheet with a plurality of pores, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.Type: ApplicationFiled: December 21, 2010Publication date: May 10, 2012Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, SHENG-GUO ZHOU, JIN-PENG LIU, YUE LIU, SHENG-LIN WU, YU-LIANG LO
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Publication number: 20110277964Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.Type: ApplicationFiled: June 28, 2010Publication date: November 17, 2011Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.Inventors: SHENG-LIANG DAI, JIN-PENG LIU, YUE LIU, SHENG-GUO ZHOU, SHENG-LIN WU, NIEN-TIEN CHENG
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Publication number: 20110174465Abstract: An exemplary flat heat pipe with an evaporator section and a condenser section includes a hollow casing, and a first wick structure and a second wick structure in the casing. The second structure contacts an inner surface of the casing at the evaporator section. The first structure at the evaporator section includes a first contact portion contacting an inner surface of the second structure, and a first isolated portion from the inner surface of the second structure. The first isolated portion and the inner surface of the second structure define a first channel therebetween. The first structure at the condenser section includes a second contact portion contacting the inner surface of the casing, and a second isolated portion from the inner surface of the casing. The second isolated portion and the inner surface of the casing define therebetween a second channel communicating with the first channel.Type: ApplicationFiled: June 17, 2010Publication date: July 21, 2011Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: YUE LIU, SHENG-LIANG DAI, JIN-PENG LIU, SHENG-GUO ZHOU, SHENG-LIN WU, YU-LIANG LO
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Publication number: 20110174466Abstract: An exemplary flat heat pipe with an evaporator section and a condenser section includes a casing, and a first wick structure and a second wick structure in the casing. The casing defines a first vapor channel within the evaporator section. The first wick structure contacts an inner surface of the casing at the condenser section. The first wick structure includes a contact portion in contact with the inner surface of the casing, and an isolated portion from the inner surface of the casing. The isolated portion and the inner surface of the casing cooperatively define therebetween a second vapor channel in communication with the first vapor channel. The second wick structure contacts the inner surface of the casing at the evaporator section. The second wick structure joins the first wick structure at a joint between the evaporator section and the condenser section.Type: ApplicationFiled: June 17, 2010Publication date: July 21, 2011Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: YUE LIU, SHENG-LIANG DAI, JIN-PENG LIU, SHENG-GUO ZHOU, SHENG-LIN WU, YU-LIANG LO
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Publication number: 20110174464Abstract: An exemplary flat heat pipe with an evaporator section and a condenser section at opposite ends thereof includes a hollow flat casing, a first wick structure and a solid and sintered second wick structure. The first wick structure includes a top plate and a bottom plate opposite to the top plate. The first wick structure is received in the casing, and extends from the evaporator section to the condenser section. The second wick structure is disposed in the casing at the evaporator section. The second wick structure contacts the top and bottom plates and joins the first wick structure. A method for manufacturing the heat pipe is also provided.Type: ApplicationFiled: June 17, 2010Publication date: July 21, 2011Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: YUE LIU, SHENG-LIANG DAI, JIN-PENG LIU, SHENG-GUO ZHOU, SHENG-LIN WU, YU-LIANG LO
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Publication number: 20100307720Abstract: A heat pipe includes a casing and a supporting member. The casing is made of titanium and has a first end and a second end at two opposite sides thereof. The first end defines a receiving space therein. The supporting member is made of a material selected from one of copper, aluminum, stainless steel, low-carbon steel, iron, nickel, tungsten, tantalum, molybdenum, rhenium and columbium. The supporting member is received in the receiving space of the first end of the casing. The first end of the casing and the supporting member are integrally cramped and sealed.Type: ApplicationFiled: August 28, 2009Publication date: December 9, 2010Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: JIN-PENG LIU, YUE LIU, SHENG-LIANG DAI, SHENG-LIN WU, YU-LIANG LO
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Publication number: 20100300655Abstract: A heat pipe includes a tube body and a sealing member. The tube body is made of titanium and has a sealed end and an open end at two opposite ends of the tube body. The sealing member is attached to the open end and seals the open end of the tube body. The sealing member is made of a material selected from one of copper, aluminum, stainless steel, low-carbon steel, iron, nickel, tungsten, tantalum, molybdenum, rhenium and columbium. The sealing member seals the open end.Type: ApplicationFiled: August 18, 2009Publication date: December 2, 2010Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: YUE LIU, JIN-PENG LIU, SHENG-LIANG DAI, SHENG-LIN WU, YU-LIANG LO
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Publication number: 20100212870Abstract: A flat heat pipe includes a casing and a wick structure received in the casing. The casing has a first lateral portion and a second lateral portion. Each of the first lateral portion and the second lateral portion has a C-shape configuration, and the second lateral portion has an opening facing an opening of the first lateral portion. The wick structure is attached to an inner surface of only one of the first and lateral portions of the casing. The inner surface of the other of the first and second lateral portions without the wick structure attached thereto defines a first vapor channel, and an inner surface of the wick structure defines a second vapor channel. The first vapor channel has a height greater than the second vapor channel.Type: ApplicationFiled: June 22, 2009Publication date: August 26, 2010Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.Inventors: Sheng-Lin Wu, Hai-Ping Shen, Sheng-Liang Dai, Yu-Liang Lo, Nien-Tien Cheng