Abstract: An encoding method, a decoding method, and a device for point cloud compression are provided. The encoding method includes the following. Point cloud data corresponding to a first frame is obtained, and is distinguished into a global point cloud set and at least one object point cloud set according to a reference frame. The object point cloud set corresponds to at least one reference object point cloud set. A global dynamic model corresponding to the global point cloud set is calculated and an object dynamic model corresponding to the object point cloud set is calculated. A bitstream is generated. The bitstream includes the global point cloud set, the global dynamic model corresponding to the global point cloud set, a serial number of each object point in the reference object point cloud set, and the object dynamic model corresponding to the object point cloud set.

Abstract: A structure and a method of forming are provided. The structure includes a first dielectric layer overlying a first substrate. A first connection pad is disposed in a top surface of the first dielectric layer and contacts a first redistribution line. A first dummy pad is disposed in the top surface of the first dielectric layer, the first dummy pad contacting the first redistribution line. A second dielectric layer overlies a second substrate. A second connection pad and a second dummy pad are disposed in the top surface of the second dielectric layer, the second connection pad bonded to the first connection pad, and the first dummy pad positioned in a manner that is offset from the second dummy pad so that the first dummy pad and the second dummy pad do not contact each other.

Abstract: A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.

Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: A wide angle optical lens assembly includes a first lens group and a second lens group arranged in order from an object side to an image plane along an optical axis, satisfying the following condition: 2.0?|F1/EFL|?3.65; 2.6?|F2/EFL|?3.45; wherein, EFL is effective focal length of the wide angle optical lens assembly; F1 is effective focal length of the first lens group; F2 is effective focal length of the second lens group. The first lens group includes a first lens having negative refractive power, a second lens having negative refractive power, and a third lens having positive refractive power arranged in order from the object side. The second lens is a meniscus lens, having a convex image-side surface. The second lens group includes a fourth lens having positive refractive power, a fifth lens having negative refractive power, and a sixth lens having positive refractive power arranged in order from the object side.

Abstract: A wide angle lens assembly having low distortion including, in order from an object side to an image plane, a first lens, which is of a meniscus shape having an object side surface being convex and an image side surface being concave, having negative refractive power; a second lens having positive refractive power; a third lens having positive refractive power, and a fourth lens having negative refractive power; the wide angle lens assembly satisfies the following condition: ?0.6<f34/f12<?0.4; wherein f12 is a composite focal length of the first lens and the second lens, and f34 is a composite focal length of the third lens and the fourth lens.

Abstract: A wide angle lens assembly having low distortion including, in order from an object side to an image plane, a first lens, which is of a meniscus shape having an object side surface being convex and an image side surface being concave, having negative refractive power; a second lens having positive refractive power; a third lens having positive refractive power, and a fourth lens having negative refractive power; the wide angle lens assembly satisfies the following condition: ?0.6<f34/f12<?0.4; wherein f12 is a composite focal length of the first lens and the second lens, and f34 is a composite focal length of the third lens and the fourth lens.