Patents by Inventor Sheng-Ming Chang
Sheng-Ming Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160143140Abstract: A printed circuit board includes a laminated core including at least an internal conductive layer, and a build-up layer on the laminated core. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area that is comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.Type: ApplicationFiled: September 22, 2015Publication date: May 19, 2016Inventors: Sheng-Ming Chang, Chia-Hui Liu, Shih-Chieh Lin, Chun-Ping Chen
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Patent number: 9331054Abstract: A semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first device-attach surface of the first semiconductor package. The second package includes a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface. A dynamic random access memory (DRAM) device is mounted on the second device-attach surface. A decoupling capacitor is mounted on the second device-attach surface. Conductive structures are disposed on the second bump-attach surface of the second package, connecting to the first bump-attach surface of the first body of the first semiconductor package.Type: GrantFiled: February 25, 2014Date of Patent: May 3, 2016Assignee: MEDIATEK INC.Inventors: Sheng-Ming Chang, Tung-Hsien Hsieh, Nan-Cheng Chen
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Publication number: 20160051105Abstract: The present disclosure illustrates a spray nozzle having a brush. The spray nozzle includes a main body which has a flow channel disposed therein. The main body includes a first end and a second end. The flow channel has at least one inlet at the first end for inputting air flow, and multiple outlets at the second end for outputting the air flow. A brush part is disposed at the second end and has a plurality of brush hairs. According to such structure, the air flow is sprayed between the brush hairs, and the air flow and the brush hairs are cooperatively functioned to remove dust.Type: ApplicationFiled: April 7, 2015Publication date: February 25, 2016Inventor: SHENG MING CHANG
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Patent number: 9233403Abstract: A nozzle of dust blower is mainly a hollow tube with one open end connected to the dust blower and the other end a closed end. The wall near the closed end has several outlets on the same side toward a radial direction of the tube, so that the high-pressure air blown by the dust blower into the tube blows out of the outlets in the radial direction. Corresponding to each of the outlets, the tube has an auxiliary nozzle base. Each nozzle base has a passage connected to the corresponding outlet. The passage of each of the nozzle bases extends along the radial direction of the tube. The end of each of the nozzle bases near the tube has at least one inlet, so as to suck more air into the nozzle base as the air is blown out.Type: GrantFiled: May 10, 2013Date of Patent: January 12, 2016Assignee: Mei Thung Co., Ltd.Inventor: Sheng-Ming Chang
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Publication number: 20150342038Abstract: A printed circuit board for mobile platforms includes a core substrate having a first side, a ground plane covering on the first side, a first insulating layer covering the ground plane, and a plurality of first signal traces and a plurality of first ground traces, alternatively arranged on the first insulating layer, a second insulating layer connecting to the first insulating layer, and a plurality of second signal traces separated from each other, disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto, wherein coverage of the ground plane is corresponding to disposition of the first signal trace, the first ground trace, the second signal trace and the second ground trace.Type: ApplicationFiled: August 3, 2015Publication date: November 26, 2015Inventors: Sheng-Ming CHANG, Shih-Chieh LIN, Nan-Cheng CHEN
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Patent number: 9131602Abstract: The invention provides a printed circuit board for mobile platforms. An exemplary embodiment of the printed circuit board for mobile platforms includes a core substrate having a first side. A ground plane covers the first side. A first insulating layer covers the ground plane. A plurality of first signal traces and a plurality of first ground traces are alternatively arranged on the first insulating layer. A second insulating layer connects to the first insulating layer. A plurality of second signal traces separated from each other is disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto.Type: GrantFiled: January 23, 2013Date of Patent: September 8, 2015Assignee: MEDIATEK INC.Inventors: Sheng-Ming Chang, Shih-Chieh Lin, Nan-Cheng Chen
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Publication number: 20150074346Abstract: A memory module, comprising: a first pin, arranged to receive a first signal; a second pin, arranged to receive second signal; a first conducting path, having a first end coupled to the first pin; at least one memory chip, coupled to the first conducting path for receiving the first signal; a predetermined resistor, having a first terminal coupled to a second end of the first conducting path; and a second conducting path, having a first end coupled to second pin for conducting the second to a second terminal of the predetermined resistor; wherein the first signal and the second are synchronous and configured to be a differential signal, for enabling a selected memory chip from the at least one memory chip to be accessed.Type: ApplicationFiled: July 6, 2014Publication date: March 12, 2015Inventors: Yan-Bin Luo, Sheng-Ming Chang, Bo-Wei Hsieh, Ming-Shi Liou, Chih-Chien Hung, Shang-Pin Chen
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Patent number: 8952718Abstract: A termination circuit for a plurality of memories controlled by a controller is provided. The termination circuit includes a plurality of drivers, a plurality of resistors and a plurality of capacitors. Each of the drivers is coupled to the memories via a transmission line. Each of the resistors is coupled to the corresponding driver via the corresponding transmission line. Each of the capacitors is coupled between the corresponding resistor and a reference voltage. The controller is coupled to the memories via the drivers, and the controller provides a specific code to one of the drivers when a quantity of logic “0” and a quantity of logic “1” transmitted to the memories via the transmission line corresponding to the one of the drivers are unbalanced, so as to adjust a termination voltage of the capacitor corresponding to the one of the drivers.Type: GrantFiled: August 10, 2012Date of Patent: February 10, 2015Assignee: Mediatek Inc.Inventors: Yan-Bin Luo, Sheng-Ming Chang, Bo-Wei Hsieh, Ming-Shi Liou, Chih-Chien Hung, Shang-Ping Chen
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Publication number: 20140331447Abstract: A nozzle of dust blower is mainly a hollow tube with one open end connected to the dust blower and the other end a closed end. The wall near the closed end has several outlets on the same side toward a radial direction of the tube, so that the high-pressure air blown by the dust blower into the tube blows out of the outlets in the radial direction. Corresponding to each of the outlets, the tube has an auxiliary nozzle base. Each nozzle base has a passage connected to the corresponding outlet. The passage of each of the nozzle bases extends along the radial direction of the tube. The end of each of the nozzle bases near the tube has at least one inlet, so as to suck more air into the nozzle base as the air is blown out.Type: ApplicationFiled: May 10, 2013Publication date: November 13, 2014Applicant: MEI THUNG CO., LTD.Inventor: SHENG-MING CHANG
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Publication number: 20140264812Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first device-attach surface of the first semiconductor package. The second package includes a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface. A dynamic random access memory (DRAM) device is mounted on the second device-attach surface. A decoupling capacitor is mounted on the second device-attach surface. Conductive structures are disposed on the second bump-attach surface of the second package, connecting to the first bump-attach surface of the first body of the first semiconductor package.Type: ApplicationFiled: February 25, 2014Publication date: September 18, 2014Applicant: MediaTek Inc.Inventors: Sheng-Ming CHANG, Tung-Hsien HSIEH, Nan-Cheng CHEN
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Patent number: 8595504Abstract: A method for authenticating a message in a network is provided. The method includes a step of generating, in a sink device, a private key and a public key. The private key includes a plurality of sub-private keys. The method further includes a step of generating, in the sink device, a signature for the message. The signature includes a sub-private key and an authentication path associated with the sub-private key in a hash tree. The hash tree is constructed during the generation of the sub-public keys.Type: GrantFiled: August 12, 2008Date of Patent: November 26, 2013Assignee: Industrial Technology Research InstituteInventors: Shih-I Huang, Shiuh-Pyng Shieh, Sheng-Ming Chang, Chi-Wei Wang
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Patent number: 8525310Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.Type: GrantFiled: April 12, 2011Date of Patent: September 3, 2013Assignee: Mediatek Inc.Inventors: Nan-Jang Chen, Chun-Wei Chang, Sheng-Ming Chang, Che-Yuan Jao, Ching-Chih Li, Nan-Cheng Chen
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Publication number: 20130113516Abstract: A termination circuit for a plurality of memories controlled by a controller is provided. The termination circuit includes a plurality of drivers, a plurality of resistors and a plurality of capacitors. Each of the drivers is coupled to the memories via a transmission line. Each of the resistors is coupled to the corresponding driver via the corresponding transmission line. Each of the capacitors is coupled between the corresponding resistor and a reference voltage. The controller is coupled to the memories via the drivers, and the controller provides a specific code to one of the drivers when a quantity of logic “0” and a quantity of logic “1” transmitted to the memories via the transmission line corresponding to the one of the drivers are unbalanced, so as to adjust a termination voltage of the capacitor corresponding to the one of the drivers.Type: ApplicationFiled: August 10, 2012Publication date: May 9, 2013Applicant: MEDIATEK INC.Inventors: Yan-Bin LUO, Sheng-Ming CHANG, Bo-Wei HSIEH, Ming-Shi LIOU, Chih-Chien HUNG, Shang-Ping CHEN
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Patent number: 8258615Abstract: The present invention provides a semiconductor device capable of eliminating voltage (IR) drop of a semiconductor die inside the semiconductor device and a fabricating method of the semiconductor device. The semiconductor device comprises the semiconductor die, and the semiconductor die comprises a first surface area, a plurality of first pads potentially equivalent to each other, a passivation layer, a plurality of first openings, and a first conducting medium layer. The passivation layer is disposed on the plurality of first pads. The plurality of first openings is formed on the passivation layer, and utilized for exposing the plurality of first pads. The first conducting medium layer is formed on the first surface area, and utilized for fulfilling the plurality of first openings to connect the plurality of first pads.Type: GrantFiled: February 20, 2009Date of Patent: September 4, 2012Assignee: Mediatek Inc.Inventors: Sheng-Ming Chang, Che-Yuan Jao, Ching-Chih Li
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Publication number: 20110248394Abstract: A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.Type: ApplicationFiled: April 12, 2011Publication date: October 13, 2011Inventors: Nan-Jang Chen, Chun-Wei Chang, Sheng-Ming Chang, Che-Yuan Jao, Ching-Chih Li, Nan-Cheng Chen
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Publication number: 20110241206Abstract: A semiconductor device is provided by the present invention. The semiconductor device includes a first semiconductor die comprising at least a first bond pad; and a second semiconductor die comprising at least a second bond pad with voltage level equivalent to the first bond pad of the first semiconductor die; wherein the first bond pad of the first semiconductor die is electrically connected to the second bond pad of the second semiconductor die via at least a bond wire. The semiconductor device of the present invention is capable of solving the IR drop of the semiconductor die with low cost.Type: ApplicationFiled: June 21, 2011Publication date: October 6, 2011Inventors: Che-Yuan Jao, Sheng-Ming Chang
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Patent number: 7880297Abstract: A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces are formed in a level of the metal interconnection; a passivation layer disposed over the two metal traces, wherein two openings are formed in the passivation layer to expose portions of the two metal traces; a conductive member externally mounted on the passivation layer between the two openings; and a redistribution layer formed over the conductive member.Type: GrantFiled: May 8, 2008Date of Patent: February 1, 2011Assignee: Mediatek Inc.Inventors: Che-Yuan Jao, Sheng-Ming Chang, Ching-Chih Li
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Patent number: 7880094Abstract: A positive differential signal trace and a negative differential signal trace are formed on different layers of a printed circuit board. A first ground trace is formed on the layer on which the positive differential signal trace is formed, and a second ground trace is formed on the layer on which the negative differential signal trace is formed. An insulation layer is positioned between the two layers and has a predetermined thickness. A differential mode impedance and a common mode impedance of differential signals are dependent on the predetermined thickness of the insulation layer, width and thickness of each differential signal trace, and a space between each differential signal trace and the corresponding ground trace formed on the same layer.Type: GrantFiled: April 26, 2007Date of Patent: February 1, 2011Assignee: ASUSTeK Computer Inc.Inventors: Cheng-Jan Chi, Wen-Cheng Ko, Sheng-Ming Chang, Chih-Wei Tsai
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Publication number: 20100171211Abstract: A semiconductor device is provided by the present invention. The semiconductor device includes a semiconductor die, and the semiconductor die includes a die core having at least two bond pads with voltage level equivalent to each other and electrically connected to each other via at least a bond wire, and an input/output (I/O) periphery. The semiconductor device of the present invention is capable of solving the IR drop of the semiconductor die with low cost.Type: ApplicationFiled: January 7, 2009Publication date: July 8, 2010Inventors: Che-Yuan Jao, Sheng-Ming Chang
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Publication number: 20100042842Abstract: A method for authenticating a message in a network is provided. The method includes a step of generating, in a sink device, a private key and a public key. The private key includes a plurality of sub-private keys. The method further includes a step of generating, in the sink device, a signature for the message. The signature includes a sub-private key and an authentication path associated with the sub-private key in a hash tree. The hash tree is constructed during the generation of the sub-public keys.Type: ApplicationFiled: August 12, 2008Publication date: February 18, 2010Inventors: Shih-I Huang, Shiuh-Pyng Shieh, Sheng-Ming Chang, Chi-Wei Wang