Patents by Inventor Sheng-Ming Wu

Sheng-Ming Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237228
    Abstract: An improved work function layer and a method of forming the same are disclosed. In an embodiment, the method includes forming a semiconductor fin extending from a substrate; depositing a dielectric layer over the semiconductor fin; depositing a first work function layer over the dielectric layer; and exposing the first work function layer to a metastable plasma of a first reaction gas, a metastable plasma of a generation gas, and a metastable plasma of a second reaction gas, the first reaction gas being different from the second reaction gas.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shao-Jyun Wu, Hung-Chi Wu, Chia-Ching Lee, Pin-Hsuan Yeh, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen, Sheng-Liang Pan, Huan-Just Lin
  • Patent number: 12211741
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.
    Type: Grant
    Filed: November 10, 2023
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hui Huang, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li
  • Patent number: 12205855
    Abstract: The present disclosure relates to a method and an associated process tool. The method includes generating electromagnetic radiation that is directed toward a perimeter of a pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the pair of bonded workpieces. The electromagnetic radiation is scanned along a vertical axis. An intensity of the electromagnetic radiation that impinges on the radiation sensor is measured throughout the scanning. Measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different positions along the vertical axis extending past top and bottom surfaces of the pair of bonded workpieces. A position of an interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: January 21, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hau-Yi Hsiao, Kuo-Ming Wu, Chun Liang Chen, Sheng-Chau Chen
  • Publication number: 20140097540
    Abstract: A semiconductor structure includes a silicon substrate, a titanium layer, a nickel layer, a silver layer and a metallic adhesion layer, wherein the silicon substrate comprises a back surface, and the titanium layer comprises an upper surface. The titanium layer is formed on the back surface, the nickel layer is formed on the upper surface, the silver layer is formed on the nickel layer, and the metallic adhesion layer is formed between the nickel layer and the silver layer.
    Type: Application
    Filed: November 15, 2012
    Publication date: April 10, 2014
    Applicant: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Hsiang-Chin Chiu, Sheng-Ming Wu, Kuang-Hao Yang, Kung-An Lin, Chen-Yu Wang
  • Publication number: 20030048175
    Abstract: This invention represents a portable biometric verification and storage device. The portable device performs the biometric characteristics recognition or verification for providing high security of personal identification by collating digital Biometric Identification Record (BIR) stored in the device and personal activated biometric characteristics. The Biometric Identification Record (BIR) includes a memory for storing at least one or more personal biometric characteristics database and for storing at least one or more ID of each person and personal information in a portable biometric verification and storage device.
    Type: Application
    Filed: September 7, 2001
    Publication date: March 13, 2003
    Inventors: Po-Tong Wang, Sheng-Ming Wu
  • Publication number: 20030048904
    Abstract: This invention represents a Web-based biometric authorization apparatus. The present invention relates to live biometric characteristics which are captured by a biometric capture device and, in particular, to the Biometric Identification Record (BIR) and personal information which are stored in a digitized data storage apparatus. It is therefore an object of the present invention to provide the further data process which includes compression and decompression function, encryption and decryption function, and to provide the BIR process which relates to calculation, collation and verification as a secured mechanism. The apparatus is operatively coupled to a remote site so as to establish an Internet communication link through wired or wireless communications. Therefore, the biometric verification is performed with peripheral devices such as POS terminals, ATM terminals, credit card reader, access control or other control mechanism.
    Type: Application
    Filed: September 7, 2001
    Publication date: March 13, 2003
    Inventors: Po-Tong Wang, Sheng-Ming Wu
  • Publication number: 20020163421
    Abstract: This invention represents a method of bank card and credit card with fingerprint authentication for identifying whether a user is a registered owner of the card. The reference fingerprint data will be digitized and stored in an IC chip or stored on a magnetic strip of a bank card and a credit card. Therefore, this invention can identify the correct user of the bank card or the credit card by collating the measured fingerprint data with the reference fingerprint data via a fingerprint ATM terminal or a fingerprint reading device of the credit card. It could prevent the illegal use of these cards and heavy financial problems of issuing banks.
    Type: Application
    Filed: May 7, 2001
    Publication date: November 7, 2002
    Inventors: Po-Tong Wang, Sheng-Ming Wu