Abstract: A semiconductor testing apparatus is provided, and includes a base, a conductive socket, a pusher, and a thermal interface material structure. The conductive socket is disposed in the base for containing a semiconductor structure. The pusher is over the conductive socket and movable in a vertical direction. The thermal interface material structure is connected to the pusher, and includes a resilient material and a metal film around the resilient material. The metal film and the resilient material are in contact with the pusher.

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Abstract: A method for estimating operation parameters of a servomotor is described. The method includes the steps of: driving the servomotor to rotate stably at an initial angular velocity; computing d- and q-axis components of an initial voltage when the servomotor rotates at the initial angular velocity; accelerating the servomotor to a predetermined angular velocity according to the initial voltage; and computing at least one operation parameter of the servomotor after the servomotor rotates at the predetermined angular velocity.

Abstract: A method for estimating operation parameters of a servomotor is described. The method includes the steps of: driving the servomotor to rotate stably at an initial angular velocity; computing d- and q-axis components of an initial voltage when the servomotor rotates at the initial angular velocity; accelerating the servomotor to a predetermined angular velocity according to the initial voltage; and computing at least one operation parameter of the servomotor after the servomotor rotates at the predetermined angular velocity.

Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

Abstract: A method for suppression of vibration includes: adjusting a center frequency of a band-pass filter, and subjecting a to-be-detected signal to processing by the band-pass filter to result in a bandpass-filtered signal; performing signal processing upon the bandpass-filtered signal to obtain a converted result; determining whether a scanning process is completed, and repeating the previous two steps when a result is negative to obtain plural converted results; determining a maximum value among the converted results, and determining the corresponding center frequency to serve as an interference frequency; and setting the interference frequency as an operating frequency of a notch filter.

Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

Abstract: A method for suppression of vibration includes: adjusting a center frequency of a band-pass filter, and subjecting a to-be-detected signal to processing by the band-pass filter to result in a bandpass-filtered signal; performing signal processing upon the bandpass-filtered signal to obtain a converted result; determining whether a scanning process is completed, and repeating the previous two steps when a result is negative to obtain plural converted results; determining a maximum value among the converted results, and determining the corresponding center frequency to serve as an interference frequency; and setting the interference frequency as an operating frequency of a notch filter.

Abstract: A controller for a motor having at least one stator phase and a method for controlling the motor, the controller including a drive signal generator for producing an electrical drive signal in the stator phase, the drive signal resulting in a current flow in the stator phase such that the current flow varies in response to varying load conditions for the motor, a current sensor for monitoring the current flow in the stator phase, an error detector for producing an error signal related to changes in the current flow, and a manipulation circuit electrically connected to the error detector and to the drive signal generator for changing the electrical stimulus in response to the error detector.