Patents by Inventor Sheng-Mou LIN
Sheng-Mou LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240079787Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.Type: ApplicationFiled: August 14, 2023Publication date: March 7, 2024Applicant: MEDIATEK INC.Inventors: Debapratim Dhara, Shih-Chia Chiu, Yen-Ju Lu, Sheng-Mou Lin
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Publication number: 20240038443Abstract: A semiconductor device includes a substrate; a first terminal and a second terminal; and a conductor arranged on the substrate between the first terminal and the second terminal to constitute an inductor shaped for forming a first loop and a second loop arranged side-by-side along a first direction. A crossing of the conductor with itself is present between the first loop and the second loop. The first loop and the second loop define a first enclosed area and a second enclosed area, respectively. At least one ground bar traverses either the first loop or the second loop.Type: ApplicationFiled: July 3, 2023Publication date: February 1, 2024Applicant: MEDIATEK INC.Inventors: Hsin-Yu Hung, Ruey-Bo Sun, Sheng-Mou Lin
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Publication number: 20240038690Abstract: A semiconductor device includes an electronic device, a guard trace and a first trace. The guard trace is connecting to a ground layer through a first ground via. The first trace is disposed adjacent to the electronic device and the guard trace and includes a first segment. A phase or a direction of a first current signal conducted on the first trace is changed in the first segment. The electronic device and the first trace are disposed at different sides of the guard trace and the first ground via is beside the first segment.Type: ApplicationFiled: June 19, 2023Publication date: February 1, 2024Applicant: MEDIATEK INC.Inventors: Po-Jui Li, Ruey-Bo Sun, Yen-Ju Lu, Chun-Yuan Yeh, Sheng-Mou Lin
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Patent number: 11764475Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.Type: GrantFiled: August 24, 2021Date of Patent: September 19, 2023Assignee: MEDIATEK INC.Inventors: Debapratim Dhara, Shih-Chia Chiu, Yen-Ju Lu, Sheng-Mou Lin
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Publication number: 20230253390Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a first system-on-chip (SOC) die, a conductive routing and a first shielding film. The first SOC die is disposed on the base. The first SOC die has a front surface and a back surface. The first SOC die includes a first inductor close to the front surface. The conductive routing is disposed on the back surface of the first SOC die. The first shielding film is disposed between the first SOC die and the conductive routing. The first shielding film covers the back surface of the first SOC die and fully overlaps the first inductor.Type: ApplicationFiled: January 13, 2023Publication date: August 10, 2023Inventors: Ruey-Bo SUN, Chih-Chun HSU, Sheng-Mou LIN
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Publication number: 20230014046Abstract: According to an embodiment of the invention, a semiconductor device comprises a substrate, a semiconductor die and a first shielding structure. The semiconductor die is disposed on the substrate and comprises an electronic device. The first shielding structure is formed outside of the semiconductor die and disposed under the electronic device.Type: ApplicationFiled: June 24, 2022Publication date: January 19, 2023Applicant: MEDIATEK INC.Inventors: Ruey-Bo Sun, Sheng-Mou Lin
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Publication number: 20220102859Abstract: An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.Type: ApplicationFiled: August 24, 2021Publication date: March 31, 2022Applicant: MEDIATEK INC.Inventors: Debapratim Dhara, Shih-Chia Chiu, Yen-Ju Lu, Sheng-Mou Lin
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Patent number: 10910323Abstract: The present disclosure provides a semiconductor package including a bottom package having a substrate, a radio-frequency (RF) die and a system-on-a-chip (SoC) die arranged on the substrate in a side-by-side manner, a molding compound covering the RF die and the SoC die, and an interposer over the molding compound. Connection elements and a column of signal interference shielding elements are disposed on the substrate. The connection elements surround the SoC die. The column of signal interference shielding elements is interposed between the RF die and the SoC die. A top package is mounted on the interposer.Type: GrantFiled: August 7, 2019Date of Patent: February 2, 2021Assignee: MEDIATEK INC.Inventors: Sheng-Mou Lin, Wen-Chou Wu, Hsing-Chih Liu
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Patent number: 10679949Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate having a first pad and a second pad thereon. A logic die is mounted on the substrate. The logic die includes a first logic die pad coupled to the first pad. A memory die is mounted on the substrate. The memory die includes a first memory die pad. A first redistribution layer (RDL) trace has a first terminal and a second terminal. The first terminal is coupled to the first pad through the first memory die pad. The second terminal is coupled to the second pad rather than the first pad.Type: GrantFiled: January 20, 2017Date of Patent: June 9, 2020Assignee: MediaTek Inc.Inventors: Sheng-Mou Lin, Duen-Yi Ho
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Publication number: 20200058633Abstract: The present disclosure provides a semiconductor package including a bottom package having a substrate, a radio-frequency (RF) die and a system-on-a-chip (SoC) die arranged on the substrate in a side-by-side manner, a molding compound covering the RF die and the SoC die, and an interposer over the molding compound. Connection elements and a column of signal interference shielding elements are disposed on the substrate. The connection elements surround the SoC die. The column of signal interference shielding elements is interposed between the RF die and the SoC die. A top package is mounted on the interposer.Type: ApplicationFiled: August 7, 2019Publication date: February 20, 2020Inventors: Sheng-Mou Lin, Wen-Chou Wu, Hsing-Chih Liu
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Publication number: 20200051927Abstract: A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.Type: ApplicationFiled: August 13, 2019Publication date: February 13, 2020Applicant: MediaTek Inc.Inventors: Yi-Chieh Lin, Sheng-Mou Lin, Wen-Chou Wu
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Publication number: 20200051925Abstract: A semiconductor device includes a first layer structure, a first layer structure, a second layer structure and a passive electronic component. The second layer structure is disposed below the first layer structure and coupled to a ground. The conductive structure is coupled to the first layer structure. The conductive structure is installed vertically between the first layer structure and the second layer structure, and is coupled to a first pad of the second layer structure. The passive electronic component comprises a first terminal coupled to the first pad of the second layer structure and a second terminal coupled to a second pad of the second layer structure. The conductive structure and the passive electronic component are connected in series between the first layer structure and the ground to form a conductive path for conducting at least one electromagnetic interference signal to the ground.Type: ApplicationFiled: July 30, 2019Publication date: February 13, 2020Applicant: MediaTek Inc.Inventors: Yi-Chieh Lin, Sheng-Mou Lin, Wen-Chou Wu
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Patent number: 10446508Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a package substrate. An integrated circuit (IC) die having a radio frequency (RF) circuit and a memory die are stacked over the package substrate. The memory die entirely covers a first surface portion of the package substrate to define a second surface portion of the package substrate exposed from the memory die, and the IC die partially covers the first surface portion and the second surface portion of the package substrate. The RF circuit includes a first sensitive device region corresponding to the second surface portion of the package substrate and a second sensitive device region corresponding to the first surface portion of the package substrate and offsetting a memory input/output (I/O) electrical path of the memory die, as viewed from a top-view perspective.Type: GrantFiled: August 22, 2017Date of Patent: October 15, 2019Assignee: MEDIATEK INC.Inventors: Sheng-Mou Lin, Chih-Chun Hsu, Wen-Chou Wu
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Patent number: 10340235Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region, a semiconductor die disposed on the package substrate in the first region, a conductive shielding element disposed on the package substrate and covering the semiconductor die, and a three-dimensional (3D) antenna. The 3D antenna includes a planar structure portion disposed on the package substrate in the second region, and a bridge structure portion above the planar structure portion and connected thereto.Type: GrantFiled: December 14, 2017Date of Patent: July 2, 2019Assignee: MEDIATEK INC.Inventors: Chih-Chun Hsu, Sheng-Mou Lin
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Patent number: 10068857Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.Type: GrantFiled: October 26, 2017Date of Patent: September 4, 2018Assignee: MEDIATEK INC.Inventors: Ruey-Bo Sun, Sheng-Mou Lin, Wen-Chou Wu
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Publication number: 20180122747Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.Type: ApplicationFiled: October 26, 2017Publication date: May 3, 2018Inventors: Ruey-Bo Sun, Sheng-Mou Lin, Wen-Chou Wu
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Publication number: 20180108624Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region, a semiconductor die disposed on the package substrate in the first region, a conductive shielding element disposed on the package substrate and covering the semiconductor die, and a three-dimensional (3D) antenna. The 3D antenna includes a planar structure portion disposed on the package substrate in the second region, and a bridge structure portion above the planar structure portion and connected thereto.Type: ApplicationFiled: December 14, 2017Publication date: April 19, 2018Inventors: Chih-Chun HSU, Sheng-Mou LIN
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Publication number: 20180061786Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a package substrate. An integrated circuit (IC) die having a radio frequency (RF) circuit and a memory die are stacked over the package substrate. The memory die entirely covers a first surface portion of the package substrate to define a second surface portion of the package substrate exposed from the memory die, and the IC die partially covers the first surface portion and the second surface portion of the package substrate. The RF circuit includes a first sensitive device region corresponding to the second surface portion of the package substrate and a second sensitive device region corresponding to the first surface portion of the package substrate and offsetting a memory input/output (I/O) electrical path of the memory die, as viewed from a top-view perspective.Type: ApplicationFiled: August 22, 2017Publication date: March 1, 2018Inventors: Sheng-Mou LIN, Chih-Chun HSU, Wen-Chou WU
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Patent number: 9881882Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region. A semiconductor die is disposed on the package substrate in the first region. A three-dimensional (3D) antenna is disposed on the package substrate in the second region. The 3D antenna includes a planar structure portion and a bridge or wall structure portion. A molding compound encapsulates the semiconductor die and at least a portion of the 3D antenna. A conductive shielding element is inside the molding compound or partially covers the molding compound. A semiconductor package assembly having the semiconductor package is also provided.Type: GrantFiled: October 26, 2016Date of Patent: January 30, 2018Assignee: MEDIATEK INC.Inventors: Chih-Chun Hsu, Sheng-Mou Lin
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Publication number: 20170263570Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate having a first pad and a second pad thereon. A logic die is mounted on the substrate. The logic die includes a first logic die pad coupled to the first pad. A memory die is mounted on the substrate. The memory die includes a first memory die pad. A first redistribution layer (RDL) trace has a first terminal and a second terminal. The first terminal is coupled to the first pad through the first memory die pad. The second terminal is coupled to the second pad rather than the first pad.Type: ApplicationFiled: January 20, 2017Publication date: September 14, 2017Inventors: Sheng-Mou LIN, Duen-Yi HO