Patents by Inventor Sheng-Nan Wang

Sheng-Nan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10868538
    Abstract: A logic cell structure includes: a first portion, with a first height, arranged to be a first layout of a first semiconductor element; a second portion, with the first height, arranged to be a second layout of a second semiconductor element, wherein the first portion is separated from the second portion; and a third portion arranged to be a third layout of an interconnecting path used for coupling the first semiconductor element and the second semiconductor element.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Shao-Huan Wang, Chun-Chen Chen, Sheng-Hsiung Chen, Kuo-Nan Yang
  • Publication number: 20200243582
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate having a front surface and a back surface facing opposite to the front surface; a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate, the filling material including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and an epitaxial layer lined between the lower portion of the filling material and the semiconductor substrate. An associated manufacturing method is also disclosed.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 30, 2020
    Inventors: SHENG-CHAN LI, I-NAN CHEN, TZU-HSIANG CHEN, YU-JEN WANG, YEN-TING CHIANG, CHENG-HSIEN CHOU, CHENG-YUAN TSAI
  • Patent number: 10658409
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate having a front surface and a back surface facing opposite to the front surface; a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate, the filling material including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and an epitaxial layer lined between the lower portion of the filling material and the semiconductor substrate. An associated manufacturing method is also disclosed.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: May 19, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. U.
    Inventors: Sheng-Chan Li, I-Nan Chen, Tzu-Hsiang Chen, Yu-Jen Wang, Yen-Ting Chiang, Cheng-Hsien Chou, Cheng-Yuan Tsai
  • Publication number: 20200126967
    Abstract: An integrated circuit includes a cell layer, a first metal layer, a first conductive via, and a second conductive via. The cell layer includes first and second cells, in which the first cell is separated from the second cell by a non-zero distance. The first metal layer includes a first conductive feature and a second conductive feature, the first conductive feature overlaps the first cell and does not overlap the second cell, and the second conductive feature overlaps the second cell and does not overlap the first cell, in which the first conductive feature is aligned with the second conductive feature along lengthwise directions of the first and second conductive features. The first conductive via interconnects the cell layer and the first conductive feature of the first metal layer. The second conductive via interconnects the cell layer and the second conductive feature of the first metal layer.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fong-Yuan CHANG, Kuo-Nan YANG, Chung-Hsing WANG, Lee-Chung LU, Sheng-Fong CHEN, Po-Hsiang HUANG, Hiranmay BISWAS, Sheng-Hsiung CHEN, Aftab Alam KHAN
  • Publication number: 20200078478
    Abstract: A PSMA targeting peptide derivative for radiotherapy, which is a structural molecule developed for diagnosis or treatment of prostate cancer, as prostate-specific membrane antigen (PSMA) is a protein present on the surface of healthy prostate cells, which is often at a high level of expression on the surface of prostate cancer cells, and the molecular composition of PSMA inhibitor is mainly composed of glutamic acid, urea and lysine, in addition to the linker of the present invention, PSMA inhibitor can be combined with a chelating agent and truncated Evans Blue, which can be labeled with radionuclides Ga-67, Ga-68, In-111, Lu-177, Cu-64 or Y-90, used for image analysis and analysis of human prostate cancer tumor pattern as a new PSMA targeting peptide receptor radionuclide therapy (PRRT), and which has a longer half-life in vivo and is featured by specific binding of PSMA for radiotherapy diagnosis or treatment.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 12, 2020
    Inventors: Ming-Hsin Li, Ming-Wei Chen, Shin-Min Wang, Shih-Wei Lo, Chun-Fang Feng, Cheng-Hui Chuang, Sheng-Nan Lo
  • Patent number: 10515944
    Abstract: An integrated circuit includes a cell layer, a first metal layer, and a first conductive via. The cell layer includes first and second cells, each of which is configured to perform a circuit function. The first metal layer is above the cell layer and includes a first conductive feature that extends from the first cell into the second cell and that is configured to receive a supply voltage. A first conductive via interconnects the cell layer and the metal layer.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fong-Yuan Chang, Kuo-Nan Yang, Chung-Hsing Wang, Lee-Chung Lu, Sheng-Fong Chen, Po-Hsiang Huang, Hiranmay Biswas, Sheng-Hsiung Chen, Aftab Alam Khan
  • Publication number: 20190372427
    Abstract: A motor includes a rotor including a rotating shaft extending along a center axis, a cylindrical rotor core provided outside the rotating shaft in a radial direction, and two discoid weight plates provided at two ends of the cylindrical rotor core in an axial direction, and a stator opposing the rotor in the radial direction. A radius of each weight plate is smaller than a radius of the rotor core, and a difference between the radius of the rotor core and the radius of each weight plate is larger than an air gap between an outside of the rotor core in the radial direction and an inside of the stator in the radial direction.
    Type: Application
    Filed: February 19, 2018
    Publication date: December 5, 2019
    Applicant: Nidec Corporation
    Inventors: Hsin-Nan LIN, Guo-Jhih YAN, Sheng-Chan YEN, Yu-Wei HSU, Kuo-Min WANG, Cheng-Tsung LIU
  • Publication number: 20190348874
    Abstract: A rotor is located around an outer periphery of a rotation shaft of a motor and rotates together with the rotation shaft. The rotor includes magnetic steel plates laminated in an axial direction and including a through-hole group passing therethrough in the axial direction. The through-hole group includes through-holes each including, as a central line, an imaginary line extending in the radial direction and having an arcuate shape extending from the central line to both sides and radially outward. The through-holes are arranged in the radial direction. Among the through-holes, a radius of curvature of an arcuate radially inner side surface of the radially innermost through-hole is the smallest, and/or a radius of curvature of an arcuate radially outer side surface of the radially outermost through-hole is the largest.
    Type: Application
    Filed: February 19, 2018
    Publication date: November 14, 2019
    Applicant: Nidec Corporation
    Inventors: Sheng-Chan YEN, Yu-Wei HSU, Guo-Jhih YAN, Hsin-Nan LIN, Kuo-Min WANG, Cheng-Tsung LIU
  • Publication number: 20190157322
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate having a front surface and a back surface facing opposite to the front surface; a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate, the filling material including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and an epitaxial layer lined between the lower portion of the filling material and the semiconductor substrate. An associated manufacturing method is also disclosed.
    Type: Application
    Filed: February 23, 2018
    Publication date: May 23, 2019
    Inventors: SHENG-CHAN LI, I-NAN CHEN, TZU-HSIANG CHEN, YU-JEN WANG, YEN-TING CHIANG, CHENG-HSIEN CHOU, CHENG-YUAN TSAI
  • Publication number: 20190148352
    Abstract: An integrated circuit includes a cell layer, a first metal layer, and a first conductive via. The cell layer includes first and second cells, each of which is configured to perform a circuit function. The first metal layer is above the cell layer and includes a first conductive feature that extends from the first cell into the second cell and that is configured to receive a supply voltage. A first conductive via interconnects the cell layer and the metal layer.
    Type: Application
    Filed: September 5, 2018
    Publication date: May 16, 2019
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fong-Yuan CHANG, Kuo-Nan YANG, Chung-Hsing WANG, Lee-Chung LU, Sheng-Fong CHEN, Po-Hsiang HUANG, Hiranmay BISWAS, Sheng-Hsiung CHEN, Aftab Alam KHAN
  • Publication number: 20150277853
    Abstract: An audio file processing method and player are provided. The audio file processing method includes: reading at least one audio file from a Blu-ray disc via a player, compressing the at least one audio file to generate at least one compressed audio file, and storing the at least one compressed audio file in a system cache of the player. According to the above method, the usage of the system cache is reduced when playing audio files from high definition disc and the cost is reduced accordingly.
    Type: Application
    Filed: March 31, 2015
    Publication date: October 1, 2015
    Inventors: Xueping LI, Sheng-Nan WANG
  • Publication number: 20120069144
    Abstract: A method for performing display management regarding a three-dimensional (3-D) video stream is provided, where the 3-D video stream includes a plurality of sub-streams respectively corresponding to two eyes of a user. The method includes: dynamically detecting whether video information corresponding to all of the sub-streams is displayable; and when it is detected that video information corresponding to a first sub-stream of the sub-streams is not displayable, temporarily utilizing video information corresponding to a second sub-stream of the sub-streams to emulate the video information corresponding to the first sub-stream. An associated video display system is also provided.
    Type: Application
    Filed: September 20, 2010
    Publication date: March 22, 2012
    Inventors: Geng Li, Sheng-Nan Wang