Abstract: Disclosed is a process for producing hexafluoro-2-butyne comprising, reacting HCFC-336 with an aqueous solution of an alkali metal hydroxide in the presence of a quaternary alkylammonium salt which comprises at least one alkyl group of at least 8 carbons, and recovering the hexafluoro-2-butyne, wherein the conversion of dichloro-1,1,1,4,4,4-hexafluorobutane is at least 50% per hour. Also disclosed is a process for producing hexafluoro-2-butyne comprising, reacting HCFC-336 with an aqueous solution of an alkali metal hydroxide in the presence of a quaternary alkylammonium salt having alkyl groups of from four to ten carbon atoms, and mixtures thereof, and a non-ionic surfactant, and recovering the hexafluoro-2-butyne, and wherein the conversion of dichloro-1,1,1,4,4,4-hexafluorobutane to hexafluoro-2-butyne is at least 20% per hour.

Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.

Abstract: Methods of producing nanowires and resulting nanowires are described. In one implementation, a method of producing nanowires includes irradiating (i) a metal-containing reagent; (ii) a templating agent; (iii) a reducing agent; and (iv) a seed-promoting agent (SPA) in a reaction medium and under a condition of an elevated pressure above atmospheric pressure to produce nanowires.

Abstract: A timing recovery apparatus for compensating a sampling frequency offset of an input signal is provided. The timing recovery apparatus includes a timing error corrector configured to generate an output signal according to the input signal and a calibration signal, a gain controller configured to adjust at least one of a signal edge low-frequency error component and a signal edge high-frequency error component of the output signal and accordingly generate an adjusted signal, a timing error detector configured to generate an error signal according to the adjusted signal, and a calibration signal generator coupled to the timing error detector and the timing error corrector, for generating the calibration signal according to the error signal and outputting the calibration signal to the timing error corrector to compensate the sampling frequency offset of the input signal.

Abstract: A magnetic connection structure, includes a ring-shape magnetic sleeve body, made of mixed magnetic iron powder and plastic by means of ejection-to-mode; and a plastic fastener, provided in an arc-shape opening on both sides of the ring-shape magnetic sleeve body, for fastening a faucet seat or an ejection head. In the magnetic connection structure, the magnetic sleeve body and the plastic fastener are formed by means of ejection-to-mode separately. The magnetic sleeve body is formed by ejection-to-mode using magnetic iron powder and plastic mixed at a certain ratio; while the magnetic fastener is formed by means of ejection-to-mode separately. Then, the magnetic sleeve body and the plastic fastener are fastened together, to achieve said magnetic connection structure, that is low in production cost and easy to install. In case the plastic fastener is damaged, it can be replaced readily.

Abstract: A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting.

Abstract: A foam soap dispenser capable of adjusting the amount of air includes a pump, piston rod, a valve seat sheathed on the piston rod, a feed pipe coupled to the pump, a feed check valve for feeding a foam soap and a discharge check valve installed in the pump, an air-liquid mixing chamber formed between the feed check valve and the discharge check valve, an air-intake pipe communicated with an air-liquid mixing chamber, and an air-intake hole formed on the air-intake pipe that connects the air-liquid mixing chamber. The air-intake pipe includes an air-intake check valve, a screw sleeve and an air adjusting screw rod. The screw sleeve is fixed to the air-intake pipe, and the air adjusting screw rod is fixed into the screw sleeve and passed through a through hole of the screw rod of the check valve to insert the screw rod into the air-intake hole.

Abstract: A foam soap dispenser includes a cylindrical external casing having two ports, a first check valve installed at a liquid soap inlet end of the external casing, an inner tube installed at a liquid soap outlet end of the external casing, a second check valve fixed to an inner end of the inner tube, a slide plug installed between the inner end of the inner tube and an inner wall of the external casing and slidable with the inner tube along the inner wall of external casing, a gap formed between the slide plug and the inner tube and covered by a soft edge of the second check valve, a vent hole formed at the external casing, and a chamber formed between the two check valves and communicated with outside air when the soft edge of the second check valve is not covered onto the gap.

Abstract: A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads. The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly.

Abstract: An antenna element employable singularly or in an array and configured for concurrent RF transmission and receipt on a plurality of frequencies concurrently. The element is formed of conductive material on a substrate by a pair of substantially identical horns extending in opposite directions to distal tips. A cavity formed between the horns narrows to a narrowest point prior to curving. The element is capable of wideband RF communication on any frequency between a low frequency defined by the distance between the distal tips to a highest frequency defined by the narrowest point of the cavity. The antenna is especially well adapted for portable devices such as smartphones where concurrent cellular, Wi-Fi, and bluetooth communications may be accomplished with a single element.

Abstract: A memory device and a manufacturing method of the same are provided. The memory device includes a substrate, a memory material layer, a first dielectric layer, a first gate layer, a second gate layer, and a source/drain (S/D) region. The substrate has a trench, and the memory material layer is formed on a sidewall of the trench. The first gate layer, the second gate layer, and the first dielectric layer, which is formed between the first gate layer and the second gate layer, are filled in the trench. The source/drain region is formed in the substrate and adjacent to the memory material layer. The first gate layer is extended in a direction perpendicular to a direction in which the source/drain region is extended.

Abstract: A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.

Abstract: Methods of producing nanowires and resulting nanowires are described. In one implementation, a method of producing nanowires includes energizing (i) a metal-containing reagent; (ii) a templating agent; (iii) a reducing agent; and (iv) a seed-promoting agent (SPA) in a reaction medium and under conditions of a first temperature for at least a portion of a first duration, followed by a second temperature for at least a portion of a second duration, and the second temperature is different from the first temperature.

Abstract: A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive.

Abstract: The present invention is directed to a process for preparation of fluorinated alcohols of Formula (I) RfCH2CH2OH??(I) by contacting a fluorinated iodide with an alkyl vinyl ether in the presence of an initiator and a base to generate an intermediate hemi-acetal or aldehyde or a mixture thereof, followed by hydrogenation of the hemi-acetal of Formula (II) RfCH2CH(OCxH2x+1)m(OH)p??(II) or aldehyde of Formula (III) RfCH2CHO??(III) or a mixture thereof, to yield a compound of Formula (I).

Abstract: An instance of an existing data system has one or more processes. Each process has corresponding metadata. Metadata for a given process is accessed and a diagram of the process is automatically generated.

Abstract: A memory device and a manufacturing method of the same are provided. The memory device includes a substrate, a memory material layer, a first dielectric layer, a first gate layer, a second gate layer, and a source/drain (S/D) region. The substrate has a trench, and the memory material layer is formed on a sidewall of the trench. The first gate layer, the second gate layer, and the first dielectric layer, which is formed between the first gate layer and the second gate layer, are filled in the trench. The source/drain region is formed in the substrate and adjacent to the memory material layer. The first gate layer is extended in a direction perpendicular to a direction in which the source/drain region is extended.

Abstract: Diagnostic data is received at a multi-tenant data center. The diagnostic data is from a data system instance and the multi-tenant data center hosts data from a plurality of organizations. The diagnostic data is stored at the multi-tenant data center and a rules engine runs on the diagnostic data and provides optimization recommendations for the instance of the data system to which the diagnostic data was collected.

Abstract: A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion.

Abstract: Methods of producing nanowires and resulting nanowires are described. In one implementation, a method includes heating a reaction mixture including (i) a solvent; (ii) a metal-containing reagent; (iii) a templating agent; and (iv) a seed-promoting agent (SPA) that is a source of halide anions, thereby producing a product that includes nanowires of the metal. The solvent includes at least two hydroxyl groups per molecule. A ratio of a concentration of the halide anions in the reaction mixture to an overall concentration of the metal in the reaction mixture, including ionic and elemental metal forms, is up to 10. The heating is carried out at a seeding temperature, followed by a growth temperature that is higher than the seeding temperature.