Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

Abstract: A network card testing system includes a network card testing set, a network card, and a network card testing software. A plurality of twisted pairs in the network card testing set is connected with one another to form a loop. When the network card testing set is connected to the network card, a test loop is formed. The network card testing software is executed by a computer, and test data packets are directly generated and transferred through a data-link layer according to different testing strategies and network card information. And then, the test data packets are sent back through the formed test loop, and test results are calculated according to the test data packets.