Abstract: An electronic module is provided, including a circuit board, at least one electronic component, a covering layer, and an adhesive. The at least one electronic component is disposed on the circuit board. The covering layer has multiple holes, and the covering layer is disposed on the circuit board and covers the at least one electronic component. The adhesive is combined to the covering layer, and the adhesive fills the holes and encapsulates the at least one electronic component.

Abstract: An electronic module is provided, including a circuit board, at least one electronic component, a covering layer, and an adhesive. The at least one electronic component is disposed on the circuit board. The covering layer has multiple holes, and the covering layer is disposed on the circuit board and covers the at least one electronic component. The adhesive is combined to the covering layer, and the adhesive fills the holes and encapsulates the at least one electronic component.

Abstract: The present disclosure discloses an electronic device, which includes a housing having a plurality of openings, a plurality of functional elements and a moving module. The moving module includes a carrier plate, a magnetic member, an elastic member and an electromagnet. The carrier plate is movably disposed on the housing, and moved between a first position and a second position. The functional elements are disposed on the carrier plate. When the carrier plate is located at either the first position or the second position, each of the functional elements is corresponding to one of the openings. The magnetic member is disposed on a first end of the carrier plate. One end of the elastic member is connected to the housing, and the other end is fixed to a second end of the carrier plate. The electric magnet is adjacent to the first end of the carrier plate.