Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A semiconductor device and method of formation are provided. The semiconductor device comprises a silicide layer over a substrate, a metal plug in an opening defined by a dielectric layer over the substrate, a first metal layer between the metal plug and the dielectric layer and between the metal plug and the silicide layer, a second metal layer over the first metal layer, and an amorphous layer between the first metal layer and the second metal layer.

Abstract: A vehicle drive system includes a motor (drive motor), a generator, a reduction drive that reduces output of the motor, and a housing. At a position above a motor shaft, an oil passage, through which oil is supplied to each of the motor, the reduction drive, and the generator, is integrally formed with the housing. An oil pipe is attached to the housing and supplies the oil from an oil reservoir to the oil passage. At a position between the motor and the generator, the reduction drive is offset from the motor shaft in a second direction that is orthogonal to the first direction. The oil pipe is located between the motor and the generator in the first direction, and at least part of the oil pipe is located on an opposite side of the reduction drive with the motor shaft being interposed therebetween in the second direction.

Abstract: An LED module includes a silicone substrate, an LED grain mounted on a face of the silicone substrate, a temperature sensor formed under the LED grain, a luminous sensor formed close to the LED grain and an encapsulation gel enclosing the LED grain, wherein the LED grain, the luminous sensor and the temperature sensor are electrically connected to electrodes for connection to foreign devices.