Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

Abstract: Provided are a lithium ion battery, an electrode of a lithium ion battery, and an electrode material. An electrode material of the lithium ion battery includes electrode active powder and a metal thin film. The metal thin film partially or completely wraps a surface of the electrode active powder, in which the metal thin film includes silver, gold, platinum, palladium, aluminum, magnesium, zinc, tin, or an alloy of the foregoing.