Patents by Inventor Sheng-Wei Lei

Sheng-Wei Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGED INTERCONNECT STRUCTURES
    Publication number: 20240113032
    Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 4, 2024
    Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
  • Test kit for testing a device under test
    Patent number: 11879934
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: January 23, 2024
    Assignee: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Chih-Yang Liu, Che-Hsien Huang, Yi-Chieh Lin
  • TEST KIT FOR TESTING A DEVICE UNDER TEST
    Publication number: 20230236222
    Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Che-Hsien Huang, Shih-Chia Chiu, Yi-Chieh Lin, Wun-Jian Lin
  • Test kit for testing a device under test
    Patent number: 11624758
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: April 11, 2023
    Assignee: MEDIATEK INC.
    Inventors: Sheng-Wei Lei, Chang-Lin Wei, Ying-Chou Shih, Yeh-Chun Kao, Yen-Ju Lu, Po-Sen Tseng
  • TEST KIT FOR TESTING A DEVICE UNDER TEST
    Publication number: 20220397600
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.
    Type: Application
    Filed: May 3, 2022
    Publication date: December 15, 2022
    Applicant: MEDIATEK INC.
    Inventors: Jing-Hui Zhuang, Ying-Chou Shih, Sheng-Wei Lei, Chang-Lin Wei, Chih-Yang Liu, Che-Hsien Huang, Yi-Chieh Lin
  • TEST KIT FOR TESTING A DEVICE UNDER TEST
    Publication number: 20210302467
    Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.
    Type: Application
    Filed: March 24, 2021
    Publication date: September 30, 2021
    Inventors: Sheng-Wei Lei, Chang-Lin Wei, Ying-Chou Shih, Yeh-Chun Kao, Yen-Ju Lu, Po-Sen Tseng