Patents by Inventor Sheng-Wei Lin

Sheng-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190372427
    Abstract: A motor includes a rotor including a rotating shaft extending along a center axis, a cylindrical rotor core provided outside the rotating shaft in a radial direction, and two discoid weight plates provided at two ends of the cylindrical rotor core in an axial direction, and a stator opposing the rotor in the radial direction. A radius of each weight plate is smaller than a radius of the rotor core, and a difference between the radius of the rotor core and the radius of each weight plate is larger than an air gap between an outside of the rotor core in the radial direction and an inside of the stator in the radial direction.
    Type: Application
    Filed: February 19, 2018
    Publication date: December 5, 2019
    Applicant: Nidec Corporation
    Inventors: Hsin-Nan LIN, Guo-Jhih YAN, Sheng-Chan YEN, Yu-Wei HSU, Kuo-Min WANG, Cheng-Tsung LIU
  • Publication number: 20190371261
    Abstract: The disclosure provides a storage medium, an expansion base and an operation method thereof combined with a portable electronic device. The portable electronic device is pre-installed with an application program and includes a touch screen. The expansion base is paired with the portable electronic device and accommodates the portable electronic device. When the portable electronic device is accommodated inside the expansion base, a touch window on the surface of the expansion base exposes at least a portion of the touch screen, and the portable electronic device executes the application program to automatically adjust a size or a display position of a display image of the touch screen to correspond to the touch window.
    Type: Application
    Filed: May 13, 2019
    Publication date: December 5, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Che-Wei Liang, Xiu-Yu Lin, Yi-Han Liao, Sheng-Chieh Tang, Chieh-Yu Chan, Chiao-Tsu Chiang, Wen-Yi Chiu, Wei-Chih Hsu, Li-Fang Chen, Yi-Jing Lin
  • Publication number: 20190357625
    Abstract: A motorcycle helmet providing cool and cleaning air may comprise a helmet body, having a window opening and a wearing opening, wherein two sides of the window opening pivotally connect to a goggle; the goggle can pivot to the window opening and seals it; the wearing opening is installed a first connecting device around; there is a ventilation hole on an opening position on the helmet body or the goggle; an ventilation tube with one end connected to the ventilation hole; a PAPR-typed air supplier connected to the other end of the ventilation tube, for providing external air which has been screened to remove particulate matters to the helmet body through the ventilation tube; and a guiding towel made of wind-proof materials, wherein a top end of the guiding towel has a second connecting device and the second connecting device is removably connected to the first connecting device.
    Type: Application
    Filed: May 23, 2018
    Publication date: November 28, 2019
    Inventors: CHIH-CHIEH CHEN, AI-LUN JIAN, SHENG-HSIU HUANG, CHIH-WEI LIN
  • Publication number: 20190361557
    Abstract: A method for operating a handheld device, a handheld device, and a computer-readable recording medium thereof are provided. The handheld device at least includes, but not limited to, a body, one or more sensors, a display, and a processor. The one or more sensors are disposed on at least one side of the body, respectively. The processor is coupled to the one or more sensors and the display and configured to receive an operation through the one or more sensors, determine a position of the operation on at least one side of the body according to sensing data generated by the sensors, and display a user interface corresponding to the position by the display. Accordingly, a convenient function for one hand operation is provided.
    Type: Application
    Filed: November 26, 2018
    Publication date: November 28, 2019
    Applicant: HTC Corporation
    Inventors: Yu-Cheng Hung, Shuo-Fang Jeng, Shih-Lung Lin, Pei-Chun Tsai, Kuan-Wei Li, Sheng-Chieh Lin
  • Publication number: 20190355921
    Abstract: An organic light-emitting device includes a first electrode layer, an emission layer, an electron transporting layer, an electron injection layer, and a second electrode layer sequentially formed from bottom to top. The emission layer includes a guest light-emitting material, a first phenyl phosphine oxide derivative and a hole transporting material. The electron transporting layer includes a second phenyl phosphine oxide derivative and a third phenyl phosphine oxide derivative different from the second phenyl phosphine oxide derivative. One of the second phenyl phosphine oxide derivative and the third phenyl phosphine oxide derivative is identical to the first phenyl phosphine oxide derivative. The electron injection layer includes an alkaline metal compound.
    Type: Application
    Filed: January 29, 2019
    Publication date: November 21, 2019
    Inventors: Hsin-Fei MENG, Sheng-Fu HORNG, Yu-Chiang CHAO, Chih-Yu CHANG, Yu-Fan CHANG, Mei-Peng LIOU, Qian-Wei LIN, Hsiao-Tso SU, Chiung -Wen CHANG
  • Publication number: 20190348874
    Abstract: A rotor is located around an outer periphery of a rotation shaft of a motor and rotates together with the rotation shaft. The rotor includes magnetic steel plates laminated in an axial direction and including a through-hole group passing therethrough in the axial direction. The through-hole group includes through-holes each including, as a central line, an imaginary line extending in the radial direction and having an arcuate shape extending from the central line to both sides and radially outward. The through-holes are arranged in the radial direction. Among the through-holes, a radius of curvature of an arcuate radially inner side surface of the radially innermost through-hole is the smallest, and/or a radius of curvature of an arcuate radially outer side surface of the radially outermost through-hole is the largest.
    Type: Application
    Filed: February 19, 2018
    Publication date: November 14, 2019
    Applicant: Nidec Corporation
    Inventors: Sheng-Chan YEN, Yu-Wei HSU, Guo-Jhih YAN, Hsin-Nan LIN, Kuo-Min WANG, Cheng-Tsung LIU
  • Patent number: 10466199
    Abstract: A biosensor device includes a substrate, a sensing transistor, an isolation layer and a main interface layer. The sensing transistor is formed on the substrate and including a bottom gate structure, a top gate structure and a semiconductor layer disposed between the bottom gate structure and the top gate structure. The bottom gate structure is electrically connected to the top gate structure. The isolation layer is formed on the sensing transistor for covering the sensing transistor, and includes a first opening. The main interface layer is disposed in the first opening for receiving biomolecules to be sensed. The main interface layer is electrically connected to the top gate structure.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: November 5, 2019
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Chih-Ting Lin, Shey-Shi Lu, Yu-Hao Chen, Sheng-Yeh Chou, I-Shun Wang, Che-Wei Huang, Pei-Wen Yen
  • Publication number: 20190334263
    Abstract: The present invention is a connector including a plurality of first terminals and second terminals. Each of the first terminals has a first securing portion, the first securing portion has a first contacting portion connected to a front end thereof. The first securing portion has a guiding portion extended downward from a rear end of the first securing portion. The guiding portion having an extending portion. The guiding portion has a first soldering portion extended downward from a bottom of the guiding portion. The first securing portion is arranged in a first upper guiding slot, the first contacting portion is arranged in a first terminal slot and extended into a plug slot, a bottom of the guiding portion is arranged in a first lower guiding slot, the first soldering portion is extended downward to go through a rear end of a bottom of a rear section.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 31, 2019
    Inventors: SHENG-YUAN HUANG, HAN-WEI WANG, PEI-YI LIN, TE-HUNG YIN
  • Publication number: 20190321008
    Abstract: A size-selective sampler includes: a base body having a receiving space and a concave surface curved toward the receiving space, wherein the concave surface has opposite first and second sides; an inlet port formed on the first side of the concave surface and communicating with the receiving space; and an outlet port formed on the second side of the concave surface and communicating with the receiving space. The inlet port has a length of at least 20 mm along the first side of the concave surface so as to reduce penetration of particles in an air flow. Further, the particle penetration curve is roughly equal to the ISO curve.
    Type: Application
    Filed: June 13, 2018
    Publication date: October 24, 2019
    Inventors: Sheng-Hsiu Huang, Ting-Ju Chen, Yu-Mei Kuo, Chih-Wei Lin, Chih-Chieh Chen
  • Patent number: 10453216
    Abstract: Systems and associated methods are disclosed for automatically configuring cameras to be associated with a known physical location in response to exposing the camera to a fiducial marker. In certain embodiments, boundaries for a zone of interest within images from the camera can be defined using the fiducial markers physically placed within the physical space.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: October 22, 2019
    Assignee: Amazon Technologies
    Inventors: Lev Zelenskiy, Jon Robert Ducrou, Alexander Edwards, Tony Li, Sheng-Wei Lin, Stephen Waits
  • Publication number: 20190319388
    Abstract: An electrical connector includes an insulating housing and a plurality of electrical terminals. A top wall of the insertion space defines a plurality of terminal grooves recessing upward. The plurality of electrical terminals are arranged in the plurality of the terminal grooves. Each of the plurality of the electrical terminals has a fixing portion. A middle of the fixing portion is of a hollow shape and is defined as a material reduction area. A front end of the fixing portion is connected with a contacting portion. A bottom of the fixing portion extends downward to form a guiding portion. A rear of the guiding portion is bent sideward and then is bent frontward to form a material increase area. two sides of the guiding portion are chamfered to form two chamfers. A bottom end of the guiding portion extends rearward to from a soldering portion.
    Type: Application
    Filed: January 20, 2019
    Publication date: October 17, 2019
    Inventors: HAN-WEI WANG, SHENG-YUAN HUANG, PEI-YI LIN, TE-HUNG YIN
  • Patent number: 10446489
    Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 15, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su
  • Publication number: 20190303501
    Abstract: A method, computer system, and a computer program product for crawling and extracting main content from a web page is provided. The present invention may include retrieving a HTML document associated with a web page. The present invention may then include identifying at least one entry point located in the retrieved HTML document by utilizing a self-adaptive entry point locator. The present invention may also include extracting a main content article associated with the retrieved HTML document based on the identified at least one entry point. The present invention may further include presenting the extracted main content associated with the retrieved HTML document to the user.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 3, 2019
    Inventors: Chen-Yu Huang, Sheng-Wei Lee, June-Ray Lin, Ci-Hao Wu, Hsieh-Lung Yang, Ying-Chen Yu
  • Publication number: 20190304939
    Abstract: The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a semiconductor substrate; an interconnection structure formed on the semiconductor substrate; and a redistribution layer (RDL) metallic feature formed on the interconnection structure. The RDL metallic feature further includes a barrier layer disposed on the interconnection structure; a diffusion layer disposed on the barrier layer, wherein the diffusion layer includes metal and oxygen; and a metallic layer disposed on the diffusion layer.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 3, 2019
    Inventors: Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin
  • Publication number: 20190291006
    Abstract: A costume replacement method includes, based on a user input, obtaining information of a model including a plurality of parts, the plurality of parts including a target part of which a costume is to be replaced, obtaining image set object data corresponding to the model of which the information is obtained, the image set object data including a plurality of pieces of image data respectively corresponding to the plurality of parts, and obtaining costume replacement data corresponding to the target part included in the model of which the information is obtained. The method further includes updating the obtained image set object data by updating one of the plurality of pieces of image data corresponding to the target part, based on the obtained costume replacement data, and rendering the model, based on the updated image set object data, to update the costume of the target part included in the model.
    Type: Application
    Filed: June 12, 2019
    Publication date: September 26, 2019
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LTD
    Inventors: Hao Jiang, Sheng Wei Lin, Yi Xu, Qi Fa Guo
  • Publication number: 20190295971
    Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.
    Type: Application
    Filed: June 10, 2019
    Publication date: September 26, 2019
    Inventors: Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen
  • Publication number: 20190273147
    Abstract: Embodiments disclosed herein relate generally to forming an effective metal diffusion barrier in sidewalls of epitaxy source/drain regions. In an embodiment, a structure includes an active area having a source/drain region on a substrate, a dielectric layer over the active area and having a sidewall aligned with the sidewall of the source/drain region, and a conductive feature along the sidewall of the dielectric layer to the source/drain region. The source/drain region has a sidewall and a lateral surface extending laterally from the sidewall of the source/drain region, and the source/drain region further includes a nitrided region extending laterally from the sidewall of the source/drain region into the source/drain region. The conductive feature includes a silicide region along the lateral surface of the source/drain region and along at least a portion of the sidewall of the source/drain region.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Wen CHENG, Cheng-Tung LIN, Chih-Wei CHANG, Hong-Mao LEE, Ming-Hsing TSAI, Sheng-Hsuan LIN, Wei-Jung LIN, Yan-Ming TSAI, Yu-Shiuan WANG, Hung-Hsu CHEN, Wei-Yip LOH, Ya-Yi CHENG
  • Publication number: 20190252248
    Abstract: A semiconductor device and method of formation are provided. The semiconductor device comprises a metal plug in a first opening over a substrate, the metal plug is over a silicide layer, and the silicide layer is over a metal oxide layer. The metal oxide layer has an oxygen gradient, such that a percentage of oxygen increases from a top surface of the metal oxide layer to a bottom surface of the metal oxide layer. The metal oxide layer unpins the Fermi level of the interface between the metal plug and the substrate, which is exhibited by a lowered Schottky barrier height (SBH) and increased oxygen vacancy states between the V.B. and the C.B. of the metal oxide layer, which decreases the intrinsic resistivity between the metal plug and the substrate as compared to a semiconductor device that lacks such a metal oxide layer.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Yu-Hung Lin, You-Hua Chou, Sheng-Hsuan Lin, Chih-Wei Chang
  • Patent number: 10381709
    Abstract: A multi-band antenna structure includes a substrate having a first wiring area located on one side surface thereof. The first wiring area has a first metal trace, a second metal trace and a connecting portion formed therein. The first and the second metal trace are respectively in an elongated spiral pattern; and the connecting portion is electrically connected at two opposite ends to the first and the second metal trace. The multi-band antenna structure can be directly integrated into electrical circuits on a circuit board to provide the advantages of reduced manufacturing cost and capable of transmitting or receiving multiple bands of signals.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: August 13, 2019
    Assignee: Keycore Technology Corp.
    Inventors: Yang-Te Liang, Po-Wei Chiu, Sheng-Ruei Hsu, Wei-Cheng Lin, Chien-Jen Hsiao, Shih-Hsiu Tseng
  • Patent number: 10354965
    Abstract: The present disclosure describes an bonding pad formation method that incorporates an tantalum (Ta) conductive layer to block mobile ionic charges generated during the aluminum-copper (AlCu) metal fill deposition. For example, the method includes forming one or more interconnect layers over a substrate and forming a dielectric over a top interconnect layer of the one or more interconnect layers. A first recess is formed in the dielectric to expose a line or a via from the top interconnect layer. A conductive layer is formed in the first recess to form a second recess that is smaller than the first recess. A barrier metal layer is formed in the second recess to form a third recess that is smaller than the second recess. A metal is formed to fill the third recess.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: July 16, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih Wei Bih, Chun-Chih Lin, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin, Wen-Hao Cheng