Abstract: Various embodiments of the present disclosure are directed towards an image sensor having a semiconductor substrate comprising a front-side surface opposite a back-side surface. A plurality of photodetectors is disposed in the semiconductor substrate. An isolation structure extends into the back-side surface of the semiconductor substrate and is disposed between adjacent photodetectors. The isolation structure includes a metal core, a conductive liner disposed between the semiconductor substrate and the metal core, and a first dielectric liner disposed between the conductive liner and the semiconductor substrate. The metal core comprises a first metal material and the conductive liner comprises the first metal material and a second metal material different from the first metal material.

Abstract: A display light engine which includes a light source module, a spectrum conversion array disposed on the light source module and a lens array is provided. The light source module includes a plurality of light-emitting components which emit light toward the spectrum conversion array. The spectrum conversion array includes a plurality of spectrum conversion components and a metal bank material. The spectrum conversion components are spaced from each other and are disposed on the light-emitting components respectively. The metal bank material is distributed between two adjacent spectrum conversion components and separates the spectrum conversion components from each other. The lens array which includes a plurality of lenses arranged in an array is disposed between the spectrum conversion array and the light source module. Those lenses are disposed on and align to the spectrum conversion components respectively.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: In a semiconductor structure, a first conductive feature is formed in a trench by PVD and a glue layer is then deposited on the first conductive feature in the trench before CVD deposition of a second conductive feature there-over. The first conductive feature acts as a protection layer to keep silicide from being damaged by later deposition of metal or a precursor by CVD. The glue layer extends along the extent of the sidewall to enhance the adhesion of the second conductive features to the surrounding dielectric layer.

Abstract: A method of performing power saving control on a display device includes: generating, by a timing controller of the display device, a power saving start indication and a power saving end indication in response to changing of a refresh rate of the display device; receiving, by a source driver of the display device, the power saving start indication and the power saving end indication; in response to the power saving start indication, allowing a part of circuitry of the source driver to be powered down during a vertical blanking interval; and in response to the power saving end indication, allowing the powered down part of circuitry of the source driver to be woken up during the vertical blanking interval.

Abstract: A method of performing power saving control on a display device includes: generating, by a timing controller of the display device, a power saving start indication and a power saving end indication in response to changing of a refresh rate of the display device; receiving, by a source driver of the display device, the power saving start indication and the power saving end indication; in response to the power saving start indication, allowing a part of circuitry of the source driver to be powered down during a vertical blanking interval; and in response to the power saving end indication, allowing the powered down part of circuitry of the source driver to be woken up during the vertical blanking interval.

Abstract: A display device includes a substrate, a reflective structure, and a pixel unit. The pixel unit is disposed on the substrate. The pixel unit includes a sub-pixel. The sub-pixel includes a light-emitting element. A light emitted by the light-emitting element has a color. The reflective structure is disposed on the substrate. The reflective structure includes a first portion and a second portion. The first portion of the reflective structure surrounds the light-emitting element. A projection area of the first portion of the reflective structure on the substrate is less than a projection area of the second portion of the reflective structure on the substrate.

Abstract: A device includes a fin extending from a semiconductor substrate, a gate stack over and along a sidewall of the fin, an isolation region surrounding the gate stack, an epitaxial source/drain region in the fin and adjacent the gate stack, and a source/drain contact extending through the isolation region, including a first silicide region in the epitaxial source/drain region, the first silicide region including NiSi2, a second silicide region on the first silicide region, the second silicide region including TiSix, and a conductive material on the second silicide region.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.

Abstract: A collapsible stand has a first member and a second member. The first member has a containment portion and an engaging portion, a circumference of the containment portion further has a first connecting portion, the second member has an accepting portion and a slot, a circumference of the second member further has a second connecting portion, and the second member engages with the engaging portion of the first member.

Abstract: A rotatable stand comprising a front body and a rear body. The front body has a containment slot, a connecting portion and a stopping portion, the rear body has an engaging portion, a positioning column and a hollow portion. The stopping portion of the front body further has a first positioning slot and a second positioning slot. By engaging the connecting portion of the front body and the engaging portion of the rear body, the positioning column of the rear body is capable of being rotated between the first positioning slot and the second positioning slot.

Abstract: A collapsible stand has a first member and a second member. The first member has a containment portion and an engaging portion, a circumference of the containment portion further has a first connecting portion, the second member has an accepting portion and a slot, a circumference of the second member further has a second connecting portion, and the second member engages with the engaging portion of the first member.

Abstract: A rotatable stand comprising a front body and a rear body. The front body has a containment slot, a connecting portion and a stopping portion, the rear body has an engaging portion, a positioning column and a hollow portion. The stopping portion of the front body further has a first positioning slot and a second positioning slot. By engaging the connecting portion of the front body and the engaging portion of the rear body, the positioning column of the rear body is capable of being rotated between the first positioning slot and the second positioning slot.

Abstract: An ornament holder for a cellphone has a securing member, a connecting member, a cover, an insertion member and a plurality of loops. The cover and the connecting member each has a connector comprising a column, a positioning portion and an engaging portion, and connecting member and the securing member each comprise a concave portion configured to engage with a connector on another of the cover and the connecting member, each concave portion comprising a positioning slot and an engaging slot; the plurality of the loops are used for connecting the securing member, the connecting member and the cover to the insertion member.

Abstract: An ornament holder for a cellphone has a securing member, a connecting member, a cover, an insertion member and a plurality of loops. The cover and the connecting member each has a connector comprising a column, a positioning portion and an engaging portion, and connecting member and the securing member each comprise a concave portion configured to engage with a connector on another of the cover and the connecting member, each concave portion comprising a positioning slot and an engaging slot; the plurality of the loops are used for connecting the securing member, the connecting member and the cover to the insertion member.