Abstract: The present disclosure describes ultrasound systems configured to enhance flow imaging and analysis by adaptively adjusting one or more imaging parameters in response to acquired flow measurements. Example systems can include an ultrasound transducer and one or more processors. Using the system components, mean flow velocity magnitude and acceleration can be determined within a target region during an acquisition phase, which may include a cardiac cycle. One or more adjusted flow imaging parameters, such as adjusted ensemble length, temporal smoothing filter length and/or step size, can be determined based on the acquired flow measurements to increase the signal quality of newly acquired ultrasound echo signals. The adjusted flow imaging parameters can then be applied by the ultrasound transducer during a second acquisition phase.

Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.

Abstract: Ultrasound image devices, systems, and methods are provided. An ultrasound imaging system, comprising an array of acoustic elements configured to transmit ultrasound energy into an anatomy and to receive ultrasound echoes associated with the anatomy; and a processor circuit in communication with the array of acoustic elements and configured to receive, from the array, ultrasound channel data corresponding to the received ultrasound echoes; normalize the ultrasound channel data by applying a first scaling function to the ultrasound channel data; generate beamformed data by applying a predictive network to the normalized ultrasound channel data; de-normalize the beamformed data by applying a second scaling function to the beamformed data; generate an image of the anatomy from the beamformed data; and output, to a display in communication with the processor circuit, the image of the anatomy.

Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.

Abstract: According to the present disclosure, a measuring method of liquid mixture purity includes steps as follows. A storage tank is provided, wherein the storage tank is configured for storing a liquid mixture including formic acid and water. A calculating unit is provided, wherein a plurality of formic acid purity values are saved in the calculating unit. A pressure-decreasing and heating step is performed by reducing a pressure of the storage tank and heating the storage tank. A measuring step is performed by measuring in the inner space of the storage tank to obtain a pressure value, and measuring the liquid mixture simultaneously to obtain a temperature value. A calculating step is performed by inputting the pressure value and the temperature value into the calculating unit, wherein the calculating unit outputs one of the formic acid purity values corresponding thereto.

Abstract: A diagnostic ultrasound system has a 2D array transducer which is operated with 1×N patches, patches which are only a single element wide. The “N” length of the patches extends in the elevation direction of a scanned 2D image plane, with the single element width extending in the lateral (azimuth) direction. Focusing is done along each patch in the elevation direction by a microbeamformer, and focusing in the lateral (azimuth) direction is done by the system beamformer. The minimal width of each patch in the azimuth direction enables the production of images highly resolved in the azimuthal plane of a 2D image, including the reception of highly resolved multilines for high frame rate imaging.

Abstract: A capsule endoscope, an endoscope system, and an image correction method are provided. The capsule endoscope includes an image sensor and a posture sensor. The image sensor is coupled to a processor and obtains a sensed image. The posture sensor is coupled to the processor and obtains three-axis data. The processor calculates a screen rotation angle according to the three-axis data and corrects the sensed image according to the screen rotation angle. A first axis and a second axis of the corrected sensed image rotate toward an actual vertical axis and an actual horizontal axis.

Abstract: The present application discloses a light sensor circuit, which comprises a photodiode and a capacitor unit. The cathode of the photodiode is controlled by a capacitive unit to maintain the same or close voltage level as the anode of the photodiode, which significantly reduces the effect of the dark current of the photodiode. Thus, the light sensor circuit can effectively maintain the performance and accuracy of an analog-to-digital converter applying the light sensor circuit. The circuit design difficulty and manufacturing cost are also significantly reduced.

Abstract: In a described example, an apparatus includes: a package substrate having a die mount portion and lead portions spaced from the die mount portion; a semiconductor die over the die mount portion having bond pads on an active surface facing away from the package substrate; non-gold bond wires forming electrical connections between at least one of the bond pads and one of the lead portions of the package substrate; a bond stitch on bump connection formed between one of the non-gold bond wires and a bond pad of the semiconductor die, comprising a stitch bond formed on a flex stud bump; and dielectric material covering a portion of the package substrate, the semiconductor die, the non-gold bond wires, the stitch bond and the flex stud bump, forming a packaged semiconductor device.

Abstract: A system for performing ablation includes an ablation device (102) configured to ablate tissue in accordance with control parameters and configured to make measurements during the ablation process. An imaging system (104) is configured to measure an elastographic related parameter to monitor ablation progress. A parameter estimation and monitoring module (115) is configured to receive the measurements from the ablation device and/or the elastographic related parameter to provide feedback to adaptively adjust imaging parameters of the imaging device at different times during an ablation process.

Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.

Abstract: A method includes: providing a first design layout including a plurality of cells; updating a first cell of the plurality of cells using optical proximity correction to provide a first updated cell and a data set; and updating a second cell from remaining cells in the first design layout based on the data set and a model without involvement of optical proximity correction to provide a second updated cell, wherein the model includes hidden layers including nodes and is trained to obtaining converged values of the nodes of the hidden layers through providing a mapping of edge segments before lithography enhancement and edge segments after lithography enhancement using optical proximity correction, and wherein at least one of the providing, and updating is executed by one or more processors.

Abstract: A system for visualization and quantification of ultrasound imaging data may include a display unit, and a processor communicatively coupled to the display unit and to an ultrasound imaging apparatus for generating an image from ultrasound data representative of a bodily structure and fluid flowing within the bodily structure. The processor may be configured to generate vector field data corresponding to the fluid flow, wherein the vector field data comprises axial and lateral velocity components of the fluid, extract spatiotemporal information from the vector field data at one or more user-selected points within the image, and cause the display unit to concurrently display the spatiotemporal information at the one or more user-selected points with the image including a graphical representation of the vector field data overlaid on the image, wherein the spatiotemporal information includes at least one of a magnitude and an angle of the fluid flow.

Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.

Abstract: A location device is provided for determining the location of an acoustic sensor. A location process makes use of a plurality of transmit beams (wherein a beam is defined as a transmission from all transducers of an ultrasound array), with a frequency analysis to identify if there is a signal reflected from the acoustic sensor. A location is obtained from the plurality of frequency analyses.

Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.

Abstract: Systems and methods for improving spectral-shift methods for calculating acoustic attenuation coefficients are disclosed. Systems, methods, and apparatuses for transmitting ultrasound pulse sequences for improved signal-to-noise outside the main passband of ultrasound transducers are disclosed. Systems, methods, and apparatuses for using the echoes from the transmitted pulse sequences to calculate the attenuation coefficient are disclosed.

Abstract: A method includes providing a first design layout including cells; updating a first cell in the plurality of cells using optical proximity correction to provide a first updated cell and a data set; training a model based on a layout-dependent parameter of a second design layout; and updating a second cell based on the data set and the model to provide a second updated cell. The model includes an input layer, a hidden layer and an output layer. Training the model includes obtaining converged values of nodes of the hidden layer. Obtaining converged values of nodes of the hidden layer includes providing information on edge segments before and after lithography enhancement to the input layer and the output layer, respectively, until values of nodes of the hidden layer attains convergence in terms of a cost function.

Abstract: The invention provides a method for controlling the generation of a compound ultrasonic image. The method includes obtaining a first ultrasound image and applying adaptive beamforming to the first ultrasound image, thereby generating a second ultrasound image. A weighting is determined based on the first and second ultrasound images, wherein the weighting comprises at least one weighting component. The compound ultrasound image is then generated based on the first and second ultrasound images and the weighting component.

Abstract: The present application discloses a light sensor circuit, which comprises a photodiode and a capacitor unit. The cathode of the photodiode is controlled by a capacitive unit to maintain the same or close voltage level as the anode of the photodiode, which significantly reduces the effect of the dark current of the photodiode. Thus, the light sensor circuit can effectively maintain the performance and accuracy of an analog-to-digital converter applying the light sensor circuit. The circuit design difficulty and manufacturing cost are also significantly reduced.