Patents by Inventor Sheng-Wen Ni

Sheng-Wen Ni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE WITH ANTENNA CIRCUIT
    Publication number: 20230067595
    Abstract: A package structure includes a carrier substrate, a circuit unit, and a packaging unit. The circuit unit includes an antenna circuit, and a conducting circuit that is flexible and that is electrically connected to the antenna circuit. At least a portion of the antenna circuit is disposed on the carrier substrate. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that a portion of the circuit unit is exposed to permit said conducting circuit for electrical connection with the outside.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 2, 2023
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Chi-Neng Ho, Sheng-Wen Ni, Yu-Cheng Lin, Yen-Chou Chen