Patents by Inventor Sheng-Wen Ou

Sheng-Wen Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 9465411
    Abstract: An electronic device includes a housing assembly and an electronic module. The housing assembly includes a first housing and a second housing. The first housing includes a main body, an accommodation box and an assembly component. The main body, the accommodation box and the assembly component are formed integrally into a single unit. The main body is connected to the accommodation box which has an accommodating space, a first side and a second side. The first side is opposite to the second side. The assembly component is disposed at the second side. The second housing detachably covers the accommodation box and the assembly component. The electronic module includes a fastening structure and is movably disposed in the accommodating space via the first side of the accommodation box. Accordingly, the fastening structure is combined with the assembly component.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: October 11, 2016
    Assignee: TPV-INVENTA TECHNOLOGY CO., LTD.
    Inventors: Sheng-Wen Ou, Hung-Chun Chen
  • ELECTRONIC DEVICE
    Publication number: 20160044807
    Abstract: An electronic device includes a housing assembly and an electronic module. The housing assembly includes a first housing and a second housing. The first housing includes a main body, an accommodation box and an assembly component. The main body, the accommodation box and the assembly component are formed integrally into a single unit. The main body is connected to the accommodation box which has an accommodating space, a first side and a second side. The first side is opposite to the second side. The assembly component is disposed at the second side. The second housing detachably covers the accommodation box and the assembly component. The electronic module includes a fastening structure and is movably disposed in the accommodating space via the first side of the accommodation box. Accordingly, the fastening structure is combined with the assembly component.
    Type: Application
    Filed: March 20, 2015
    Publication date: February 11, 2016
    Inventors: Sheng-Wen Ou, Hung-Chun Chen