Patents by Inventor Sheng WEN

Sheng WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Patent number: 11950960
    Abstract: Ultrasound image devices, systems, and methods are provided. An ultrasound imaging system, comprising an array of acoustic elements configured to transmit ultrasound energy into an anatomy and to receive ultrasound echoes associated with the anatomy; and a processor circuit in communication with the array of acoustic elements and configured to receive, from the array, ultrasound channel data corresponding to the received ultrasound echoes; normalize the ultrasound channel data by applying a first scaling function to the ultrasound channel data; generate beamformed data by applying a predictive network to the normalized ultrasound channel data; de-normalize the beamformed data by applying a second scaling function to the beamformed data; generate an image of the anatomy from the beamformed data; and output, to a display in communication with the processor circuit, the image of the anatomy.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: April 9, 2024
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Francois Guy Gerard Marie Vignon, Muhammad Usman Ghani, Jun Seob Shin, Faik Can Meral, Sheng-Wen Huang, Jean-Luc Francois-Marie Robert
  • Patent number: 11955335
    Abstract: In a method of coating a photo resist over a wafer, dispensing the photo resist from a nozzle over the wafer is started while rotating the wafer, and dispensing the photo resist is stopped while rotating the wafer. After starting and before stopping the dispensing the photo resist, a wafer rotation speed is changed at least 4 times. During dispensing, an arm holding the nozzle may move horizontally. A tip end of the nozzle may be located at a height of 2.5 mm to 3.5 mm from the wafer.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tung-Hung Feng, Hui-Chun Lee, Sheng-Wen Jiang, Shih-Che Wang
  • Patent number: 11945766
    Abstract: The present invention relates to the technical field of acetonitrile refining, and in particular, to an improved acetonitrile purification process for an ultrahigh performance liquid chromatography-mass spectrometer. The present invention provides an acetonitrile purification process. A high-purity finished product may be obtained by performing operations of oxidation, rectification adsorption, drying, reflux rectification and filtration on industrial acetonitrile and controlling related parameters such as temperature, flow and the like, continuous production is ensured, a light transmittance of the finished product in ultraviolet rays of 200 to 260 nm is greater than or equal to 95%, water and impurities in the industrial acetonitrile are removed, and the requirements of the ultrahigh performance liquid chromatography-mass spectrometer are met; moreover, by controlling process parameters and equipment.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 2, 2024
    Inventors: Sheng Wen, ZhengChong Zhao, ChunLi Gong, Fan Cheng, Hai Liu, FuQiang Hu
  • Patent number: 11942652
    Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: March 26, 2024
    Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chen-Ting Kao, Chi-Cheng Wen, Yu-Sheng Chang, Chih-Cheng Lee, Chiung-Hsiang Wu, Sheng-Li Yen, Yu-Cheng Zhang, Chang-Ju Hsieh, Chen Chao
  • Patent number: 11935722
    Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Pin Chou, Sheng-Wen Huang, Jun-Xiu Liu
  • Patent number: 11929271
    Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Kang Hu, Shou-Wen Kuo, Sheng-Hsiang Chuang, Jiun-Rong Pai, Hsu-Shui Liu
  • Publication number: 20240077392
    Abstract: According to the present disclosure, a measuring method of liquid mixture purity includes steps as follows. A storage tank is provided, wherein the storage tank is configured for storing a liquid mixture including formic acid and water. A calculating unit is provided, wherein a plurality of formic acid purity values are saved in the calculating unit. A pressure-decreasing and heating step is performed by reducing a pressure of the storage tank and heating the storage tank. A measuring step is performed by measuring in the inner space of the storage tank to obtain a pressure value, and measuring the liquid mixture simultaneously to obtain a temperature value. A calculating step is performed by inputting the pressure value and the temperature value into the calculating unit, wherein the calculating unit outputs one of the formic acid purity values corresponding thereto.
    Type: Application
    Filed: April 11, 2023
    Publication date: March 7, 2024
    Inventors: Kuo-Liang YEH, Ya-Ju CHANG, Jung-Kuei PENG, Sheng-Tang CHANG, Min-Wen WENG, Wen-Ting HUANG
  • Patent number: 11911218
    Abstract: A diagnostic ultrasound system has a 2D array transducer which is operated with 1×N patches, patches which are only a single element wide. The “N” length of the patches extends in the elevation direction of a scanned 2D image plane, with the single element width extending in the lateral (azimuth) direction. Focusing is done along each patch in the elevation direction by a microbeamformer, and focusing in the lateral (azimuth) direction is done by the system beamformer. The minimal width of each patch in the azimuth direction enables the production of images highly resolved in the azimuthal plane of a 2D image, including the reception of highly resolved multilines for high frame rate imaging.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: February 27, 2024
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Man Nguyen, Jean-Luc Robert, Ramon Quido Erkamp, Sheng-Wen Huang, Bernard Joseph Savord, Emil George Radulescu
  • Publication number: 20240064102
    Abstract: A first packet flow and a second packet flow support a first protocol, a third packet flow and a fourth packet flow support a second protocol, and a priority of the first protocol is lower than a priority of the second protocol. The first packet flow and the third packet flow are transmitted from a first ingress port to a first egress port. The second packet flow and the fourth packet flow are transmitted from a second ingress port to a second egress port. When the packet processing device is in a congested state, a bandwidth modulator performs a first suppression process on the first packet flow at the first ingress port, and the bandwidth modulator performs a second suppression process on the second packet flow at the second egress port or on the third packet flow at the first ingress port.
    Type: Application
    Filed: March 13, 2023
    Publication date: February 22, 2024
    Inventors: Kuo Cheng LU, Chun-Ming LIU, Sheng Wen LO
  • Publication number: 20240050948
    Abstract: A contactless selection device, a light sensing structure thereof, and a biological particle selection apparatus are provided. The light sensing structure includes a substrate, an insulating layer, an electrode layer, and a photoelectric layer, the latter two of which are respectively formed on two opposite sides of the substrate. The photoelectric layer includes a plurality of collector regions, a plurality of base regions respectively formed in the collector regions, and a plurality of emitter regions that are respectively formed in the base regions. Each of the emitter regions includes a plurality of emitter pads formed in the corresponding base region. Each of the base regions, the corresponding collector region, and the corresponding emitter region are jointly formed as a vertical transistor. The insulating layer covers and separates the vertical transistors and an end of each of the emitter pads is exposed from the insulating layer.
    Type: Application
    Filed: November 16, 2022
    Publication date: February 15, 2024
    Inventors: Chung-Er Huang, Sheng-Wen Chen, Hsin-Cheng Ho
  • Patent number: 11886263
    Abstract: A signal re-driving device, a data storage system and a mode control method are provided. The method includes the following steps. A first signal is received via a receiving circuit of the signal re-driving device. An analog signal feature is detected the receiving circuit. A first mode is entered according to the analog signal feature. The first signal is modulated and a second signal is outputted in the first mode. The second signal is sent via a sending circuit of the signal re-driving device. A digital signal feature is detected via the receiving circuit. And, the first mode is switched to a second mode according to the digital signal feature.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: January 30, 2024
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Po-Jung Chou, Sheng-Wen Chen, Chung-Kuang Chen
  • Patent number: 11887928
    Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yung-Shun Chang, Sheng-Wen Yang, Teck-Chong Lee, Yen-Liang Huang
  • Publication number: 20240024868
    Abstract: Provided is a microfluidic detection device, including a base with a microfluidic channel structure formed on the base and a lid covering the base. The microfluidic channel structure includes a sample well for loading a sample, a detection well having a first reagent for reacting with the sample, and a channel connecting the sample well and the detection well. The detection well has a recess deeper than the channel, and the base includes a protrusion corresponding to the recess to form a space between the protrusion and the recess. Also provided is a method for rapid diagnostic testing by the microfluidic detection device.
    Type: Application
    Filed: July 25, 2023
    Publication date: January 25, 2024
    Inventors: Ching-Yun Chen, Cherng-Jyh Ke, Shih-Tien Hsu, Ching-Wen Tsai, Si-Ting Wu, Yi-Hsuan Tung, Hsin-I Chiu, Sheng-Wen Chang, Jing-Ke Chen, Yueh-Teng Tsai, Ching Yu, Jian-Hua Chang
  • Publication number: 20240016794
    Abstract: The present invention is directed to a method of treating acute ischemic stroke in a human comprising administering one of more low doses of DC009, wherein the dose is about 0.01-0.075 mg/kg/dose. The low dose administration is safe and effective in treating acute ischemic stroke in a human subject.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 18, 2024
    Inventors: David Chih-Kuang Chou, Jung-Chin Lin, Sheng-Wen Yeh, Shiqi Peng, Ming Zhao
  • Publication number: 20240016373
    Abstract: A capsule endoscope, an endoscope system, and an image correction method are provided. The capsule endoscope includes an image sensor and a posture sensor. The image sensor is coupled to a processor and obtains a sensed image. The posture sensor is coupled to the processor and obtains three-axis data. The processor calculates a screen rotation angle according to the three-axis data and corrects the sensed image according to the screen rotation angle. A first axis and a second axis of the corrected sensed image rotate toward an actual vertical axis and an actual horizontal axis.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 18, 2024
    Applicant: Pro-Sight Medical Technology CORP.,LTD.
    Inventors: Sheng Wen Huang, Ai-Ke Huang, Jr-Je Chuang, Hsiao-Chun Hsu, Ya-Hsuan Lee
  • Patent number: 11874166
    Abstract: The present application discloses a light sensor circuit, which comprises a photodiode and a capacitor unit. The cathode of the photodiode is controlled by a capacitive unit to maintain the same or close voltage level as the anode of the photodiode, which significantly reduces the effect of the dark current of the photodiode. Thus, the light sensor circuit can effectively maintain the performance and accuracy of an analog-to-digital converter applying the light sensor circuit. The circuit design difficulty and manufacturing cost are also significantly reduced.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: January 16, 2024
    Assignee: Sensortek Technology Corp.
    Inventors: Wen-Cheng Chen, Kai-Hsiang Chan, Sheng-Wen Huang
  • Patent number: 11861089
    Abstract: A driving circuit configured to drive a touch display panel is provided. The driving circuit includes a signal generating circuit and a sensor driving circuit. The signal generating circuit is configurable to be coupled to gate lines of the touch display panel via a gate control circuit. The signal generating circuit modulates a plurality of voltage signals on a first driving signal and a second driving signal, and provides the modulated first driving signal and the modulated second driving signal to the gate control circuit to drive the gate lines during a sensing period. The sensor driving circuit is configurable to be coupled to sensor pads of the touch display panel. The sensor driving circuit modulates the voltage signals on a third driving signal, and drives the sensor pads with the modulated third driving signal during the sensing period. A method for driving a touch display panel is also provided.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: January 2, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Sheng-Wen Hsiao, Liang-Chi Cheng
  • Patent number: 11848297
    Abstract: In a described example, an apparatus includes: a package substrate having a die mount portion and lead portions spaced from the die mount portion; a semiconductor die over the die mount portion having bond pads on an active surface facing away from the package substrate; non-gold bond wires forming electrical connections between at least one of the bond pads and one of the lead portions of the package substrate; a bond stitch on bump connection formed between one of the non-gold bond wires and a bond pad of the semiconductor die, comprising a stitch bond formed on a flex stud bump; and dielectric material covering a portion of the package substrate, the semiconductor die, the non-gold bond wires, the stitch bond and the flex stud bump, forming a packaged semiconductor device.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: December 19, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Bo-Hsun Pan, Chien-Chang Li, Hung-Yu Chou, Shawn Martin O'Connor, Byron Lovell Williams, Jeffrey Alan West, Zi-Xian Zhan, Sheng-Wen Huang
  • Patent number: 11842677
    Abstract: The disclosure provides a pixel circuit of a display panel. The pixel circuit includes a light-emitting element, a transistor, a first capacitor, a second capacitor, a first switch, and a second switch. The transistor is disposed in a driving current path to adjust the driving current of the light-emitting element. A first terminal of the first switch is coupled to a data line. A second terminal of the first switch is coupled to a first terminal of the first capacitor and a control terminal of the transistor. A first terminal of the second switch is coupled to a second terminal of the first capacitor and a first terminal of the second capacitor. A second terminal of the second switch is coupled to a first terminal of the transistor. A second terminal of the second capacitor is coupled to a reference voltage.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: December 12, 2023
    Assignee: Novatek Microelectronics Corp.
    Inventor: Sheng-Wen Hsiao